A contact image sensor includes a preset scanning plane used for the surface to be scanned to map to the original copy. The contact image sensor includes: a timing circuit: for self-generating light source control signal LRDT and line scan control signal TRIG1; a lens: for collecting reflected light emitted by a light source reflected by the original copy and emitting the reflected light onto a photoelectric conversion chip for converting received optical signals into electrical signals; and a data processing unit: emitting trigger pulse TRIG according to the encoder transmitting the object to be detected, receiving and processing electrical signals output by the photoelectric conversion chip that has the same size of the photoelectric signal output, ensuring the output stability, dynamic range and sensitivity of the image sensor.

An image reading device (1) includes a board (24) including a plurality of imaging elements (23) arranged along a scanning direction, and a housing (13) including (i) a plurality of optical components that are arranged along the scanning direction and (ii) a plurality of housing components (13a, 13b) that are arranged along the scanning direction. Each of the plurality of optical components focuses light reflected by a reading target onto a corresponding imaging element (23), and each of the plurality of housing components holds at least one optical component. The plurality of housing components (13a, 13b) are arranged to have a clearance therebetween and each of the plurality of housing components (13a, 13b) is fixed to the board (24) at a position to transmit light through the optical components to focus onto the corresponding imaging element (23).

A linear image sensor includes first and second sensor chips, first and second substrates, a common support substrate, a support portion, a dam portion, and a sealing portion. The first sensor chip is mounted to partially protrude on one end side of the first substrate. The second sensor chip is mounted to partially protrude on one end side of the second substrate. The first and second substrates are mounted on the common support substrate. The support portion is provided in a gap between the end faces of the first and second substrates. The dam portion is provided annularly to surround the sensor chips. The sealing portion seals the sensor chips, in a region surrounded by the dam portion.

An example scanner device includes a sealed enclosure including a scan window to allow light to enter the sealed enclosure, and an optical assembly including a light source and an image sensor. The light source is to emit light through the scan window onto a medium to be scanned. The image sensor is to capture light reflected by the medium through the scan window. The optical assembly is rotatably positioned within the sealed enclosure. An actuator is disposed within the sealed enclosure to rotate the optical assembly to aim the optical assembly at different locations on the scan window.

An example scanner device includes a sealed enclosure including a scan window to allow light to enter the sealed enclosure, and an optical assembly including a light source and an image sensor. The light source is to emit light through the scan window onto a medium to be scanned. The image sensor is to capture light reflected by the medium through the scan window. The optical assembly is rotatably positioned within the sealed enclosure. An actuator is disposed within the sealed enclosure to rotate the optical assembly to aim the optical assembly at different locations on the scan window.

An image controller of an image forming apparatus is configured to generate a light emission signal for detection for forming light emission for detection, and transmit the light emission signal for detection to a laser controller through a flexible flat cable, and the laser controller is configured to cause a semiconductor laser to emit light in accordance with the light emission signal for detection, and determine, based on a PD signal output from a PD that has received a light beam, whether improper connection has occurred in the flexible flat cable.

A lens array unit includes a lens array including a plurality of lenses, a first side plate, and a second side plate, the first side plate and the second side plate being configured to hold the plurality of lenses therebetween, and a frame made of resin and including a first supporting portion and a second supporting portion, the first supporting portion being in contact with an outside surface of the first side plate, the second supporting portion being in contact with an outside surface of the second side plate, the first supporting portion and the second supporting portion being configured to hold the lens array therebetween and support the lens array. The outside surface of the first side plate includes a plurality of first concave portions spaced from each other in an array direction of the lenses and configured to fit with the first supporting portion.

In accordance with an embodiment, a lens mirror array includes a plurality of optical elements integrally connected in a first direction. Each optical element includes an incident side lens surface through which light enters the optical element, a ridge located at an edge of the incident side lens surface, a reflection surface on which light incident on the incident side lens surface is reflected, an exit side lens surface through which light reflected by the reflection surface exits the optical element, and a groove surrounding the reflection surface except for a portion adjacent to the ridge, the portion adjacent to the ridge connecting to an adjacent optical element in the plurality of optical elements.

A linear image sensor includes first and second sensor chips, first and second substrates, a common support substrate, a support portion, a dam portion, and a sealing portion. The first sensor chip is mounted to partially protrude on one end side of the first substrate. The second sensor chip is mounted to partially protrude on one end side of the second substrate. The first and second substrates are mounted on the common support substrate. The support portion is provided in a gap between the end faces of the first and second substrates. The dam portion is provided annularly to surround the sensor chips. The sealing portion seals the sensor chips, in a region surrounded by the dam portion.

A linear image sensor includes first and second sensor chips, first and second substrates, a common support substrate, a support portion, a dam portion, and a sealing portion. The first sensor chip is mounted to partially protrude on one end side of the first substrate. The second sensor chip is mounted to partially protrude on one end side of the second substrate. The first and second substrates are mounted on the common support substrate. The support portion is provided in a gap between the end faces of the first and second substrates. The dam portion is provided annularly to surround the sensor chips. The sealing portion seals the sensor chips, in a region surrounded by the dam portion.