Examples of the present disclosure provide apparatuses and methods for performing multi-variable bit-length multiplication operations in a memory. An example method comprises performing a multiplication operation on a first vector and a second vector. The first vector includes a number of first elements stored in a group of memory cells coupled to a first access line and a number of sense lines of a memory array. The second vector includes a number of second elements stored in a group of memory cells coupled to a second access line and the number of sense lines of the memory array. The example multiplication operation can include performing a number of AND operations, OR operations and SHIFT operations without transferring data via an input/output (I/O) line.

The present disclosure provides chip architectures for FPGAs and other routing implementations that provide for increased memory with high bandwidth, in a reduced size, accessible with reduced latency. Such architectures include a first layer in advanced node and a second layer in legacy node. The first layer includes an active die, active circuitry, and a configurable memory, and the second layer includes a passive die with wiring. The second layer is bonded to the first layer such that the wiring of the second layer interconnects with the active circuitry of the first layer and extends an amount of wiring possible in the first layer.

An electrical system comprising a circuit of reconfigurable electrical devices and a controller including a processor. The processor has a configuration examiner and a state modifier. The configuration examiner is configured to determine a configuration for the circuit of reconfigurable electrical devices based upon a connection input. The state modifier is configured to modify, based on the configuration, the circuit by changing a resistance state of the reconfigurable electrical devices. A controller for reconfigurable electrical devices and a method of controlling reconfigurable electrical devices of a circuit are also described.

Integrated circuits with digital signal processing (DSP) blocks are provided. A DSP block may include one or more large multiplier circuits. A large multiplier circuit such as an 1818 multiplier circuit may be used to support two or more smaller multiplication operations such as two 88 integer multiplications or two 99 integer multiplications. To implement the two 88 or 99 unsigned/signed multiplications, the 1818 multiplier may be configured to support two 88 multiplications with one shared operand, two 66 multiplications without any shared operand, or two 77 multiplications without any shared operand. Any potential overlap of partial product terms may be subtracted out using correction logic. The multiplication of the remaining most significant bits can be computed using associated multiplier extension logic and appended to the other least significant bits using merging logic.

Systems and methods relating to a programmable circuit. The programmable circuit includes multiple sectors. Each sector includes configurable functional blocks, configurable routing wires, configuration bits for storing configurations for the functional blocks and routing wires, and local control circuitry for interfacing with the configuration bits to configure the sector. The programmable circuit may include global control circuitry for interfacing with the local control circuitry to configure the sector. Each sector may be independently operable and/or operable in parallel with other sectors. Operating the programmable circuit may include using the local control circuitry to interface with the configurations bit and configure the sector. Additionally, operating the programmable circuit may include using the global control circuitry to interface with respective local control circuitry and configure the sector.

Methods, systems, and apparatus, including a system that includes a first integrated circuit chip configured to store application logic for one or more executable applications; and a second integrated circuit chip communicatively coupled to the first integrated circuit chip, the second integrated circuit chip including an instruction decoder configured to decode instructions for executing the one or more executable applications; and a communication interface configured to transmit the decoded instructions to the first integrated circuit chip to execute the one or more executable applications on the first integrated circuit chip.

Methods, systems, and apparatus, including a system that includes a first integrated circuit chip configured to store application logic for one or more executable applications; and a second integrated circuit chip communicatively coupled to the first integrated circuit chip, the second integrated circuit chip including an instruction decoder configured to decode instructions for executing the one or more executable applications; and a communication interface configured to transmit the decoded instructions to the first integrated circuit chip to execute the one or more executable applications on the first integrated circuit chip.

A multichip package may include at least a main die mounted on a substrate. The main die may be coupled to one or more transceiver dies also mounted on the substrate. The main die may include one or more universal interface blocks configured to interface with an on-package memory device or an on-package expansion die, both of which can be mounted on the substrate. The expansion die may include external memory interface (EMIF) components for communicating with off-package memory devices and/or bulk random-access memory (RAM) components for storing large amounts of data for the main die. Smaller input-output blocks such as GPIO (general purpose input-output) or LVDS (low-voltage differential signaling) interfaces may be formed within the core fabric of the main die without causing routing congestion while providing the necessary clock source.

An electrical system comprising a circuit of reconfigurable electrical devices and a controller including a processor. The processor has a configuration examiner and a state modifier. The configuration examiner is configured to determine a configuration for the circuit of reconfigurable electrical devices based upon a connection input. The state modifier is configured to modify, based on the configuration, the circuit by changing a resistance state of the reconfigurable electrical devices. A controller for reconfigurable electrical devices and a method of controlling reconfigurable electrical devices of a circuit are also described.

The present disclosure provides chip architectures for FPGAs and other routing implementations that provide for increased memory with high bandwidth, in a reduced size, accessible with reduced latency. Such architectures include a first layer in advanced node and a second layer in legacy node. The first layer includes an active die, active circuitry, and a configurable memory, and the second layer includes a passive die with wiring. The second layer is bonded to the first layer such that the wiring of the second layer interconnects with the active circuitry of the first layer and extends an amount of wiring possible in the first layer.