A ceramic heater including a heater electrode embedded in a plate made of ceramic, wherein, of the heater electrode, a specific area surrounding portion surrounding a specific temperature area in which temperature of the plate becomes low has a smaller thickness than a normal portion of the heater electrode.

A ceramic heater includes a ceramic substrate, a resistance heater, a cylindrical shaft, a thermocouple path, and a thermocouple insertion hole. The disc-shaped ceramic substrate has a wafer placement surface at an upper surface. The resistance heater is embedded in the ceramic substrate. The cylindrical shaft supports the ceramic substrate from a lower surface of the ceramic substrate. The thermocouple path is provided between the resistance heater and the wafer placement surface and extends from a start position on a center side to an end position on an outer circumferential side inside the ceramic substrate. The thermocouple insertion hole is open at an inner shaft region of the lower surface of the ceramic substrate surrounded by the cylindrical shaft and communicates with the thermocouple path.

The present invention relates to a substrate heating apparatus. More specifically, the present invention relates to a substrate heating apparatus including a first heating element located in an inner region of the substrate heating apparatus, a second heating element located in an outer region, and a third heating element supplying current to the second heating element passing through the inner region, wherein the diameter of a wire constituting the third heating element is thicker than the diameter of a wire constituting the second heating element, thereby inhibiting the generation of an overheating region by the heating of the third heating element.

A ceramic heater includes a ceramic plate incorporating an outer peripheral resistance heating element, and an outer peripheral thermocouple that measures the temperature of an outer peripheral zone by a temperature measurement portion provided at the tip of the outer peripheral thermocouple. The outer peripheral resistance heating element extends out from one of a pair of terminals provided at a center portion of the ceramic plate to the annular outer peripheral zone and reaches the other of the pair of terminals after disposed in the outer peripheral zone while turning back at a plurality of turn-back portions. The temperature measurement portion is disposed at a location in the outer peripheral zone excluding parts where the turn-back portions of the outer peripheral resistance heating element face each other.

A ceramic heater includes a ceramic plate, a main resistance heating element, and a sub resistance heating element. The main resistance heating element is a coil that is disposed in the ceramic plate, that is wired from one of a pair of main terminals in a one-stroke pattern, and that reaches the other of the pair of the main terminals. The sub resistance heating element is a heating element that is disposed in the ceramic plate, that complements heating with the main resistance heating element, and that has a two-dimensional shape.

A ceramic heater includes a ceramic plate. The ceramic plate has a wafer placement surface, and is divided into an inner-peripheral zone having a circular shape and an outer-peripheral zone having an annular shape. An inner-peripheral resistance heating element that is composed of high-melting-point metal is disposed in the inner-peripheral zone. An outer-peripheral resistance heating element that has at least a surface composed of metal carbide is disposed in the outer-peripheral zone.

A ceramic heater includes a ceramic plate having a surface that serves as a wafer placement surface, resistance heating elements that are embedded in the ceramic plate, a tubular shaft that supports the ceramic plate from a rear surface of the ceramic plate, a recess that is formed in a within-shaft region of the rear surface of the ceramic plate, the within-shaft region being surrounded by the tubular shaft, and terminals that are disposed to be exposed at a side surface of the recess and that supply electric power to the resistance heating element.

A ceramic heater includes a ceramic plate having a wafer placement surface, a tubular shaft having one end that is bonded to a rear surface of the ceramic plate on an opposite side to the wafer placement surface, a within-shaft region of the rear surface of the ceramic plate, an elongate hole extending from a start point in an outer peripheral portion of the within-shaft region to a terminal end position in the outer peripheral portion of the ceramic plate, and a thermocouple guide that guides a tip end of an outer-peripheral-side thermocouple to come into the start point of the elongate hole. A portion of the thermocouple guide, the portion extending from the other end (lower end) of the tubular shaft to the start point of the elongate hole, is formed in a shape following an inner wall of the tubular shaft.

Implementations described herein provide a substrate support assembly. The substrate support assembly has a first ceramic plate having a workpiece supporting surface and a bottom surface. The first ceramic plate has a plurality of secondary heaters each forming a plurality of micro zones. The substrate support assembly has a second ceramic plate having an upper surface and a lower surface. A first metal bonding layer is disposed between the bottom surface of the first ceramic plate and the upper surface of the second ceramic plate. A third ceramic plate has a top portion and a bottom portion. The third ceramic plate has primary heaters. A second metal bonding layer is disposed between the lower surface of the second ceramic plate and the top portion of the third ceramic plate.

A support unit includes a first plate on which a substrate is seated, a second plate located under the first plate, a third plate located under the second plate, a ground electrode disposed between the first plate and the second plate, and a heater electrode disposed between the second plate and the third plate. The first plate includes a first dielectric plate, a conductive plate disposed under the first dielectric plate, and a second dielectric plate disposed under the conductive plate.