A vibration device includes: a first substrate including a first surface and a second surface located at an opposite side of the first surface, and a first integrated circuit disposed on at least one of the first surface and the second surface; a second substrate including a third surface bonded to the second surface, a fourth surface located at an opposite side of the third surface, a recess that opens to the third surface, and a second integrated circuit disposed on the fourth surface; and a vibration element accommodated in a space defined by an opening of the recess being closed by the first substrate.

An oscillator includes a first container, a second container accommodated in the first container, a resonator element accommodated in the second container, a temperature sensor accommodated in the second container, a first circuit element that is accommodated in the second container and includes an oscillation circuit that causes the resonator element to oscillate so as to generate an oscillation signal on which temperature compensation is performed based on a detected temperature of the temperature sensor, and a second circuit element which is accommodated in the first container and includes a frequency control circuit that controls a frequency of the oscillation signal. The second container and the second circuit element are spaced from each other and are disposed to overlap each other in plan view.

A vibrator device includes a silicon substrate having a through hole, a first terminal placed on a first surface of the silicon substrate, a second terminal placed on a second surface opposite to the first surface of the silicon substrate, a wire passing the through hole and electrically coupling the first terminal and the second terminal, a resin layer placed between the wire and an inner wall defining the through hole, a silicon oxide layer placed between the resin layer and the inner wall, and a vibrator element bonded to the first terminal.

An electronic component housing package includes: a base section having a mounting section for an electronic component; a projecting part that is positioned on the base section and projects from the base section; a frame part that is positioned on the base section and surrounds the mounting section; a frame-shaped metalized layer that is positioned on the frame part; a plurality of external connection conductors that is positioned opposite the mounting section in the thickness direction; a connection conductor which is positioned on the projecting part and for connecting to the electronic component; and a wiring conductor that is connected to the connection conductor and that is led out to the base section. The thickness of the connection conductor gradually increases toward the wiring conductor.

An oscillator includes a substrate having a first substrate main surface and a substrate side surface, and a lid body bonded to the substrate and including a metal material, in which the substrate includes a substrate body having a first substrate body main surface corresponding to the first substrate main surface and a substrate body side surface corresponding to the substrate side surface, and provided with a cutout portion in the substrate body side surface, a side surface wiring provided along the cutout portion, a filling member provided in the cutout portion, and an insulating coating member provided on the first substrate body main surface.

A vibrator device includes a silicon substrate having a through hole, a first terminal placed on a first surface of the silicon substrate, a second terminal placed on a second surface opposite to the first surface of the silicon substrate, a wire passing the through hole and electrically coupling the first terminal and the second terminal, a resin layer placed between the wire and an inner wall defining the through hole, a silicon oxide layer placed between the resin layer and the inner wall, and a vibrator element bonded to the first terminal.

A vibrator device includes a base, a vibrator that includes a vibrator element and a vibrator element package, which accommodates the vibrator element and has a first terminal on a surface on a base side, a circuit element that is disposed between the base and the vibrator and has a first connection pad on a surface on a vibrator side, and a conductive connecting member that is disposed between the circuit element and the vibrator, bonds the circuit element and the vibrator together, and electrically connects the first connection pad and the first terminal together.

A quartz crystal resonator unit including a quartz crystal resonator having a quartz crystal blank, a frame surrounding an outer periphery of the quartz crystal blank, and coupling members connecting the frame to the quartz crystal blank. Moreover, a lid member and a base member are attached to the frame and seal the resonator. One or more outer electrodes is formed over end surfaces of the frame, the lid member, and the base member on a side where the coupling members are coupled. The one or more outer electrodes has a machinery quality factor smaller than that of the frame.

The vibration substrate having a main surface extending parallel to a first direction and a second direction that are orthogonal to each other, and that includes a main body region having a vibrating portion at least in a part thereof and at least one holding region arranged side by side with the main body region along the first direction. The at least one holding region including a holding portion and a beam portion connecting the holding portion and the main body region. The beam portion includes a first arm portion extending from the holding portion along the first direction, a second arm portion extending along the second direction from an end portion of the first arm portion on a side thereof opposite to the holding portion, and a connection portion connecting the second arm portion and the main body region.

A family of composite resonator devices having improved performance properties for use in electronic circuits. Each composite device includes two or more resonator electrodes on a single crystal or other resonant material. The two resonators may be connected in series or parallel, based on application requirements. The two resonators have different surface areas or some other type of asymmetry, causing the response of the composite device to have suppressed spurious modes, reduced insertion loss, or both. This is accomplished by designing the electrodes to have different frequency response curves, where the responses can be tuned and combined to reduce undesirable modes. Improvements in acceleration sensitivity and temperature sensitivity are also achieved. Both physically-applied and projected electrode types are disclosed, along with several crystal shapes. The family of composite resonator devices includes both passive and active devices, such as resonators, filters and oscillators.