H05B3/143

Heater system, ceramic heater, plasma treatment system, and adsorption system
11031271 · 2021-06-08 · ·

A heater system may include a ceramic heater and a drive device. The ceramic heater may include a ceramic substrate and a resistance heating element. The ceramic substrate may include an upper surface. The resistance heating element may extend in an internal portion or on a surface of the ceramic substrate along the upper surface of the ceramic substrate. The drive device may include a main driving part, which supplies the main power to the entirety of the resistance heating element, and an additional driving part, which supplies additional power to a divided region that is a portion of the resistance heating element, by superimposing it on the main power.

ELECTRONIC CIGARETTE, ATOMIZING ASSEMBLY, AND ATOMIZING COMPONENT FOR SAME
20210161207 · 2021-06-03 ·

An electronic cigarette, an atomization assembly and an atomization component for the same. The atomization component comprises a porous base, a first film, and a second film. The porous base material comprises an atomization surface. The first film and the second film are sequentially formed on the atomization surface. At least one of the first film or the second film is used for generating heat when charged, so as to heat and atomize an e-liquid on the atomization surface.

HEATER AND METHOD OF PRODUCTION OF SAME

A heater includes a base body and a resistance heating element. The base body is configured by an insulating material and includes a top surface on which a wafer is placed. The resistance heating element extends in the base body along the top surface. A top surface of the resistance heating element and the base body are in contact with each other. A vacuum or gas-filled gap is interposed between a side surface of the resistance heating element and the base body.

AEROSOL GENERATOR
20210112871 · 2021-04-22 ·

An aerosol generating device includes a reservoir configured to contain a liquid medium and a heating body including a sheet of an electrically-conductive material having a first surface in physical contact with the liquid medium and a second surface opposite the first surface, interfacing with ambient air, and including an array of micro-nozzles disposed over an area of the sheet and extending through the sheet from the first surface to the second surface. An electrical power unit, is configured to inject pulses of electrical current through the area of the sheet, with a pulse energy selected so as to heat the conducting material sufficiently to vaporize the liquid medium. The micro-nozzles have a profile selected so as to cause a vapor of the liquid medium to be accelerated by the micro-nozzles to form respective high-speed jets of hot vapor into the ambient air.

PBN Heaters For ALD Temperature Uniformity

Heaters having a body with having a top and bottom comprising pyrolytic boron nitride (PBN), a first heater electrode and a second heater electrode are described. The heater electrodes can be enclosed within an electrically insulating standoff and connected to separate busbars to provide power. Heater assemblies including one or more of the heaters and processing chambers including the heater assemblies are also described.

CERAMIC HEATER AND METHOD OF FORMING USING TRANSIENT LIQUID PHASE BONDING

A heater includes an aluminum nitride (AlN) substrate and a heating layer. The heating layer is made from a molybdenum material and is bonded to the AlN substrate via transient liquid phase bonding. The heater can also include a routing layer and a plurality of first conductive vias connecting the heating layer to the routing layer. The routing layer and the plurality of first conductive vias can be made from the molybdenum material and at least one of the routing layer and the plurality of first conductive vias are bonded to the AlN substrate via a transient liquid phase bond. A plurality of second conductive vias connecting the routing layer to a surface of the AlN substrate can be included and the plurality of second conductive vias are made of the molybdenum material and can be bonded to the AlN substrate via a transient liquid phase bond.

CERAMIC HEATER
20210212172 · 2021-07-08 · ·

A ceramic heater includes a ceramic plate in which inner circumferential side and outer circumferential side resistance heating elements are built in; and a cylindrical shaft joined to a rear surface of the ceramic plate. A long hole is provided along a direction deviated from the diameter direction of the ceramic plate, and extends from a start point of a shaft inside area to a terminal position of the outer circumferential portion of the ceramic plate. A portion of the long hole forms a long groove, the portion passing through the shaft inside area. Terminals of the resistance heating elements are collectively provided in one of two division areas which are in the shaft inside area and divided by an axial line of the long groove, the one being a first division area having a larger area.

MULTI-ZONE SILICON NITRIDE WAFER HEATER ASSEMBLY HAVING CORROSION PROTECTIVE LAYER, AND METHODS OF MAKING AND USING THE SAME
20210005480 · 2021-01-07 ·

A wafer heater assembly comprises a heater substrate and a non-porous outermost layer. The heater substrate comprises silicon nitride (Si.sub.3N.sub.4) and includes at least one heating element embedded therein. The non-porous outermost layer is associated with at least a first surface of the heater substrate. The non-porous outermost layer comprises a rare-earth (RE) disilicate (RE.sub.2Si.sub.2O.sub.7); where RE is one of Yb and Y. The non-porous outermost layer includes an exposed surface configured to contact a wafer for heating, the exposed surface opposite the first surface of the heater substrate. Methods of making wafer heater assemblies are also disclosed as well as methods of using the wafer heater assembly.

METHOD FOR MANUFACTURING AN ELECTRICALLY OPERABLE HEATING BODY FOR AN INHALER

Method for manufacturing an electrically operable heating body for an inhaler, wherein a semiconductor material is provided so as to be substantially planar, and a plurality of channels are incorporated into the semiconductor material substantially in the direction of the surface normal of the planar semiconductor material, such that a fluid can pass through the semiconductor material in the channels.

Ceramic structure, method for manufacturing the same, and member for semiconductor manufacturing apparatus

A ceramic structure 10 includes a heater electrode 14 within a disk-shaped AlN ceramic substrate 12. The heater electrode 14 contains a metal filler in the main component WC. The metal filler (such as Ru or RuAl) has a lower resistivity and a higher thermal expansion coefficient than AlN. An absolute value of a difference |CTE| between a thermal expansion coefficient of the AlN ceramic substrate 12 and a thermal expansion coefficient of the heater electrode 14 at a temperature in the range of 40 C. to 1000 C. is 0.35 ppm/ C. or less.