Patent classifications
H03H9/14541
ACOUSTIC WAVE DEVICE
An acoustic wave device includes a piezoelectric substrate, and an IDT electrode on the piezoelectric substrate. The piezoelectric substrate includes a high acoustic velocity layer, and a piezoelectric layer. The IDT electrode includes a first busbar and a second busbar, and first and second electrode fingers interdigitated with each other. A first envelope and a second envelope each extend in a slanted direction with respect to an acoustic wave propagation direction, the first envelope being an imaginary line formed by connecting tips of the first electrode fingers, the second envelope being an imaginary line formed by connecting tips of the second electrode fingers. The first dielectric film is located in at least one gap of first and second gaps, the first gaps being located between the first electrode fingers and the second busbar, the second gaps being located between the second electrode fingers and the first busbar. The first dielectric film has a density greater than a density of silicon oxide.
ACOUSTIC WAVE DEVICE, RADIO-FREQUENCY FRONT END CIRCUIT, AND COMMUNICATION DEVICE
An acoustic wave device includes N band pass filters with first ends connected to define a common connection and having different pass bands. At least one of the band pass filters includes acoustic wave resonators including a lithium tantalate film having Euler angles (φ.sub.LT=0°±5°, θ.sub.LT, ψ.sub.LT=0°±15°), a silicon support substrate, a silicon oxide film between the lithium tantalate film and the silicon support substrate, an IDT electrode, and a protective film. In at least one acoustic wave resonator, a frequency f.sub.h1_t.sup.(n) satisfies Formula (3) or Formula (4) for all m where m>n:
f.sub.h1_t.sup.(n)>f.sub.u.sup.(m) Formula (3); and
f.sub.h1_t.sup.(n)<f.sub.l.sup.(m) Formula (4).
In Formulas (3) and (4), f.sub.u.sup.(m) and f.sub.l.sup.(m) represent the frequencies of the high-frequency end and the low-frequency end of the pass band in the m band pass filters.
ACOUSTIC WAVE DEVICE
An acoustic wave device uses a longitudinal acoustic wave, and includes a piezoelectric layer including first and second principal surfaces opposite to each other, an IDT electrode directly or indirectly on the first principal surface, and a high acoustic velocity member directly or indirectly on the second principal surface and including a 4H-type or 6H-type crystal polytype silicon carbide.
Acoustic wave device, method of fabricating the same, filter, and multiplexer
An acoustic wave device includes: a piezoelectric substrate; and a pair of comb-shaped electrodes located on the piezoelectric substrate, each of the comb-shaped electrodes being formed mainly of a monocrystalline metal film, each of the comb-shaped electrodes including electrode fingers.
ELECTROACOUSTIC RESONATOR, RF FILTER WITH INCREASED USABLE BANDWIDTH AND METHOD OF MANUFACTURING AN ELECTROACOUSTIC RESONATOR
An electroacoustic resonator (EAR) that allows RF filters in which transversal modes are suppressed in a wider frequency range and corresponding RF filters and methods are provided. The resonator has an electrode structure (BB,EF) on a piezoelectric material and a transversal acoustic wave guide. The wave guide has a central excitation area (CEA), trap stripes (TP) and barrier stripes (B). The difference in wave velocity (|VCEA−VB|) between the central excitation area and the barrier stripes determines the frequency range of suppressed transversal modes.
Acoustic wave device, high-frequency front end circuit, and communication device
An acoustic wave device includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate. In the IDT electrode, a central region, first and second low acoustic velocity regions and first and second high acoustic velocity regions are disposed in this order. A duty ratio in the first low acoustic velocity region of first electrode fingers and the second low acoustic velocity region of second electrode fingers is larger than a duty ratio in the central region. When acoustic velocity of a transversal bulk wave propagating in metal that is a main component of a main electrode layer is defined as v (m/s), v≤3299 m/s, and when a wave length defined by an electrode finger pitch of the IDT electrode is defined as λ, and a film thickness of the main electrode layer normalized by the wave length λ is defined as T, then T≥0.00018e.sup.0.002V+0.014.
Acoustic wave device
An acoustic wave device includes a piezoelectric substrate, an interdigital transducer electrode on the piezoelectric substrate, and two reflectors on both sides of the interdigital transducer electrode in an acoustic wave propagation direction. The reflectors include first and second busbars and first to third electrode fingers, respectively, and the first and second busbars are opposed to one another. The first busbars and the second busbars are connected by at least one third electrode finger. The reflectors each include a center area located centrally in a length direction and a first high-acoustic-velocity area that is located between the center area and the first busbars and has an acoustic velocity higher than the acoustic velocity of the center area, where the length direction is a direction in which the first to third electrode fingers extend.
Elastic wave device, duplexer, and communication device
A surface acoustic wave (SAW) device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode located on an upper surface of the piezoelectric substrate, a cover covering the upper surface of the piezoelectric substrate from above the IDT electrode, at least one first via conductor extending through at least part of the cover from the upper surface of the piezoelectric substrate to an upper surface of the cover, at least one second via conductor located, on the piezoelectric substrate, inward from the first via conductor in a plan view, extending through at least part of the cover from the upper surface of the piezoelectric substrate to the upper surface of the cover, and having a smaller diameter than the first via conductor, and a conductive layer located on the upper surface of the cover and extending over an upper end of the second via conductor.
ACOUSTIC WAVE ELEMENT, ACOUSTIC WAVE FILTER, MULTIPLEXER, AND COMMUNICATION APPARATUS
In a SAW element, a piezoelectric layer is laid over a support substrate. An IDT electrode includes a main region and two end regions on two sides of the main region. The end region continues from a portion where electrode finger design is modified up to the end part. A resonance frequency determined by electrode finger design of reflector electrode fingers is lower than a resonance frequency determined by electrode finger design of electrode fingers in the main region. An interval between centers of the electrode fingers in the main region is defined as “a”. Number of electrode fingers configuring the end region is defined as “m”. A distance between a center of an electrode finger among the electrode fingers in the main region which is located on a side closest to the end region and a center of a reflector electrode finger among the reflector electrode fingers which is located on a side closest to the end region is defined as “x”. At this time, the following relationship is satisfied:
0.5×a×(m+1)<x<a×(m+1)
Acoustic wave device with high thermal conductivity layer on interdigital transducer
An acoustic wave device includes a piezoelectric substrate, interdigital transducer electrodes including a predetermined number of electrode fingers disposed on an upper surface of the substrate, and a dielectric material layer having a first portion and a second portion. The first portion is disposed on the upper surface of the substrate and between the interdigital transducer electrode fingers. The second portion is disposed above the interdigital transducer electrode fingers. The acoustic wave device further includes at least one thermally conductive bridge disposed within the dielectric material layer and contacting upper surfaces of at least two adjacent interdigital transducer electrode fingers to dissipate heat therefrom.