A wiring module according to an embodiment of the present technology includes: a wiring board and a heat dissipation member. The wiring board includes a body portion and one or more heat dissipation vias, the body portion including a front surface layer to which a device package is connected and a rear surface layer opposite to the front surface layer, the one or more heat dissipation vias penetrating the body portion from the front surface layer to the rear surface layer. The heat dissipation member is connected to the rear surface layer so as to thermally bond with the one or more heat dissipation vias.

A multiple layer printed circuit board including a plurality of layers, vertical interconnect accesses (VIAs), and a vertical interconnect access (VIA) bridge. The layers may include signal layers, prepreg substrate layers disposed between the signal layers, ground plane layers, wherein each of the ground plane layers abuts one of the prepreg substrate layers, inner signal layers, wherein each of the inner signal layers abuts one of the prepreg substrate layers, and a core substrate layer disposed between the signal layers, wherein two of the inner signal layers abut opposed sides of the core substrate layer. The VIAs extend through at least some of the layers, wherein each of the VIAs is formed by aligned apertures through adjoining ones of the prepreg substrate layers, ground plane layers, and inner signal layers. The VIA bridge is coupled to the VIAs to convey heat to a heat sink.

The present disclosure provides a light bar, a backlight assembly and a display device. The light bar includes a substrate; a first metal layer disposed on a first side of the substrate and comprising a plurality of first metal segments disposed at intervals along a length direction of the light bar; a second metal layer disposed on a second side opposite to the first side of the substrate and comprising a plurality of second metal segments disposed at intervals along the length direction of the light bar, a projection of the interval between two adjacent first metal segments on the substrate falls into projections of the second metal segments on the substrate, and a projection of the interval between two adjacent second metal segments on the substrate falls into projections of the first metal segments on the substrate.

A circuit board includes a first outer wiring layer, a circuit substrate, and a second outer wiring layer stacked. The circuit substrate includes a first inner wiring layer, an insulating layer, and a second inner wiring layer stacked. A plurality of thermally conductive pillars is arranged at intervals on the first inner wiring layer, a liquid storage space is formed between every two adjacent thermally conductive pillars, and a thermally conductive agent is received in the liquid storage space. The first outer wiring layer is formed on the plurality of thermally conductive pillars. The second outer wiring layer is formed the second inner wiring layer. A first groove penetrates the second outer wiring layer, the second inner wiring layer and the insulating layer, exposes a portion of the first inner wiring layer, and corresponds to the thermally conductive pillars. At least one heating element is installed in the first groove.

An integrated antenna assembly includes one or more antenna elements, one or more electronics components, and one or both of a static discharge element disposed between the antenna element(s) and the electronics component(s) and/or one or more thermal dissipators.

A method is provided for forming waveguides in a PCB. The method may include forming an opening in a PCB core comprising a plurality of conductive layers interleaved with a plurality of insulating layers, the opening extending from a first side of the PCB core to a second side of the PCB core. The method may also include filling the opening with metal. The method may also include forming a cavity enclosed by sidewalls by removing a first portion of the filled opening, the cavity extending from the first side of the PCB core to the second side of the PCB core. A second portion of the filled opening is a heat transfer element configured to transfer heat from the first side of the PCB core to the second side of the PCB core. The at least one waveguide is embedded within the heat transfer element and configured for transmitting signals from the first side to the second side.

A package structure includes a first dielectric layer, semiconductor device(s) attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein, the embedding material comprising one or more additional dielectric layers. Vias are formed through the first dielectric layer to the at least one semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on one or more outward facing surfaces thereof to provide a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicular to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit.

A high frequency module includes a module substrate that includes main surfaces facing each other, a power amplifier that is disposed on the main surface and capable of amplifying a transmission signal, an external connection terminal that is disposed on the main surface and set to a ground potential, and a via conductor that is formed inside the module substrate and connects the main surfaces. One end of the via conductor is bonded to a ground electrode of the power amplifier on the main surface, and the other end of the via conductor is bonded to an end surface of the external connection terminal on the main surface. An area Rb of an end surface that is opposite to the end surface of the external connection terminal is larger than an area of a cut surface that is in parallel to the main surface of the external connection terminal.

Described herein is a sensor device. The sensor device comprises a housing and a printed circuit board encased by the housing. The printed circuit board comprises an image sensor that captures image data, an image sensor processor that processes the image data, a serializer that converts one or more data channels associated with the image data into a single data channel, and one or more exposed surfaces. The one or more exposed surfaces dissipate heat generated by the image sensor, the image sensor processor, and the serializer from the printed circuit board to the housing.

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.