A vibrator device includes a vibrator having a first and second electrode, and a circuit device having a drive circuit adapted to drive the vibrator, and an output circuit adapted to output a monitor signal corresponding to a vibration characteristic of the vibrator while driven by the drive circuit. The circuit device includes a first terminal electrically connected to the first electrode, and from which an output signal from the drive circuit to the vibrator is output, a second terminal electrically connected to the second electrode, and to which an input signal from the vibrator to the drive circuit is input, a third terminal electrically separated from the first electrode and the second electrode, and a monitor terminal from which the monitor signal is output. The vibrator is supported on an active surface side of the circuit device using conductive bumps respectively to the first, second, and third terminal.

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying element; a second amplifying element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying element, another end of the primary coil is connected to an output terminal of the second amplifying element, an end of the secondary coil is connected to an output terminal of the power amplifier, the first amplifying element and the second amplifying element are disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.

A vibrator includes: a vibration element that includes a pair of first excitation electrodes formed at the first vibration portion, a pair of second excitation electrodes formed at the second vibration portion, and a pair of third excitation electrodes formed at the third vibration portion, in which one second excitation electrode of the pair of second excitation electrodes is formed at a first inclined surface that is inclined with respect to two main surfaces, and one third excitation electrode of the pair of third excitation electrodes is formed at a second inclined surface that is inclined with respect to the two main surfaces and the first inclined surface; and a package that houses the vibration element. The vibration element includes a fixing portion to be fixed to the package. The fixing portion is provided between the first vibration portion and the second and third vibration portions.

A single frequency control device incorporating a high frequency resonator, a low frequency resonator and a temperature sensing element, the latter thermally coupled closely to the said resonators to facilitate temperature sensing with higher resolution and accuracy. Additional benefits offered by the structure include smaller size and lower cost.

A single-chamber-type temperature-sensor-provided crystal unit includes: a single chamber; and a quartz-crystal vibrating piece and a temperature sensor, provided in the single chamber. The quartz-crystal vibrating piece has a square planar shape. The quartz-crystal vibrating piece is secured in the single chamber at two securing portions via conductive members. The two securing portions are in proximities of both ends of a first side of the quartz-crystal vibrating piece. The temperature sensor has a rectangular parallelepiped shape. The temperature sensor is disposed such that a longitudinal surface of the temperature sensor is parallel to a line segment Y and the temperature sensor is close to a side of the two securing portions within the single chamber, when a line segment connecting the two securing portions is defined as the line segment Y.

An oscillator includes: a resonator element; a circuit element configured to output a clock signal; and a container accommodating the resonator element and the circuit element and including a substrate having a first surface. The substrate includes a first electrode provided on the first surface and electrically coupled to the resonator element, a second electrode electrically coupled to the resonator element, and an output electrode configured to output the clock signal. The first electrode and the second electrode are disposed side by side in a first direction. The output electrode is disposed adjacent to the first electrode in a second direction orthogonal to the first direction. When an end portion of the first electrode on a side close to the second electrode is defined as a first end portion, the output electrode includes a first region disposed closer to the second electrode side than the first end portion in the first direction.

A hybrid filter device (1) includes an acoustic wave device (AD) that includes an acoustic wave resonator and a passive device (PD) that includes an inductor element or an inductor element and a capacitance element. At least one of the acoustic wave device (AD) and the passive device (PD) is mounted on a substrate (20) of the hybrid filter device (1) and the acoustic wave device (AD) and the passive device (PD) are electrically connected to each other. The acoustic wave device (AD) overlaps the passive device (PD) when the hybrid filter device (1) is viewed in a direction perpendicular to one main surface (20a) of the substrate (20).

An oscillator includes: a resonator element; a circuit element; and a container including a substrate mounted with the circuit element, in which the circuit element includes a first coupling terminal coupled to the resonator element, a second coupling terminal coupled to the resonator element and aligned in a first direction with the first coupling terminal in the first direction, and an output terminal disposed adjacent to the first coupling terminal in a second direction orthogonal to the first direction, in the second direction orthogonal to the first direction, and in which the substrate includes a first surface mounted with the circuit element and a second surface, and the substrate includes a first coupling electrode provided on the first surface and coupled to the first coupling terminal, a second coupling electrode coupled to the second coupling terminal, an output electrode coupled to the output terminal, a first coupling wiring provided on the second surface and coupled to the first coupling electrode, a second coupling wiring coupled to the second coupling electrode, an output wiring coupled to the output electrode, and a shield wiring that is provided between the first coupling wiring and the output wiring and to which a direct-current potential is applied.

An electronic component package includes a lid, a first layer, a second layer disposed between the first layer and the lid and configuring a first frame, a third layer disposed between the second layer and the lid and configuring a second frame, a bonding member bonding the third layer to the lid, and a via wire electrically coupled to the lid and penetrating the second frame, in which, when an inner diameter of a first corner portion of the first frame is denoted by R1 and an inner diameter of a second corner portion of the second frame overlapping the first corner portion in a plan view is denoted by R2, R1<R2, and an inner surface of the second corner portion protrudes more than an inner surface of the first corner portion in a cross-sectional view.

A method of wafer scale packaging acoustic resonator devices and an apparatus therefor. The method including providing a partially completed semiconductor substrate comprising a plurality of single crystal acoustic resonator devices, each having a first electrode member, a second electrode member, and an overlying passivation material. At least one of the devices to be configured with an external connection, a repassivation material overlying the passivation material, an under metal material overlying the repassivation material. Copper pillar interconnect structures are then configured overlying the electrode members, and solder bump structures are form overlying the copper pillar interconnect structures.