A semiconductor device includes a first chip and a second chip. The first chip includes a first circuit having a first output terminal. The second chip includes a second circuit having a second output terminal, which is electrically connected to the first output terminal via a first signal line. When the first chip and the second chip receive a first command, the second circuit calibrates an output impedance at the second output terminal through a first calibration operation based on an output impedance at the first output terminal.

An integrated circuit may include an embedded test processor that is capable of performing in-field testing and repair of hardware-related defects without having to remove the integrated circuit from the customer's board. The test processor can be used to drive and monitor test vectors to performing defect screening on input-output circuitry, logic circuitry including lookup table (LUT) circuits and digital signal processing (DSP) circuits, transceiver circuitry, and configuration random-access memory circuitry. The test processor can generate a failure mechanism report and selectively fix repairable defects via a hardware redundancy scheme. The failure mechanism report allows the customer to identify the root cause of failure in the overall system.

Systems or methods of the present disclosure may provide a programmable logic device including multiple logic array blocks each having multiple programmable elements. The multiple logic array blocks are arranged in multiple rows that are segmented into multiple segments. The programmable logic device also includes repair circuitry disposed between the multiple segments. The repair circuitry remaps logic within a first segment of the multiple segments when a first logic array block of the multiple logic array blocks has failed. Moreover, the first segment includes the first logic array block.

A field programmable gate array (FPGA) with an automatic error detection and correction function for programmable logic modules includes an error checking and correction device. A check code generation circuit in the error checking and correction device performs error correcting code (ECC) encoding according to input data of corresponding programmable logic registers to generate a check code, and refreshes and writes the check code into a check code register according to a clock signal. A check circuit checks outputs of the programmable logic registers and check code registers to generate syndromes for implementing checking. A decoding circuit generates upset signals corresponding to the syndromes according to a trigger enable pulse of a trigger circuit to control a fault register to directly and asynchronously upset content to correct the error. A circuit area is greatly reduced by using the FPGA, thereby improving a degree of integration of the circuit.

An integrated circuit includes first circuits that are configured to implement a user design for the integrated circuit, second circuits that are unused by the user design, and configuration circuitry that couples the second circuits together through a network of conductors. Transistors in the second circuits turn on and off in response to a varying signal that propagates through the second circuits and through the network of conductors while the first circuits implement the user design.

An integrated circuit includes first circuits that are configured to implement a user design for the integrated circuit, second circuits that are unused by the user design, and configuration circuitry that couples the second circuits together through a network of conductors. Transistors in the second circuits turn on and off in response to a varying signal that propagates through the second circuits and through the network of conductors while the first circuits implement the user design.

A three-dimensional stacked integrated circuit (3D SIC) having a non-volatile memory die, a volatile memory die, and a logic die. The non-volatile memory die, the volatile memory die, and the logic die are stacked. The 3D SIC is partitioned into a plurality of columns that are perpendicular to each of the stacked dies. Each column of the plurality of columns is configurable to be bypassed via configurable routes. When the configurable routes are used, functionality of a failing part of the column is re-routed to a corresponding effective part of a neighboring column.

A three-dimensional stacked integrated circuit (3D SIC) having a non-volatile memory die, a volatile memory die, and a logic die. The non-volatile memory die, the volatile memory die, and the logic die are stacked. The 3D SIC is partitioned into a plurality of columns that are perpendicular to each of the stacked dies. Each column of the plurality of columns is configurable to be bypassed via configurable routes. When the configurable routes are used, functionality of a failing part of the column is re-routed to a corresponding effective part of a neighboring column.

An embedded logic analyzer of an integrated circuit includes a comparison block configured to generate a capture data signal and a plurality of comparison enable signals based on an input data signal from one of function blocks included in the integrated circuit such that the comparison enable signals are activated respectively based on different comparison conditions; an operation block configured to perform a logic operation on the comparison enable signals to generate a data enable signal indicating a data capture timing; and packer circuitry configured to generate a packer data signal including capture data and capture time information based on the capture data signal, the data enable signal and a time information signal.

An embedded logic analyzer of an integrated circuit includes a comparison block configured to generate a capture data signal and a plurality of comparison enable signals based on an input data signal from one of function blocks included in the integrated circuit such that the comparison enable signals are activated respectively based on different comparison conditions; an operation block configured to perform a logic operation on the comparison enable signals to generate a data enable signal indicating a data capture timing; and packer circuitry configured to generate a packer data signal including capture data and capture time information based on the capture data signal, the data enable signal and a time information signal.