A substrate that includes an encapsulation layer, a first acoustic resonator, a second acoustic resonator, at least one first dielectric layer, a plurality of first interconnects, at least one second dielectric layer, and a plurality of second interconnects. The first acoustic resonator is located in the encapsulation layer. The first acoustic resonator includes a first piezoelectric substrate comprising a first thickness. The second acoustic is located in the encapsulation layer. The second acoustic resonator includes a second piezoelectric substrate comprising a second thickness that is different than the first thickness. The at least one first dielectric layer is coupled to a first surface of the encapsulation layer. The plurality of first interconnects is coupled to the first surface of the encapsulation layer. The plurality of first interconnects is located at least in the at least one first dielectric layer.

Acoustic resonator devices and filters are disclosed. An acoustic resonator chip includes a piezoelectric plate attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern formed on a surface of the piezoelectric plate includes an interdigital transducer with interleaved fingers on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a surface of an interposer, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is directly bonded to a respective pad of the second plurality of contact pads. A seal is formed between a perimeter of the acoustic resonator chip and a perimeter of the interposer.

Acoustic resonator devices and filters are disclosed. An acoustic resonator chip includes a piezoelectric plate attached to a substrate. Portions of the piezoelectric plate form at least first and second diaphragms spanning respective cavities in the substrate. A first conductor pattern on the surface of the piezoelectric plate includes a first plurality of contact pads and at least first and second IDTs with interleaved fingers of each IDT on respective diaphragms. An interposer includes a second plurality of contacts pads. A plurality of conductive balls bond each of the contact pads of the first plurality of contact pads to respective contact pads of the second plurality of contact pads.

A filter includes a first input/output electrode and the second input/output electrode, and is arranged on a first main surface of a mounting substrate. The mounting substrate includes a first land electrode, a second land electrode, a ground terminal, and a plurality of via conductors. The first land electrode is connected to the first input/output electrode. The second land electrode is connected to the second input/output electrode. The ground terminal is located closer to a second main surface side than the first main surface in a thickness direction of the mounting substrate. The plurality of via conductors is arranged between the first main surface and the second main surface, and is connected to the ground terminal. The plurality of via conductors is located between the first land electrode and the second land electrode in a plan view from the thickness direction of the mounting substrate.

A manufacturing method for an electronic component includes forming an electrically conductive pillar on a surface of a support, forming an intermediate layer covering a side surface of the pillar, forming a conductor layer covering a side surface of the intermediate layer, and molding a resin structure covering a side surface of the conductor layer.

An acoustic wave element includes a piezoelectric film, an interdigital transducer electrode on a first principal surface of the piezoelectric film, and a high acoustic velocity member near a second principal surface of the piezoelectric film. A surface of the high acoustic velocity member opposite to the piezoelectric film and a side surface of each of the high acoustic velocity member and the piezoelectric film are covered with resin. At least a portion of the side surface of the high acoustic velocity member is in contact with the resin. A gap is provided between the resin and at least a portion of the side surface of the piezoelectric film.

An electronic component module includes an electronic component, a resin structure body, a through wiring, a wiring layer, and a close-contact layer. The resin structure body covers at least a portion of the electronic component. The through wiring extends through the resin structure body. The wiring layer electrically connects the electronic component and the through wiring to each other. The close-contact layer is provided between the resin structure body and the through wiring and is in contact with the resin structure body and the through wiring. The close-contact layer includes an inorganic insulation film.

An electronic component includes a substrate, a functional portion, external connection conductor portions, and first and second heat-conducting portions. The functional portion is located on first principal surface of the substrate and portion generates heat during operation. The external connection conductor portions are located directly on the first principal surface of the substrate or located below the first principal surface without direct contact with the substrate. The second principal surface of the substrate includes first and second regions. When viewed in plan in a thickness direction of the substrate, the first region does not overlap the functional portion, and the second region coincides with the functional portion. The first heat-conducting portion is located directly on all or a portion of the first region or located over all or a portion of the first region without direct contact with the substrate. The second heat-conducting portion is located directly on a region that is a portion of the second principal surface of the substrate and including at least a portion of the second region or located over the region without direct contact with the substrate and is discretely spaced away from the first heat-conducting portion when viewed in plan in the thickness direction of the substrate.

A packaging method and package structure for a filter chip. The packaging method includes providing a circuit substrate, covering a first surface of the circuit substrate and/or filter chip with adhesive material and forming recessed cavities or closed cavities in the adhesive material. The method further includes adhering the filter chip to the first surface of circuit substrate via the adhesive material, such that surface acoustic wave transmitting regions of the filter chip correspond to the recessed cavities or closed cavities in the adhesive material to form a gap therebetween, and encapsulating the filter chip with encapsulating material. The method further includes forming interconnecting holes extending from a second surface of the circuit substrate to pins of the filter chip, filling the interconnecting holes with conductive material, so that the conductive material is in electrical contact with a chip pin bump or pad metal of the filter chip, and forming external pin pads on the second surface.

A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a step of preparing a sheet having thermosetting property; a disposing step of disposing the sheet on the mounting member so as to face the second circuit members; and a sealing step of pressing the sheet against the first circuit member and heating the sheet, to seal the second circuit members and to cure the sheet, wherein the second circuit members include a reference member, and a first adjacent member and a second adjacent member each adjacent to the reference member, a separation distance D1 between the reference member and the first adjacent member is different from a separation distance D2 between the reference member and the second adjacent member, at least one of the plurality of the second circuit members is a hollow member to be provided with a space from the first circuit member, and in the sealing step, the plurality of the second circuit members are sealed so as to maintain the space.