H04R1/2892

RECEIVER ASSEMBLY

A receiver assembly including a receiver and an assembly housing. The receiver includes a sound outlet configured to outlet sound from the receiver. Furthermore, the receiver includes at least a first and a second outer surface and is arranged at least partly within the assembly housing. The assembly housing includes an assembly sound outlet arranged in communication with the sound outlet for outlet of sound from the receiver via the assembly outlet. The receiver assembly further includes a suspension structure having at least one suspension element, the suspension structure suspending the receiver in the assembly housing. The suspension element connects the receiver and the assembly housing, and the suspension element is formed by a sheet material and is an elongated element extending in an longitudinal direction and is configured to dampen vibration of the receiver by deflection of the suspension element in a direction transverse to the longitudinal direction.

MICORPHONE MOUNT MECHANICAL ISOLATOR
20180160221 · 2018-06-07 ·

Universal mechanical isolator that effectively decouples a vibration sensitive device such as a microphone from a support to thereby isolate the vibration sensitive device from mechanical vibrations.

Top port multi-part surface mount silicon condenser microphone
09980038 · 2018-05-22 · ·

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

Electronic device

An electronic device includes: a case having an aperture; a board located within the case; a microphone located at a position corresponding to the aperture of the case; a partition wall located between the board and the case to surround a periphery of the microphone; and a sound absorbing material having a density of 46 kg/m.sup.3 to 69 kg/m.sup.3, and located in a space partitioned by the board, the partition wall, and the case to cover the microphone.

SENSOR DEVICE, VEHICLE, PRODUCTION METHOD, AND MOUNTING METHOD
20240388840 · 2024-11-21 ·

A sensor device. The sensor device has a sensor housing, which includes a circuit carrier including a microphone sensor, a cover, and a housing body, which has an internal space. The circuit carrier is arranged in the internal space. The sensor device includes at least one elastic outer damper, which is arranged on an outer side of the sensor housing on the cover and/or on the housing body.

Microphone holding structure and electronic device
09871901 · 2018-01-16 · ·

A holding structure for holding a microphone includes a chassis configured to be separated into at least a first chassis and a second chassis; an elastic member formed of an elastic material, the elastic member including a holding unit configured to hold the microphone and an attachment portion provided in a periphery of the holding unit; and a retention member configured to retain the attachment portion at a predetermined position of the first chassis. The retention member is fixed to the first chassis by the second chassis in a state where the second chassis is attached to the first chassis.

Biological sound acquisition device
12167930 · 2024-12-17 · ·

A biological sound acquisition device (10) includes a housing (100), a first acceleration sensor (210), and a second acceleration sensor (220). The first acceleration sensor (210) is disposed in the housing (100). The first acceleration sensor (210) is mechanically connected to the housing (100) through a first vibration damping member (410). The second acceleration sensor (220) is disposed in the housing (100).

Speaker and electronic device having the speaker
09838778 · 2017-12-05 · ·

An electronic device has a speaker. The speaker has a main body and a cover. The main body has a speaker body and a tube. The tube is situated at a side of the speaker body. The cover is situated above the main body for covering the tube and part of the speaker body, such that the speaker has a covered portion and an uncovered portion. The cover has a hole. The sound produced by the covered portion is output via the tube along a first direction. The sound produced by the uncovered portion is output via the hole along a second direction.

Anti-shock self-powered microphone and monitor system for wind instruments and a mount therefor
09832558 · 2017-11-28 · ·

An anti-shock self-powered microphone and monitor system for wind or brass instruments includes a mounting basket and mounting ring, a microphone and microphone mount disposed within the mounting ring, and a wired or wireless personal monitor connected to the microphone. One filament fastens the microphone within the mounting ring by engaging a mounting ring coupling attached to the mounting ring and the microphone mount. Another filament fastens the mounting ring coupling to a bell mounting coupling thereby providing for removeably attaching the system to a bell of a wind or brass instrument. The mounting basket is adaptable in size to accommodate the attachment of the mounting basket to the bell of a saxophone, trumpet, a plurality of brass instruments a wide array of instruments such as, for example the bell of a clarinet, a saxophone, a trumpet, a trombone, a tuba and a sousaphone.

TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE
20170264997 · 2017-09-14 · ·

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.