A radio frequency module includes a radio frequency filter (10), and the radio frequency filter (10) includes a terminal (11), a terminal (12), an impedance element (Z) disposed in series on a path (13) connecting the terminal (11) and the terminal (12), and a parallel arm resonator (P) connected between a node (N) on the path (13) and a ground. The impedance element (Z) is a capacitor or an inductor, and a wiring length A.sub.1 between the node (N) and the parallel arm resonator (P) is shorter than a wiring length B.sub.1 between the impedance element (Z) and a terminal (terminal (11), for example) out of the terminal (11) and the terminal (12) having a shorter wiring length to the impedance element (Z).

A vibration device includes a first substrate including a first surface and a second surface opposite to the first surface; a second substrate including a third surface bonded to the second surface thereby forming an accommodation space between the first substrate and the second substrate, and a fourth surface opposite to the third surface; a vibration element accommodated in the accommodation space; and a first external coupling terminal arranged at the fourth surface and having a first position to where a first wire to be coupled. The first position being within an area overlapping a bonding area between the first substrate and the second substrate, as viewed in a plan view.

The vibrator element includes a base part, a vibrating arm extending from the base part, and a weight provided to the vibrating arm, wherein the weight includes a thick film part, a thin film part thinner in film thickness than the thick film part, and a connection part which is located between the thick film part and the thin film part to connect the thick film part and the thin film part to each other, and which forms a taper shape gradually decreasing in film thickness in a direction from the thick film part side toward the thin film part.

A vibrator device includes a vibrator element, a container in which the vibrator element is housed, a circuit which is disposed in the container, and which overlaps the vibrator element in a plan view, and an inductor which is disposed in the container, which fails to overlap the vibrator element in the plan view, and which is electrically coupled to the circuit. The container includes at least a first member and a second member, and a bonding area configured to bond the first member and the second member to each other, and the inductor is disposed in the bonding area.

A multilayer body includes a first electronic component and a structural body including first and second regions. The first electronic component is in the second region. The multilayer body includes a second electronic component mounted via a solder bump onto the structural body with a connection pad interposed therebetween. An outer surface of the first region and an outer surface of the first electronic component have a step difference therebetween in a height direction of the structural body. The connection pad is on the outer surface of the first region, an outer surface of the first electronic component, and a step-difference surface of a portion of the step difference.

An integrated circuit device includes a first pad and a second pad electrically coupled to one end and the other end of a resonator, an oscillation circuit that is electrically coupled to the first pad and the second pad and generates an oscillation signal by causing the resonator to oscillate, and an output circuit that outputs a clock signal based on the oscillation signal. The oscillation circuit is disposed along a first side of the integrated circuit device among the first side, a second side that intersects the first side, a third side that is an opposite side of the first side, and a fourth side that is an opposite side of the second side. The first pad and the second pad are disposed in the oscillation circuit along the first side in a plan view, and the output circuit is disposed along the second side.

There is provided a vibrator device including: a vibrator element; a semiconductor substrate having a first surface on which the vibrator element is disposed and a second surface positioned on an opposite side of the first surface; a fractional N-PLL circuit disposed at the second surface; a wiring that is disposed at the first surface and electrically couples the vibrator element and the fractional N-PLL circuit; and an output terminal that is disposed at the second surface side of the semiconductor substrate, is electrically coupled to the fractional N-PLL circuit, and outputs a signal from the fractional N-PLL circuit, in which the output terminal does not overlap the wiring in a plan view along a thickness direction of the semiconductor substrate.

A band-pass filter (BPF) having first and second ports includes an acoustic wave filter (AWF) having first and second ports, the first port of the AWF coupled to the first port of the BPF. An impedance matching network consisting of a first inductor in parallel with a series combination of a second inductor and a capacitor is connected across the first port of the BPF.

The vibrator element includes at least one vibrating arm, and a weight provided to the vibrating arm, the weight is provided with at least one processing scar, when an axis which overlaps a center in a width direction of the vibrating arm, and which extends along an extending direction of the vibrating arm is a central axis, and an axis which overlaps a centroid of the vibrating arm, and which extends along the extending direction of the vibrating arm is a centroid axis, the processing scar is formed in at least an area at the centroid axis side with respect to the central axis, and S1>S2 an area of the processing scar located at the centroid axis side with respect to the central axis is S1, and an area of the processing scar located at an opposite side to the centroid axis with respect to the central axis is S2.

A vibration device includes a substrate having a first surface and a second surface at an opposite side to the first surface, a vibration element disposed on the first surface, a first through electrode which penetrates the substrate, and is configured to electrically couple the power supply interconnection disposed on the second surface and the first circuit block disposed on the first surface, and a second through electrode which penetrates the substrate, and is configured to electrically couple the power supply interconnection and the second circuit block including an analog circuit disposed on the first circuit, wherein R1>R4 and R2>R4, in which R1 is an electric resistance of the first through electrode, R2 is an electric resistance of the second through electrode, and R4 is an electric resistance of a zone of the power supply interconnection coupling the first through electrode and the second through electrode.