An acoustic wave device includes a substrate, a first resonator, a second resonator, and a shared reflector. The second resonator is adjacent to the first resonator and has different frequency characteristics different than the first resonator. The first resonator includes a first interdigital transducer electrode. The second resonator includes a second interdigital transducer electrode. The shared reflector has frequency characteristics that are the same as both frequency characteristics of the first resonator and frequency characteristics of the second resonator or between the frequency characteristics of the first resonator and the frequency characteristics of the second resonator. a higher-order mode frequency of the first resonator and a higher-order mode frequency of the second resonator coincides. When the number of electrode fingers of the shared reflector is even, an electrode finger facing the shared reflector in the first interdigital transducer electrode and an electrode finger facing the shared reflector in the second interdigital transducer electrode have the same polarity. When the number of electrode fingers of the shared reflector is odd, an electrode finger facing the shared reflector in the first interdigital transducer electrode and an electrode finger facing the shared reflector in the second interdigital transducer electrode have opposite polarities.

An acoustic wave filter includes a first chip and a second chip electrically connected to the first chip. Each of the chips includes a support substrate, a plurality of acoustic films, a piezoelectric film, and an excitation electrode sequentially stacked on one another. The plurality of acoustic films are sequentially stacked on the support substrate and materials for acoustic films stacked on each other are different from each other.

A multiplexer includes a first filter located between a common terminal and a first terminal to pass a signal in a first passband, and a second filter located between the common terminal and a second terminal to pass a signal in a second passband. A first series arm circuit included in the first filter includes a first series arm resonator and a second series arm resonator. The first series arm circuit is connected to the common terminal not through a circuit including an elastic wave resonator and a connecting point of the circuit. The first series arm circuit has a first antiresonance frequency and a second antiresonance frequency higher than the first antiresonance frequency. The second antiresonance frequency is higher than a higher edge of the first passband. The first antiresonance frequency is at or lower than a higher edge of the second passband.

An elastic wave device includes an LiNbO.sub.3 substrate, a first elastic wave resonator including a first IDT electrode and a first dielectric film, and a second elastic wave resonator including a second IDT electrode and a second dielectric film. A Rayleigh wave travels along at least one surface of the elastic wave device. A thickness of the first dielectric film differs from a thickness of the second dielectric film. A propagation direction of an elastic wave in the first elastic wave resonator coincides with a propagation direction of an elastic wave in the second elastic wave resonator. Euler angles of the LiNbO.sub.3 substrate fall within a range of (0°±5°, θ, 0°±10°).

A filter device includes a filter circuit including series-arm resonators and series-arm-resonator connecting wires, and an additional circuit including a resonator including first and second interdigital transducer electrodes, first and second capacitors connected between the first and second interdigital transducer electrodes and the filter circuit, and first and second I-C connecting wires connected to the first and second interdigital transducer electrodes and the first and second capacitors, the additional circuit being connected in parallel with a portion of the series-arm resonators in the filter circuit. The first and second interdigital transducer electrodes are output-side interdigital transducer electrodes. A capacitance of the first capacitor is smaller than the capacitance of the second capacitor. A shortest distance among distances between the first I-C connecting wire and the series-arm-resonator connecting wires is shortest among shortest distances between the I-C connecting wires and the series-arm-resonator connecting wires.

A high-frequency apparatus includes a first device and a second device, and a mounting substrate on which the first and second devices are mounted. At least the second device is an acoustic wave device including a piezoelectric substrate and a functional element. The first device and the second device are adjacent to or in a vicinity of each other on the mounting substrate. A coefficient of linear expansion of a substrate of the first device is lower than a coefficient of linear expansion of the mounting substrate, and a coefficient of linear expansion of the piezoelectric substrate of the second device is higher than the coefficient of linear expansion of the mounting substrate.

An acoustic wave device includes a support including a cavity, a piezoelectric layer on or above the support and made of one of lithium niobate or lithium tantalate, an interdigital transducer electrode embedded in the piezoelectric layer and including surfaces opposed to each other in a thickness direction, one of the surfaces being in contact with the piezoelectric layer, and a dielectric film on the piezoelectric layer and covering the interdigital transducer electrode. The interdigital transducer electrode includes electrode fingers, at least one of which overlaps the cavity in plan view. Assuming a thickness of the piezoelectric layer is d and an electrode finger pitch of the interdigital transducer electrode is p, p/d≥ about 4.25.

Aspects of this disclosure relate to an acoustic wave filter that includes a multi-mode surface acoustic wave filter and a ladder section. The multi-mode surface acoustic wave filter has a higher impedance at an output than at an input. The ladder section is connected to the output of the multi-mode surface acoustic wave filter. Related radio frequency systems, radio frequency modules, wireless communication devices, and methods are disclosed.

A transducer structure for a surface acoustic wave device, comprising a pair of inter-digitated comb electrodes, wherein the pair of inter-digitated comb electrodes comprises neighboring electrode means belonging to different comb electrodes and having a pitch p being defined as the edge-to-edge electrode means distance between two neighboring electrode means, the pitch p satisfying the Bragg condition; characterized in that the pair of inter-digitated comb electrodes comprises at least one region in which two or more neighboring electrode means belong to the same comb electrode while having an edge-to-edge distance to each other corresponding to the pitch p. The present disclosure relates also to a surface acoustic wave filter device.

A filter device includes a substrate having piezoelectricity, a first filter including an IDT electrode disposed on the substrate, a terminal electrode disposed on the substrate, a first wiring electrode disposed on the substrate and connecting the first filter and a terminal electrode, and a dielectric film disposed above the substrate to cover the IDT electrode. At least a portion of the first wiring electrode is not covered with the dielectric film.