A radio-frequency module includes a mount board, an electronic component, an external connection terminal, and an acoustic wave filter. The mount board has a first principal surface and a second principal surface facing each other. The electronic component is arranged on the first principal surface of the mount board. The external connection terminal is arranged on the second principal surface of the mount board. The acoustic wave filter is arranged on the second principal surface of the mount board. The acoustic wave filter is a bare-chip acoustic wave filter. The radio-frequency module is suppressed in height along a thickness of the mount board.

An elastic wave device includes a piezoelectric substrate, IDT electrodes disposed on the piezoelectric substrate, a first wiring line, an insulating layer covering at least a portion of the first wiring line, a second wiring line at least a portion of which is disposed on the insulating layer to provide a three-dimensional crossing portion, a peripheral support including a cavity surrounding the IDT electrodes, the first and second wiring lines, and the insulating layer, a partition support disposed in the cavity, and a cover disposed on the peripheral support and the partition support to cover the cavity. The second wiring line includes a step portion electrically connecting a portion of the second wiring line located on the piezoelectric substrate and a portion of the second wiring line located on the insulating layer to each other. The partition support covers the step portion.

An elastic wave apparatus includes a piezoelectric substrate including a main surface and a polarization axis direction having a tilt angle with respect to the main surface, an IDT electrode provided on the main surface, and at least one line on the main surface and between an end edge of the main surface and the IDT electrode. A relationship a≦316|cos(θ)|μm is satisfied where a denotes a distance from the end edge of the main surface to the IDT electrode and b≧28 μm where a dimension of the line along a direction connecting the end edge to the IDT electrode is defined as a width, b denotes the width of the line when one line is provided, and b denotes the sum of the widths of multiple lines when the multiple lines are provided.

A packaged acoustic wave component includes a support substrate, a multi-layer piezoelectric substrate disposed over a first side of the support substrate, one or more metal layers disposed on a second side of the support substrate that is opposite the first side of the support substrate, and one or more surface acoustic wave resonators or filters disposed over the multi-layer piezoelectric substrate. The one or more surface acoustic wave resonators or filters include a multi-mode surface acoustic wave resonator or filter (e.g., dual mode surface acoustic wave resonator or filter). One or more vias extend through the support substrate and electrically connect the multi-mode surface acoustic wave resonator or filter and the one or more metal layers to provide a ground connection for the multi-mode surface acoustic wave resonator or filter, while reducing parasitic inductance.

Switchable and/or tunable filters, methods of manufacture and design structures are disclosed herein. The method of forming the filters includes forming at least one piezoelectric filter structure comprising a plurality of electrodes formed to be in contact with at least one piezoelectric substrate. The method further includes forming a micro-electro-mechanical structure (MEMS) comprising a MEMS beam in which, upon actuation, the MEMS beam will turn on the at least one piezoelectric filter structure by interleaving electrodes in contact with the piezoelectric substrate or sandwiching the at least one piezoelectric substrate between the electrodes.

A package that includes a first filter comprising a first polymer, a substrate cap, a second filter comprising a second polymer frame, at least one interconnect, an encapsulation layer and a plurality of through encapsulation vias. The substrate cap is coupled to the first polymer frame such that a first void is formed between the substrate cap and the first filter. The second polymer frame is coupled to the substrate cap such that a second void is formed between the substrate cap and the second filter. The at least one interconnect is coupled to the first filter and the second filter. The encapsulation layer encapsulates the first filter, the substrate cap, the second filter, and the at least one interconnect. The plurality of through encapsulation vias coupled to the first filter.

An elastic wave device includes an elastic wave element including a piezoelectric substrate with a first main surface and a second main surface that face each other, an IDT electrode disposed on the second main surface of the piezoelectric substrate, a support disposed on the second main surface of the piezoelectric substrate so as to surround the IDT electrode in plan view, and a cover that is disposed on the support and seals the IDT electrode together with the support and the piezoelectric substrate, a mounting substrate above which the elastic wave element is mounted, and a sealing resin that is disposed on the side of the side of the upper surface of the mounting substrate and seals the elastic wave element. A thickness of the mounting substrate is less than a thickness of the sealing resin that corresponds to a distance from a surface of the sealing resin in contact with the upper surface of the mounting substrate to a surface of the sealing resin on an opposite side of the mounting substrate.

An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer in frame-like form disposed on an upper surface of an uppermost one of the plurality of insulating layers. The first metal layer contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.

A crystal oscillator internally includes a package storing a crystal unit. The crystal oscillator is configured to include: a substrate having one surface side on which the crystal unit is disposed and another surface side on which a circuit component and a heating element are disposed, the circuit component including an oscillator circuit that oscillates the crystal unit, and the heating element regulating a temperature inside the package; a stepped portion formed at an inner wall of the package to support only an end portion of the substrate from the one surface side such that the crystal unit, the circuit component, and the heating element are spaced from a wall portion of the package; and a wire that connects between a terminal disposed at the heating element and a terminal disposed inside the package without via the substrate.

A surface acoustic wave device includes a piezoelectric substrate with an IDT electrode that excites a surface acoustic wave provided on a principal surface, a cover layer opposing the principal surface and that covers the IDT electrode, a support provided in a standing manner around the IDT electrode on the one principal surface, and that, with the cover layer separated from the IDT electrode, supports a piezoelectric-substrate-side surface of the cover layer, and a connector that is provided on the piezoelectric-substrate-side surface of the cover layer and that joins the cover layer and the support to each other. At least a portion of a cover-layer-side end portion of the support exists in the connector. A dimension of the connector in a normal direction to the one principal surface is less than a dimension of the support in the normal direction.