Patent classifications
H04R1/2876
CAVITIES AND ACTIVE REGIONS
The present invention relates to a method and apparatus for providing and/or receiving audible sound. In particular, the invention relates to apparatus, such as a micro speaker, which includes an active region which comprises an adsorbent element in the form of a self-supporting monolith-like element with a porous reticulated structure. The adsorbent element includes adsorbent material which comprises microporous organic polymer (MOP) material. The apparatus of the present invention is suitable for use in an electronic device, for example a mobile or portable electronic device, to provide improved audible sound.
INTEGRATED SHOCK AND IMPACT MANAGEMENT OF A TRANSDUCER
A component of a bone conduction device, including a housing and a piezoelectric bender located in the housing, wherein the component is configured to limit bending of the piezoelectric bender relative to that which would otherwise be the case in the absence of the limits via application of a stopping force at a centralized location of an assembly of which the bender is a part.
Lighting module and lighting kit
Disclosed is a lighting module (10) comprising a carrier (20) having a major surface (21) including a plurality of first regions (23) and a plurality of second regions (25), each second region being adjacent to a first region. The lighting module also has a plurality of light engines (40), each light engine being located in a first region of said carrier, and an optically transmissive light exit structure (50) facing the major surface and being spatially separated therefrom. Each first region is covered by a separate cover (30) that is optically transmissive and acoustically reflective. Each cover has a surface portion with a surface normal (31) under a non-zero angle (θ) with the surface normal (51) of the light exit structure so that it is shaped to reflect sound waves (33) towards an adjacent second region (25). Each second region has an acoustically absorbent member (35) arranged to absorb said reflected sound waves. Also disclosed is a lighting kit (100) comprising a plurality of such lighting modules.
Sound absorbing material, method for process same and speaker using same
The present disclosure provides a sound absorbing material. The sound absorbing material comprising MFI-structural-type molecular sieves, the MFI-structural-type molecular sieves comprises frameworks and extra-framework cations, the framework comprising SiO2 and a metal oxide MxOy containing a metal element M, wherein a molar ratio of Si/M is between 220 and 600 in the framework, the metal element M comprises aluminum, and the extra-framework cations are at least one of hydrogen ions, alkali metal ions and alkaline earth metals. The present also provides a method for preparing a sound absorbing material and a speaker box using the sound absorbing material.
Speaker module
Disclosed is a speaker module, comprising a module housing and a speaker unit accommodated in the module housing. The speaker unit partitions a module cavity encircled by the module housing into two cavities, namely a front acoustic cavity and a rear acoustic cavity. A separator component is provided within the rear acoustic cavity. The separator component partitions the rear acoustic cavity into an accommodating cavity and a sound-absorbing cavity. The sound-absorbing cavity is filled with sound-absorbing particles. An antistatic material is added into the housing material of the module housing at where the sound-absorbing cavity is located, or the antistatic material is coated on the surface of the module housing at where the sound-absorbing cavity is located, and the antistatic material is either an electrically-conductive material or an antistatic agent. The speaker module of the present invention is capable of greatly increasing the fill rate of the sound-absorbing particles in the sound-absorbing cavity of the rear acoustic cavity of the speaker module, thus allowing the space of the rear acoustic cavity of the speaker module to be fully utilized and the sound-absorbing particles to fully exert the effects thereof in improving the acoustic properties of the speaker module, and greatly increasing the acoustic properties of the speaker module.
Virtual Button Using a Sound Signal
Electrical equipment includes a housing having a hole formed therein; a microphone positioned inside the housing and in the proximity of the hole; a loudspeaker; emitter means arranged to emit an emitted detection sound signal via the loudspeaker; and processor means arranged to acquire a received detection sound signal via the microphone, to detect in real time from the received detection sound signal whether a user's finger is or is not positioned on or in the immediate proximity of the hole, and if a finger is positioned on or in the immediate proximity of the hole to cause a predetermined action to be performed.
SYSTEMS AND METHODS FOR SUPPRESSING SOUND LEAKAGE
A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
MICROPHONE AND ELECTRONIC DEVICE HAVING THE SAME
The present disclosure relates to microphones and electronic devices having the same. A microphone may include a housing for receiving vibration signals; a converting component inside the housing for converting the vibration signals into electrical signals, and a processing circuit for processing the electrical signals. The converting component may include a transducer and at least one damping film attached to the transducer.
Microphone and electronic device having the same
The present disclosure relates to microphones and electronic devices having the same. The microphone may include a housing for receiving sound signals, at least two transducers for vibrating to generate electrical signals in response to the sound signals, and a processing circuit for processing the electrical signals. Each of the at least two transducers may provide a distinctive resonance peak to the microphone.
SYSTEMS AND METHODS FOR SUPPRESSING SOUND LEAKAGE
A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.