The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.

A vibration device includes a first substrate including a first surface and a second surface opposite to the first surface; a second substrate including a third surface bonded to the second surface thereby forming an accommodation space between the first substrate and the second substrate, and a fourth surface opposite to the third surface; a vibration element accommodated in the accommodation space; and a first external coupling terminal arranged at the fourth surface and having a first position to where a first wire to be coupled. The first position being within an area overlapping a bonding area between the first substrate and the second substrate, as viewed in a plan view.

A vibrator device includes a vibrating body having obverse and reverse principal surfaces and a side surface connecting the obverse and reverse principal surfaces to each other, a package configured to house the vibrating body, and a bonding material configured to fix the vibrating body to the package, wherein the vibrating body has a coupling part including a recess recessed from the side surface toward a center of the principal surfaces, and a protrusion protruding from a side surface of the recess, the protrusion is one of breaking-off parts with which a plurality of the vibrating bodies is broken off from a wafer to which the plurality of the vibrating bodies is coupled, and the bonding material has contact with a side surface of the protrusion in the recess.

A vibration device includes a substrate having a first surface and a second surface at an opposite side to the first surface, a vibration element disposed on the first surface, a first through electrode which penetrates the substrate, and is configured to electrically couple the power supply interconnection disposed on the second surface and the first circuit block disposed on the first surface, and a second through electrode which penetrates the substrate, and is configured to electrically couple the power supply interconnection and the second circuit block including an analog circuit disposed on the first circuit, wherein R1>R4 and R2>R4, in which R1 is an electric resistance of the first through electrode, R2 is an electric resistance of the second through electrode, and R4 is an electric resistance of a zone of the power supply interconnection coupling the first through electrode and the second through electrode.

A vibration device includes: a first substrate including a first surface and a second surface located at an opposite side of the first surface, and a first integrated circuit disposed on at least one of the first surface and the second surface; a second substrate including a third surface bonded to the second surface, a fourth surface located at an opposite side of the third surface, a recess that opens to the third surface, and a second integrated circuit disposed on the fourth surface; and a vibration element accommodated in a space defined by an opening of the recess being closed by the first substrate.

A piezoelectric vibrator includes a piezoelectric vibrating element, and a base member having a mounting surface to which the piezoelectric vibrating element is mounted, and a mount surface positioned on the opposite side to the mounting surface. The base member includes an electrode pattern formed at the mount surface that includes a ground electrode and a signal electrode that is electrically connected to the piezoelectric vibrating element. Moreover, the mount surface is a rectangular shape, the signal and ground electrodes are arranged in a region of the mount surface closer to any one side thereof, with the one side defining part of outer edges of the mount surface, and a distance from an outer edge of the signal electrode to the one side of the mount surface is longer than a distance from an outer edge of the ground electrode to the one side of the mount surface.

A piezoelectric vibration device includes an element mounting member provided with a recessed part, a vibration element held in the recessed part, and a lid closing the recessed part. The element mounting member includes an insulating base body including an inner bottom surface of the recessed part and an inner circumferential surface of the recessed part surrounding the inner bottom surface, a pair of signal terminals which are located on an outer surface of the base body and are electrically connected to the vibration element, a GND terminal which is located on the outer surface of the base body, and a shield film which is superposed on the inner circumferential surface of the recessed part and is electrically connected to the GND terminal.

A vibrator device includes a base, a first relay substrate mounted on the base, a second relay substrate mounted on the first relay substrate, and a vibrator element mounted on the second relay substrate, in which the second relay substrate is disposed between the first relay substrate and the vibrator, and the second relay substrate includes a terminal that is electrically coupled to the vibrator element and is positioned in a region overlapping with the first relay substrate and not overlapping the vibrator element in a plan view. The vibrator device being configured to reduce a mounting stress applied to a vibrator element and to reduce frequency variation of the vibrator element due to the mounting stress, in a case of mounting on a package after adjusting a frequency of the vibrator element.

An integrated circuit device includes a digital signal processing circuit that generates frequency control data by performing a temperature compensation process by a neural network calculation process based on temperature detection data and an amount of change in time of the temperature detection data, and an oscillation signal generation circuit that generates an oscillation signal of a frequency set by the frequency control data using a resonator.

A piezoelectric resonator unit that includes a piezoelectric resonator; a substrate that includes a mounting surface, an electrode pattern on the mounting surface; and a cap joined to the mounting surface of the substrate by a joining material such that the piezoelectric resonator is hermetically sealed. The electrode pattern includes a connection electrode to which the piezoelectric resonator is connected, and an extended electrode that is extended from the connection electrode towards an outer edge of the mounting surface. A joining region on the mounting surface is provided over an entire periphery and surrounds the connection electrode. An insulating material is in the joining region such that at least part of the electrode pattern is exposed therefrom.