Patent classifications
H
H03
H03H
9/00
H03H9/24
H03H9/2405
H03H9/2468
H03H9/2478
H03H9/2484
H03H9/2484
Techniques for adding compensating material(s) in semiconductor devices
A resonant member of a MEMS resonator oscillates in a mechanical resonance mode that produces non-uniform regional stresses such that a first level of mechanical stress in a first region of the resonant member is higher than a second level of mechanical stress in a second region of the resonant member. A plurality of openings within a surface of the resonant member are disposed more densely within the first region than the second region and at least partly filled with a compensating material that reduces temperature dependence of the resonant frequency corresponding to the mechanical resonance mode.