A high peak bandwidth I/O channel embedded within a multilayer surface interface that forms the bus circuitry electrically interfacing the output or input port on a first semiconductor die with the input or output port on a second semiconductor die.

This application provides example receiver optical sub-assemblies, example bi-directional optical sub-assemblies, and example optical network devices. One example receiver optical sub-assembly includes a photodiode, a trans-impedance amplifier, and a first filter component. The photodiode is configured to convert an optical signal into an electrical signal, a positive electrode of the photodiode is connected to an input terminal of the trans-impedance amplifier, and a negative electrode of the photodiode is configured to connect to a power supply. The trans-impedance amplifier is configured to amplify the electrical signal output by the photodiode, where a power terminal of the trans-impedance amplifier is configured to connect to a power supply, and a first ground terminal of the trans-impedance amplifier is configured to connect to an external ground.

A reception device 20 is configured to include a separation means 21 and a plurality of optical reception means 22. Each optical reception means 22 is configured to further include an optical/electrical conversion means 23 and a band restoration means 24. The separation means 21 separates a multiplexed signal into which signals of respective channels to which spectral shaping that narrows bandwidth to less than or equal to a baud rate is applied are multiplexed at spacings less than or equal to the baud rate on the transmission side into optical signals for the respective channels. Each optical/electrical conversion means 23 converts an optical signal to an electrical signal as a reception signal. Each band restoration means 24 applies processing having inverse characteristics to those of the band narrowing filter processing to the reception signal and restores the band of the reception signal.

High-performance ultra-wideband Phased Array Sensors (PAS) are disclosed, which have unique capabilities, enabled through photonic integrated circuits and novel optical architectures. Unique capabilities for a Receive PAS are provided by wafer scale photonic integration including heterogeneous integration of III-V materials and ultra-low-loss silicon nitride waveguides, combining key component technologies into complex PIC devices. Novel aspects include optical multiplexing combining wavelength division multiplexing and/or a novel extension to array photodetectors providing the capability to combine many RF photonic signals with very low loss. The architecture also includes optical down-conversion, as well as digital signal processing to improve the linearity of the system. Simultaneous multi-channel beamforming is achieved through optical power splitting of optical signals to create multiple exact replicas of the signals that are then processed independently.

An optical receiver is configured so as to be as less susceptible to noise as possible even in the case where high noise occurs inside an optical transceiver. The optical receiver includes a connection part that connects two photodiodes (PDs) constituting a dual photodiode and a transimpedance amplifier (TIA), wherein signal lines from the dual photodiode are surrounded by a conductor pattern that is not connected to each of the signal lines for each channel, and the conductor pattern is connected to a ground pattern on the transimpedance amplifier or a power source pattern for the PDs.

A channel estimation technique suitable for implementation at a digital communication receiver such as an optical signal receiver apparatus includes receiving, over a communication channel, a transmission comprising a sequence of modulated symbols, estimating, at multiple frequencies, estimated values of a channel transfer function of the communication channel and selectively revising the estimated values of channel transfer function by reducing glitches in the estimated values of the channel transfer function.

An optical transmitter for quantum communication, including a QKD channel comprising at least QKD light source and configured to emit a stream of QKD encoded pulses; a reference channel including a reference light source and configured to emit a stream of reference pulses; and a control circuit connected to the QKD channel and to the reference light channel. The control circuit is configured to control the QKD channel and the reference light channel to emit the reference pulses with a predetermined time delay to the QKD encoded pulses. A difference of a wavelength of the QKD encoded pulses and a wavelength of the reference pulses is 5 nm or less. A corresponding optical receiver, an optical system and a method for quantum communication are also provided.

A high peak bandwidth I/O channel embedded within a multilayer surface interface that forms the bus circuitry electrically interfacing the output or input port on a first semiconductor die with the input or output port on a second semiconductor die.

High-performance ultra-wideband Phased Array Sensors (PAS) are disclosed, which have unique capabilities, enabled through photonic integrated circuits and novel optical architectures. Unique capabilities for a Receive PAS are provided by wafer scale photonic integration including heterogeneous integration of III-V materials and ultra-low-loss silicon nitride waveguides, combining key component technologies into complex PIC devices. Novel aspects include optical multiplexing combining wavelength division multiplexing and/or a novel extension to array photodetectors providing the capability to combine many RF photonic signals with very low loss. The architecture also includes optical down-conversion, as well as digital signal processing to improve the linearity of the system. Simultaneous multi-channel beamforming is achieved through optical power splitting of optical signals to create multiple exact replicas of the signals that are then processed independently.

High-performance ultra-wideband Phased Array Sensors (PAS) are disclosed, which have unique capabilities, enabled through photonic integrated circuits and novel optical architectures. Unique capabilities for a Receive PAS are provided by wafer scale photonic integration including heterogeneous integration of III-V materials and ultra-low-loss silicon nitride waveguides, combining key component technologies into complex PIC devices. Novel aspects include optical multiplexing combining wavelength division multiplexing and/or a novel extension to array photodetectors providing the capability to combine many RF photonic signals with very low loss. The architecture also includes optical down-conversion, as well as digital signal processing to improve the linearity of the system. Simultaneous multi-channel beamforming is achieved through optical power splitting of optical signals to create multiple exact replicas of the signals that are then processed independently.