A method of manufacturing an electronic device includes preparing an electronic component including a first substrate on a main surface of which a functional unit and a first resin layer are formed. The first resin layer has a first surface facing the main surface of the first substrate, a second surface opposed to the first surface, a cavity on the first surface enclosing the functional unit, and a portion defining a wall of the cavity. The first resin layer defines a recess provided with a solder layer on the second surface. The method further includes preparing a second substrate having an electrode pad formed on a main surface, aligning the electronic component with the second substrate to layer the solder layer and the electrode pad in contact with the solder layer, and forming the electronic component and the second substrate into the electronic device.

An electronic component includes a piezoelectric substrate, a functional electrode on the piezoelectric substrate, a support layer on the piezoelectric substrate, a cover layer on the support layer, the cover layer, the support layer, and the piezoelectric substrate defining a hollow space that the functional electrode faces, and connection terminals that are electrically connected to the functional electrode, that are each made from a metal particle aggregate, and that each have a porous structure. The connection terminals are each located at a position in which the connection terminals overlap at least a portion of the hollow space in plan view.

A device including a piezoelectric substrate, an interdigital transducer (IDT), and an antireflective structure is disclosed herein. The piezoelectric substrate has a front-side surface and a smoothed back-side surface. The IDT is on the front-side surface of the piezoelectric substrate. The antireflective structure is over at least a portion of the smoothed back-side surface of the piezoelectric substrate. By having the antireflective structure on at least a portion of the smoothed back-side surface of the piezoelectric substrate, reflection of spurious bulk acoustic waves toward the front-side surface of the piezoelectric substrate can be reduced and/or eliminated to lessen interference with surface acoustic waves. The reduction and/or elimination of spurious bulk acoustic waves allows the device to forego conventional roughening of the back-side surface of the piezoelectric substrate, thereby reducing fractures at the back-side surface and allowing for singulation techniques capable of producing smaller die sizes.

Acoustic resonator devices and filters; and methods of their fabrication are disclosed. A piezoelectric plate is bonded to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity that is formed in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer disposed on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a back surface of an interposer, the second conductor pattern including a second plurality of contact pads. The interposer is formed by cofiring layers of thin ceramic tape, at least one layer of the tape comprising printed conductors. A plurality of conductive balls is formed on and directly bonds the first plurality of contact pads to respective contact pads of the second plurality of contact pads.

Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer disposed on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a surface of a base, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is connected to a respective pad of the second plurality of contact pads. A seal is formed between a perimeter of the piezoelectric plate and a perimeter of the base.

Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer disposed on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a back surface of an interposer, the second conductor pattern including a second plurality of contact pads. The interposer has layers of a LTCC circuit card, at least one layer of the tape comprising printed conductors. A plurality of conductive balls directly bonds the first plurality of contact pads formed on the plate to respective contact pads of the second plurality of contact pads formed on the interposer.

A method for forming a connection structure is disclosed. A semiconductor structure having a first pad and a bump respectively on a bottom surface thereof is provided. A carrier having a second pad on a top surface thereof is provided. The second pad corresponds to the bump. An epoxy portion is disposed onto the second pad of the carrier. A diameter of the epoxy portion is less than or equal to a diameter of the bump. After depositing the epoxy portion, the bump is attached to the second pad via the epoxy portion.

Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a chip cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer on the diaphragm, and first contact pads. An interposer has walls on its back surface that are attached to the chip front surface and that surround the diaphragm. An interposer cover layer spans the walls creating an enclosed interposer cavity over the diaphragm. A second conductor pattern formed on the walls and cover layer includes second contact pads on the interposer back surface. Electrical connections between the second contact pads and connection points on the chip electrically connect the first contact pads to respective ones of the second contact pads.

Acoustic resonator devices and filters; and methods of their fabrication are disclosed. A piezoelectric plate is bonded to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity that is formed in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer on the diaphragm, and first contact pads. Walls of an interposer back surface are formed onto the resonator front surface and surround the diaphragm. An interposer cover layer is formed on the walls, spans the walls and creates an enclosed interposer cavity over the diaphragm. A second conductor pattern is formed on the walls and cover layer that includes second contact pads on the interposer back surface; and connections that electrically connect the first contact pads to respective ones of the second contact pads.

A semiconductor package includes a main substrate, a resonator device disposed above the main substrate, a wiring portion connected to the resonator device, an electrical connection structure connected to the wiring portion and the main substrate, an encapsulant encapsulating the resonator device and the electrical connection structure, and a heat dissipation member bonded to and mounted on the resonator device. A cavity is provided in the resonator device, and is formed between the resonance portion and a resonator device substrate provided in the resonator device.