In one or more implementations, a data processing device and a data processing method are disclosed that includes a data communication port configured to transmit and receive data to and from at least one computing device. Further, a replicator is included that is configured to replicate ingress data received from the data communication port to a pattern matcher and a field programmable gate array. The pattern matcher is configured to receive the replicated data directly from the replicator and to generate and transmit a trigger signal to the field programmable gate array. Still further, the field programmable gate array is configured to receive the replicated data from the replicator and the trigger signal from the pattern matcher and to perform bit operations on the replicated data as a function of the trigger signal.

A device including an array of superconducting logic cells, where each of the superconducting logic cells is configured to receive at least one input and provide at least one output, is provided. Each of the superconducting logic cells includes at least one Josephson junction, whose state changes based on at least a biasing condition caused by a phase of a first clock or a phase of a second clock. The array of the superconducting logic cells is configured to perform at least one operation based at least on a connection arrangement of the array of the superconducting logic cells.

Disclosed are methods and devices, among which is a device that includes a finite state machine lattice. The lattice may includes a programmable Boolean logic cell that may be programmed to perform various logic functions on a data stream. The programmability includes an inversion of a first input to the Boolean logic cell, an inversion of a last output of the Boolean logic cell, and a selection of an AND gate or an OR gate as a final output of the Boolean logic cell. The Boolean logic cell also includes end of data circuitry configured to cause the Boolean logic cell to only output after an end of data signifying the end of a data stream is received at the Boolean logic cell.

In accordance with an embodiment, a method is disclosed for detecting action in a video clip. An audio clip is extracted from the video clip. The audio clip is converted to an auditory spectrogram. The auditory spectrogram is used to construct a self-similarity matrix. The self-similarity matrix is then used to calculate a novelty curve. The clip is then segmented into segments according to peaks in the novelty curve. Each of segments is scored, and then classified as an action clip if the score is above or below a predetermined threshold. Related methods for folding a digitized song into a shorter version of itself and for sequencing a set of user-supplied video and photo clips to a user-supplied song are further disclosed.

A programmable integrated circuit device includes a plurality of clusters of programmable logic resources. Programmable device interconnect resources allow user-defined interconnection between the clusters of programmable logic resources. A plurality of specialized processing blocks have dedicated arithmetic operators and programmable internal interconnect resources, and having inputs and outputs programmably connectable to the programmable device interconnect resources. A plurality of dedicated memory modules have inputs and outputs programmably connectable to the programmable device interconnect resources. Programmably connectable direct interconnect between at least one respective individual one of the specialized processing blocks and at least one respective individual one of the dedicated memory modules allow the formation of a processor element from a specialized processing block and a memory module. The specialized processing block may be designed with a datapath and operators arranged to support the configuring of a processor element.

A device that includes a memristive Akers logic array, wherein the memristive Akers logic array comprises multiple primitive logic cells that are coupled to each other; wherein each primitive logic cell comprises at least one memristive device.

A device that includes a memristive Akers logic array, wherein the memristive Akers logic array comprises multiple primitive logic cells that are coupled to each other; wherein each primitive logic cell comprises at least one memristive device.

A multi-chip package comprising an interconnection substrate; a first semiconductor IC chip over the interconnection substrate, wherein the first semiconductor IC chip comprises a first silicon substrate, a plurality of first metal vias passing through the first silicon substrate, a plurality of first transistors on a top surface of the first silicon substrate and a first interconnection scheme over the first silicon substrate, wherein the first interconnection scheme comprises a first interconnection metal layer over the first silicon substrate, a second interconnection metal layer over the first interconnection layer and the first silicon substrate and a first insulating dielectric layer over the first silicon substrate and between the first and second interconnection metal layers; a second semiconductor IC chip over and bonded to the first semiconductor IC chip; and a plurality of second metal vias over and coupling to the interconnection substrate, wherein the plurality of second metal vias are in a space extending from a sidewall of the first semiconductor IC chip.

A multi-chip package comprising an interconnection substrate; a first semiconductor IC chip over the interconnection substrate, wherein the first semiconductor IC chip comprises a first silicon substrate, a plurality of first metal vias passing through the first silicon substrate, a plurality of first transistors on a top surface of the first silicon substrate and a first interconnection scheme over the first silicon substrate, wherein the first interconnection scheme comprises a first interconnection metal layer over the first silicon substrate, a second interconnection metal layer over the first interconnection layer and the first silicon substrate and a first insulating dielectric layer over the first silicon substrate and between the first and second interconnection metal layers; a second semiconductor IC chip over and bonded to the first semiconductor IC chip; and a plurality of second metal vias over and coupling to the interconnection substrate, wherein the plurality of second metal vias are in a space extending from a sidewall of the first semiconductor IC chip.

In one or more implementations, a data processing device and a data processing method are disclosed that includes a data communication port configured to transmit and receive data to and from at least one computing device. Further, a replicator is included that is configured to replicate ingress data received from the data communication port to a pattern matcher and a field programmable gate array. The pattern matcher is configured to receive the replicated data directly from the replicator and to generate and transmit a trigger signal to the field programmable gate array. Still further, the field programmable gate array is configured to receive the replicated data from the replicator and the trigger signal from the pattern matcher and to perform bit operations on the replicated data as a function of the trigger signal.