The present disclosure relates to microphones and electronic devices having the same. A microphone may include a housing for receiving vibration signals; a converting component inside the housing for converting the vibration signals into electrical signals, and a processing circuit for processing the electrical signals. The converting component may include a transducer and at least one damping film attached to the transducer.

This disclosure describes a ceiling tile microphone that includes: a plurality of microphones coupled together as a microphone array used for beamforming, the plurality of microphones are positioned at predetermined locations; a single ceiling tile with an outer surface on the front side of the ceiling tile where the outer surface is acoustically transparent, the microphone array combines with the ceiling tile as a single unit, the ceiling tile being mountable in a drop ceiling in place of a ceiling tile included in the drop ceiling; where the ceiling tile microphone further includes beamforming, acoustic echo cancellation, and auto voice tracking; where the ceiling tile microphone is used in a drop ceiling mounting configuration; where the microphone array couples to the back side of the ceiling tile and all or part of the ceiling tile microphone is in the drop space of the drop ceiling.

This disclosure describes a ceiling tile microphone that includes: a plurality of microphones coupled together as a microphone array used for beamforming, the plurality of microphones are positioned at predetermined locations; a single ceiling tile with an outer surface on the front side of the ceiling tile where the outer surface is acoustically transparent, the microphone array combines with the ceiling tile as a single unit, the ceiling tile being mountable in a drop ceiling in place of a ceiling tile included in the drop ceiling; where the ceiling tile microphone further includes beamforming, acoustic echo cancellation, and auto voice tracking; where the ceiling tile microphone is used in a drop ceiling mounting configuration; where the microphone array couples to the back side of the ceiling tile and all or part of the ceiling tile microphone is in the drop space of the drop ceiling.

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

A bone conduction speaker includes a housing, a vibration board and a transducer. The transducer is located in the housing, and the vibration board is configured to contact with skin and pass vibration. At least one sound guiding hole is set on at least one portion of the housing to guide sound wave inside the housing to the outside of the housing. The guided sound wave interfaces with the leaked sound wave, and the interfacing reduces a sound pressure level of at least a portion of the leaked sound wave. A frequency of the at least a portion of the leaked sound wave is lower than 4000 Hz.

A bone conduction speaker includes a housing, a vibration board and a transducer. The transducer is located in the housing, and the vibration board is configured to contact with skin and pass vibration. At least one sound guiding hole is set on at least one portion of the housing to guide sound wave inside the housing to the outside of the housing. The guided sound wave interfaces with the leaked sound wave, and the interfacing reduces a sound pressure level of at least a portion of the leaked sound wave. A frequency of the at least a portion of the leaked sound wave is lower than 4000 Hz.

This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

The present disclosure relates to microphones and electronic devices having the same. A microphone may include a housing for receiving vibration signals; a converting component inside the housing for converting the vibration signals into electrical signals, and a processing circuit for processing the electrical signals. The converting component may include a transducer and at least one damping film attached to the transducer.

This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

This disclosure describes a ceiling tile beamforming microphone array system that includes a plurality of microphones coupled together as a microphone array and used for beamforming processing, the plurality of microphones are positioned at predetermined locations that produce audio signals to be used to form a directional pickup pattern; one or more separate processing devices where one of the separate processing devices further includes beamforming processing; a single ceiling tile with an outer surface on the front side of the ceiling tile where the outer surface is acoustically transparent; where the ceiling tile beamforming microphone array system is used in a drop ceiling mounting configuration, where the microphone array couples to the back side of the ceiling tile and all or part of the ceiling tile beamforming microphone array system is in the drop space of the drop ceiling.