Systems and methods are provided for performing error recovery using LLRs generated from multi-read operations. A method may comprise selecting a set of decoding factors for a multi-read operation to read a non-volatile storage device multiple times. The set of decoding factors may include an aggregation mode for aggregating read results of multiple reads. The method may further comprise issuing a command to the non-volatile storage device to read user data according to the set of decoding factors, generating a plurality of Log-Likelihood Ratio (LLR) values using a mapping engine from a pre-selected set of LLR value magnitudes based on the set of decoding factors, obtaining an aggregated read result in accordance with the aggregation mode and obtaining an LLR value from the plurality of LLR values using the aggregated read result as an index.

The present application discloses a multi-die FPGA implementing a built-in analog circuit using an active silicon connection layer, and relates to the field of FPGA technology. The multi-die FPGA allows multiple small-scale and small-area dies to cascade to achieve large-scale and large-area FPGA products, reducing processing difficulties and improving chip production yields. Meanwhile, due to the existence of the active silicon connection layer, some circuit structures that are difficult to implement within the die and/or occupy a large die area and/or have a low processing requirement can be laid out in the silicon connection layer, solving the existing problems of making these circuit structures directly within the die. Part of the circuit structures can be implemented within the silicon connection layer and the rest in the die, which helps optimize the performance of FPGA products, improve system stability, and reduce system area.

The present application discloses a multi-die FPGA implementing a built-in analog circuit using an active silicon connection layer, and relates to the field of FPGA technology. The multi-die FPGA allows multiple small-scale and small-area dies to cascade to achieve large-scale and large-area FPGA products, reducing processing difficulties and improving chip production yields. Meanwhile, due to the existence of the active silicon connection layer, some circuit structures that are difficult to implement within the die and/or occupy a large die area and/or have a low processing requirement can be laid out in the silicon connection layer, solving the existing problems of making these circuit structures directly within the die. Part of the circuit structures can be implemented within the silicon connection layer and the rest in the die, which helps optimize the performance of FPGA products, improve system stability, and reduce system area.

Configurable circuits include an input selection region, a computation region, a switching region, and an output region. The input selection region includes a set of input multiplexers and selects and routes input signals. The computation region includes a set of lookup tables, each lookup table being coupled to selected signals from the input selection stage to generate a respective output signal. The switching region includes a set of output multiplexers, each output multiplexer being coupled to output signals from the set of lookup tables to provide circuit outputs responsive to respective output selection signals. The output region includes a domino logic stage, having a set of transistors, coupled to output signals from the set of lookup tables to provide circuit outputs that determine combinations of the signals output by the set of lookup tables.

A method for real-time firmware configuration and a debugging apparatus are provided. When a demand for updating or debugging a target processor raises, in the method, a computer system generates a firmware debugging request that is attached with a firmware data with a specific debugging function. The computer system then loads the firmware data to a programmable logic unit of the debugging apparatus. After the real-time firmware configuration is completed, the computer system issues a debugging command to the programmable logic unit. The programmable logic unit obtains at least one debugging action after resolving the debugging command. The at least one debugging action is performed in the target processor when the target processor receives the at least one debugging action. A debugging result is returned after the at least one debugging action is completed.

A method for real-time firmware configuration and a debugging apparatus are provided. When a demand for updating or debugging a target processor raises, in the method, a computer system generates a firmware debugging request that is attached with a firmware data with a specific debugging function. The computer system then loads the firmware data to a programmable logic unit of the debugging apparatus. After the real-time firmware configuration is completed, the computer system issues a debugging command to the programmable logic unit. The programmable logic unit obtains at least one debugging action after resolving the debugging command. The at least one debugging action is performed in the target processor when the target processor receives the at least one debugging action. A debugging result is returned after the at least one debugging action is completed.

The various embodiments described herein include methods, devices, and systems for operating superconducting circuitry. In one aspect, a programmable circuit includes: (1) a superconducting component arranged in a multi-dimensional array of alternating narrow and wide portions, the superconducting component having an input terminal at a first end and an output terminal at a second end opposite of the first end; and (2) control circuitry coupled to the narrow portions of the superconducting component, the control circuitry configured to transition the narrow portions between superconducting and non-superconducting states. In some implementations, the superconducting component and the control circuitry are formed on different layers of the programmable circuit.

The various embodiments described herein include methods, devices, and systems for operating superconducting circuitry. In one aspect, a programmable circuit includes: (1) a superconducting component arranged in a multi-dimensional array of alternating narrow and wide portions, the superconducting component having an input terminal at a first end and an output terminal at a second end opposite of the first end; and (2) control circuitry coupled to the narrow portions of the superconducting component, the control circuitry configured to transition the narrow portions between superconducting and non-superconducting states. In some implementations, the superconducting component and the control circuitry are formed on different layers of the programmable circuit.

A memory system includes memory chips connected to each other. Each of the memory chips includes a memory array, a read/write data strobe pin, a look-up table storage device, a chip number identification circuit, and a control logic circuit. The memory array stores data. The read/write data strobe pin is connected to read/write data strobe pins of other memory chips. The look-up table storage device stores a plurality of trimming shift values related to a number of chip connections in advance. The chip number identification circuit identifies a current number of chip connections according to a state information, and finds a selected trimming shift value from the look-up table storage device. The control logic circuit transmits a data signal in response to a clock signal, and adjusts a setup hold time between the clock signal and the data signal according to the selected trimming shift value.

A memory system includes memory chips connected to each other. Each of the memory chips includes a memory array, a read/write data strobe pin, a look-up table storage device, a chip number identification circuit, and a control logic circuit. The memory array stores data. The read/write data strobe pin is connected to read/write data strobe pins of other memory chips. The look-up table storage device stores a plurality of trimming shift values related to a number of chip connections in advance. The chip number identification circuit identifies a current number of chip connections according to a state information, and finds a selected trimming shift value from the look-up table storage device. The control logic circuit transmits a data signal in response to a clock signal, and adjusts a setup hold time between the clock signal and the data signal according to the selected trimming shift value.