To provide a radio-frequency module and a communication apparatus capable of achieving more excellent impedance characteristics. A radio-frequency module includes a first acoustic-wave filter (a first reception filter), a second acoustic-wave filter (a second reception filter), a switch (an antenna switch), a first inductor, and a second inductor. The first acoustic-wave filter transmits a signal in a first communication band. The second acoustic-wave filter transmits a signal in a second communication band. The first inductor is provided between ground and a node on a signal path (a second reception path) with which the switch is connected to the second acoustic-wave filter. The second inductor is connected in series between the switch and the first inductor on the signal path.

An electronic module includes a substrate that includes a first main surface and a second main surface, at least one first electronic component that includes electrodes on a mounting surface thereof on the substrate and that includes a hollow portion, at least one second electronic component that includes electrodes on a mounting surface thereof on the substrate and that includes no hollow portion, and a sealing resin. The at least one first electronic component is mounted on the first main surface of the substrate and sealed with the sealing resin. The at least one second electronic component is mounted on the second main surface of the substrate and is not sealed with the sealing resin.

A vibrator device including a vibrator element, an IC substrate including a semiconductor substrate configured of a semiconductor having a first conductive type and a circuit electrically coupled to the vibrator element, the first conductive type being any one of an N-type and a P-type, and a lid directly bonded to the semiconductor substrate and configured of a semiconductor having the first conductive type.

An acoustic wave device includes a piezoelectric substrate, first and second signal electrodes, and a first ground electrode on a first main surface of the piezoelectric substrate, at least one insulation layer on a second main surface of the piezoelectric substrate, first and second signal terminals provided indirectly on the second main surface with the insulation layer interposed therebetween, and a ground terminal on the second main surface. An acoustic wave filter is provided on the piezoelectric substrate. The first signal electrode and the first signal terminal are electrically coupled, the second signal electrode and the second signal terminal are electrically coupled, and the first ground electrode and the ground terminal are electrically coupled. The ground terminal includes a contact portion in contact with the second main surface of the piezoelectric substrate.

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier includes: an input terminal; an output terminal; first and second amplifying elements disposed parallel to the input terminal; and an output transformer connected between the output terminal and output terminals of the first and second amplifying elements. The PA control circuit is disposed on the second principal surface, and the first and second amplifying elements are both disposed on the first principal surface.

A vibrator includes: a vibration element that includes a pair of first excitation electrodes formed at the first vibration portion, a pair of second excitation electrodes formed at the second vibration portion, and a pair of third excitation electrodes formed at the third vibration portion, in which one second excitation electrode of the pair of second excitation electrodes is formed at a first inclined surface that is inclined with respect to two main surfaces, and one third excitation electrode of the pair of third excitation electrodes is formed at a second inclined surface that is inclined with respect to the two main surfaces and the first inclined surface; and a package that houses the vibration element. The vibration element includes a fixing portion to be fixed to the package. The fixing portion is provided between the first vibration portion and the second and third vibration portions.

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier disposed on the module board; a low noise amplifier disposed on the module board; a transmission filter (a first acoustic wave filter) disposed on one of the first principal surface and the second principal surface; and a reception filter (a second acoustic wave filter) disposed on one of the first principal surface and the second principal surface. An absolute value of a temperature coefficient of frequency (TCF) of the transmission filter is smaller than an absolute value of a TCF of the reception filter, and a distance between the transmission filter and the power amplifier is shorter than a distance between the reception filter and the power amplifier.

A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

A vibrator device includes a base; and a vibrator element including a quartz crystal vibrator element attached to the base via a first metal bump, in which the first metal bump is disposed on a straight line inclined within a range of +55° to +65° or −65° to −55° with respect to an X axis of the quartz crystal constituting the quartz crystal vibrator element in plan view seen from a direction in which the base and the quartz crystal vibrator element are arranged.

A piezoelectric resonator unit includes a piezoelectric substrate, first and second excitation electrodes, first and second connecting electrodes, and first and second exterior members. The first excitation electrode and first connecting electrode are disposed on a first main surface of the piezoelectric substrate and are electrically connected to each other. Similarly, the second excitation electrode and the second connecting electrode are disposed on a second main surface of the piezoelectric substrate and are electrically connected to each other. First and second exterior members bonded to the substrate with sealing members interposed. The first exterior member includes a first terminal portion formed in a shape that externally exposes at least part of the first connecting electrode. A first outer electrode covers the first terminal portion and the exposed portion of the first connecting electrode protruding from the first exterior member.