Patent classifications
H03K19/17732
Hybrid synchronous and asynchronous control for scan-based testing
An integrated circuit includes an intellectual property core, scan data pipeline circuitry configured to convey scan data to the intellectual property core, and scan control pipeline circuitry configured to convey one or more scan control signals to the intellectual property core. The integrated circuit also includes a wave shaping circuit configured to detect a trigger event on the one or more scan control signals and, in response to detecting the trigger event, suppress a scan clock to the intellectual property core for a selected number of clock cycles.
Hybrid synchronous and asynchronous control for scan-based testing
An integrated circuit includes an intellectual property core, scan data pipeline circuitry configured to convey scan data to the intellectual property core, and scan control pipeline circuitry configured to convey one or more scan control signals to the intellectual property core. The integrated circuit also includes a wave shaping circuit configured to detect a trigger event on the one or more scan control signals and, in response to detecting the trigger event, suppress a scan clock to the intellectual property core for a selected number of clock cycles.
RECONFIGURABLE ARRAY FOR ANALOG APPLICATIONS
A field-programmable analog array (FPAA) fabric includes a 6×6 matrix of configurable analog blocks (CABs). The implementation of programmable CABs eliminates the use of fixed analog subcircuits. A unique routing strategy is developed within the CAB units that supports both differential and single-ended mode circuit configurations. The bandwidth limitation due to the routing switches of each individual CAB unit is compensated for through the use of a switch-less routing network between CABs. Algorithms and methodologies facilitate rapid implementation of analog circuits on the FPAA. The proposed FPAA fabric provides high operating speeds as compared to existing FPAA topologies, while providing greater configuration in the CAB units as compared to switch-less FPAA. The FPAA core includes 498 programming switches and 14 global switchless interconnects, while occupying an area of 0.1 mm2 in a 65 nm CMOS process.
RECONFIGURABLE ARRAY FOR ANALOG APPLICATIONS
A field-programmable analog array (FPAA) fabric includes a 6×6 matrix of configurable analog blocks (CABs). The implementation of programmable CABs eliminates the use of fixed analog subcircuits. A unique routing strategy is developed within the CAB units that supports both differential and single-ended mode circuit configurations. The bandwidth limitation due to the routing switches of each individual CAB unit is compensated for through the use of a switch-less routing network between CABs. Algorithms and methodologies facilitate rapid implementation of analog circuits on the FPAA. The proposed FPAA fabric provides high operating speeds as compared to existing FPAA topologies, while providing greater configuration in the CAB units as compared to switch-less FPAA. The FPAA core includes 498 programming switches and 14 global switchless interconnects, while occupying an area of 0.1 mm2 in a 65 nm CMOS process.
Periphery shoreline augmentation for integrated circuits
A multichip package may include at least a main die mounted on a substrate. The main die may be coupled to one or more transceiver dies also mounted on the substrate. The main die may include one or more universal interface blocks configured to interface with an on-package memory device or an on-package expansion die, both of which can be mounted on the substrate. The expansion die may include external memory interface (EMIF) components for communicating with off-package memory devices and/or bulk random-access memory (RAM) components for storing large amounts of data for the main die. Smaller input-output blocks such as GPIO (general purpose input-output) or LVDS (low-voltage differential signaling) interfaces may be formed within the core fabric of the main die without causing routing congestion while providing the necessary clock source.
Reduced latency multiplier circuitry for very large numbers
An integrated circuit with a large multiplier is provided. The multiplier may be configured to receive large input operands with thousands of bits. The multiplier may be implemented using a multiplier decomposition scheme that is recursively flattened into multiple decomposition levels to expose a tree of adders. The adders may be collapsed into a merged pipelined structure, where partial sums are forwarded from one level to the next while bypassing intervening prefix networks. The final correct sum is not calculated until later. In accordance with the decomposition technique, the partial sums are successively halved, which allows the prefix networks to be smaller from one level to the next. This allows all sums to be calculated at approximately the same pipeline depth, which significantly reduces latency with no or limited pipeline balancing.
Process of routing tile-to-tile interconnects of an FPGA, and method of manufacturing an FPGA
A method of routing interconnects of a field programmable gate array including: a plurality of logic tiles, and a tile-to-tile interconnect network, having a plurality of tile-to-tile interconnects to interconnect logic tile networks of the logic tiles, the method comprises: routing a first plurality of tile-to-tile interconnects in a first plurality of logic tiles. After routing the first plurality of tile-to-tile interconnects, routing a second plurality of tile-to-tile interconnects in a second plurality of logic tiles. The start/end point of each tile-to-tile interconnect in the first plurality and the second plurality of tiles is independent of the start/end point of the other tile-to-tile interconnects in the first and second plurality, respectively. Routing the second plurality of tile-to-tile interconnects includes connecting at least one start/end point of each tile-to-tile interconnect in the second plurality of tiles to at least one start/end point of each interconnect in the first plurality of tiles.
Process of routing tile-to-tile interconnects of an FPGA, and method of manufacturing an FPGA
A method of routing interconnects of a field programmable gate array including: a plurality of logic tiles, and a tile-to-tile interconnect network, having a plurality of tile-to-tile interconnects to interconnect logic tile networks of the logic tiles, the method comprises: routing a first plurality of tile-to-tile interconnects in a first plurality of logic tiles. After routing the first plurality of tile-to-tile interconnects, routing a second plurality of tile-to-tile interconnects in a second plurality of logic tiles. The start/end point of each tile-to-tile interconnect in the first plurality and the second plurality of tiles is independent of the start/end point of the other tile-to-tile interconnects in the first and second plurality, respectively. Routing the second plurality of tile-to-tile interconnects includes connecting at least one start/end point of each tile-to-tile interconnect in the second plurality of tiles to at least one start/end point of each interconnect in the first plurality of tiles.
Bridged integrated circuits
Methods, systems, and apparatus, including a system that includes a first integrated circuit chip configured to store application logic for one or more executable applications; and a second integrated circuit chip communicatively coupled to the first integrated circuit chip, the second integrated circuit chip including an instruction decoder configured to decode instructions for executing the one or more executable applications; and a communication interface configured to transmit the decoded instructions to the first integrated circuit chip to execute the one or more executable applications on the first integrated circuit chip.
Bridged integrated circuits
Methods, systems, and apparatus, including a system that includes a first integrated circuit chip configured to store application logic for one or more executable applications; and a second integrated circuit chip communicatively coupled to the first integrated circuit chip, the second integrated circuit chip including an instruction decoder configured to decode instructions for executing the one or more executable applications; and a communication interface configured to transmit the decoded instructions to the first integrated circuit chip to execute the one or more executable applications on the first integrated circuit chip.