Patent classifications
H03H9/173
TWO-STAGE LATERAL BULK ACOUSTIC WAVE FILTER WITH CAPACITIVE COUPLING OF COUNTER ELECTRODE
An acoustic wave filter device with two-stage acoustic wave filters is provided. Each of the two stages includes a respective acoustic wave filter element. A first acoustic wave filter element (100a) includes a first input electrode (150a), a first output electrode (174a), and a first counter electrode (120a). The first input electrode and the first output electrode are located on a top surface of piezoelectric layer (650), and the first counter electrode is located on a bottom surface of the piezoelectric layer. A second acoustic wave filter element (100b) includes a second input electrode (154b), a second output electrode (174b), and a second counter electrode (120b). The second input electrode and the second output electrode are located on the top surface of the piezoelectric layer, and the second counter electrode is located on a bottom surface of the piezoelectric layer. The two acoustic wave filter elements are connected in series through a common floating electrode (602).
ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF
An acoustic wave device includes: a substrate; a first electrode on the substrate; a piezoelectric layer on the first electrode; and a second electrode on the piezoelectric layer. A bonding interface is located between the substrate and the first electrode. The full width at half maximum (FWHM) in the X-ray diffraction pattern of the crystal plane <002> of the piezoelectric layer is between 10 arc-sec and 3600 arc-sec.
Piston mode Lamb wave resonators
Piston mode Lamb wave resonators are disclosed. A piston mode Lamb wave resonator can include a piezoelectric layer, such as an aluminum nitride layer, and an interdigital transducer on the piezoelectric layer. The piston mode Lamb wave resonator has an active region and a border region, in which the border region has a velocity with a lower magnitude than a velocity of the active region. The border region can suppress a transverse mode.
PIEZOELECTRIC DEVICE
In a piezoelectric device, a layered portion includes, at a position at least above a recess, a single crystal piezoelectric layer and a pair of electrode layers to apply voltage to the single crystal piezoelectric layer. At least a portion of the pair of electrode layers includes a lower electrode layer extending along a surface of the single crystal piezoelectric layer, the surface being closer to a base. The lower electrode layer is present only inside the recess.
FILM BULK ACOUSTIC RESONATOR
Disclosed is a film bulk acoustic resonator (FBAR) including a substrate, a lower electrode formed above the substrate, a piezoelectric layer formed above the lower electrode, an upper electrode formed above the piezoelectric layer, and a first protection layer formed above the upper electrode. Here, the first protection layer covers the upper electrode while extending downward along a side surface of one end of the upper electrode to cover a certain area of the piezoelectric layer.
BULK ACOUSTIC WAVE FILTER AND METHOD OF MANUFACTURING BULK ACOUSTIC WAVE FILTER
A method of manufacturing a bulk acoustic wave filter is provided, including: forming an acoustic reflection air cavity, a sacrificial layer, a seed layer, a lower electrode layer and a piezoelectric layer of n resonators on a substrate in sequence, wherein n is greater than or equal to 2; taking N from 1 to n for respectively repeating following steps: forming an N-th metal hard mask layer, defining an effective area of a first resonator to an N-th resonator by using a photolithography process, removing the N-th metal hard mask layer outside the effective area of the first resonator to the N-th resonator, oxidizing the piezoelectric layer outside the effective area of the first resonator to the N-th resonator to form an N-th oxidized part of the piezoelectric layer, and etching the N-th oxidized part of the piezoelectric layer; removing the metal hard mask layer of the effective area of the first resonator to the N-th resonator, so as to form the piezoelectric layer having different thicknesses of the first resonator to the N-th resonator; and forming an upper electrode layer on the piezoelectric layer having different thicknesses of the first resonator to the N-th resonator.
High Q acoustic resonator with dielectric flaps
A high Q acoustic BAW resonator with high coupling and improved spurious mode suppression is given. The BAW resonator comprises an active resonator region (AR) formed by an overlap of the three layers bottom electrode (BE), piezoelectric layer (PL) and top electrode layer (TE). An inner-flap (IF) is formed by a dielectric 3D structure sitting on a marginal region (MR) of the active resonator region (AR) or adjacent thereto, extending inwardly towards the center thereof and having a section that runs in parallel and distant to the top surface of the resonator keeping an inner gap (IG) thereto or an angle Θ.
Acoustic wave resonator
An acoustic wave resonator includes a resonating part disposed on and spaced apart from a substrate by a cavity, the resonating part including a membrane layer, a first electrode, a piezoelectric layer, and a second electrode that are sequentially stacked. 0 Å≤ΔMg≤170 Å may be satisfied, ΔMg being a difference between a maximum thickness and a minimum thickness of the membrane layer disposed in the cavity.
BAW resonator with increased quality factor
A BAW resonator comprises a center area (CA), an underlap region (UL) surrounding the center area having a thickness smaller than the thickness d.sub.C of the center region and a frame region (FR), surrounding the underlap region having thickness d.sub.F greater than d.sub.C.
Bulk-acoustic wave resonator
A bulk-acoustic wave resonator includes: a substrate; a seed layer disposed on the substrate, and having a hexagonal crystal structure; a bottom electrode disposed on the seed layer; a piezoelectric layer at least partially disposed on the bottom electrode; and a top electrode disposed on the piezoelectric layer, wherein either one or both of the bottom electrode and the top electrode includes a scandium (Sc)-containing aluminum alloy layer.