A ceramic substrate is provided, including: a board having a first surface and a second surface opposing the first surface; first electrical contact pads disposed on the first surface; second electrical contact pads disposed on the second surface; conductive pillars disposed in the board and connecting the first surface and the second surface to electrically connect the electrical contact pad and the second electrical contact pad; a first heat conductive pad disposed on the first surface; a second heat conductive pad disposed on the second surface; and a heat conductive pillar disposed in the board and connecting the first surface and the second surface to contact and be coupled with the first heat conductive pad and the second heat conductive pad, wherein the heat conductive pillar has a width greater than or equal to widths of the conductive pillars and greater than or equal to 300 micrometers.

A printed circuit board includes: a first insulating layer; a first circuit layer disposed on one surface of the first insulating layer and including a connection pad; a second insulating layer disposed on the one surface of the first insulating layer and embedding the first circuit layer; a via penetrating through the second insulating layer and connected to the first circuit layer; a metal post disposed on one surface of the second insulating layer and connected to the via; and a hole penetrating through the second insulating layer and exposing at least a portion of the connection pad of the first circuit layer. The metal post is spaced apart from the hole, and protrudes from the second insulating layer.

A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

Described herein is a sensor device. The sensor device comprises a housing and a printed circuit board encased by the housing. The printed circuit board comprises an image sensor that captures image data, an image sensor processor that processes the image data, a serializer that converts one or more data channels associated with the image data into a single data channel, and one or more exposed surfaces. The one or more exposed surfaces dissipate heat generated by the image sensor, the image sensor processor, and the serializer from the printed circuit board to the housing.

A camera device according to one embodiment of the present invention includes a printed circuit board, a heat radiation layer disposed on a first surface of the printed circuit board, and an image sensor disposed on the heat radiation layer, a plurality of through-holes passing through the printed circuit board from the first surface to a second surface which is a surface opposite to the first surface are formed in the printed circuit board, and the plurality of through-holes are in contact with the heat radiation layer.

A circuit board assembly includes a printed circuit board (PCB) substrate, a cooling assembly, an intermediate layer, one or more power devices, and a plurality of conductive layers arranged within the PCB substrate. The PCB substrate has a first surface and an opposite second surface that has a first electrical pattern. The cooling assembly is thermally coupled to the second surface of the PCB substrate. The intermediate layer is sandwiched between the PCB substrate and the cooling assembly. The one or more power devices are embedded within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices and thermally couple the one or more power devices to the cooling assembly. At least a portion of the intermediate layer has a second electrical pattern that is similarly patterned to the first electrical pattern of the second surface of the PCB substrate.

An optical communication module includes a module board housed in a casing, a VCSEL and a driving IC mounted on a mounting surface of the module board, a lens holder mounted on the mounting surface of the module board, a lens block held by the lens holder, a plurality of thermal vias passing through the module board, and a first fixing screw and a second fixing screw passing through the module board to be screwed into the casing so as to press a back surface of the module board against a bottom surface of the casing, and the first fixing screw and the second fixing screw are each arranged in a region between the plug connector and the lens holder and on either outer side of the lens holder.

A semiconductor device assembly (10) includes a multi-layer printed circuit board (PCB—40), a thermoelectric cooler (TEC—30), a chip (22), and packaged integrated circuitry (IC—26). The multi-layer PCB includes a lateral heat conducting path (60) formed in a recessed area (44) of the PCB. The TEC and the chip are disposed on the PCB, side-by-side to one another over the lateral heat conducting path. The TEC is configured to evacuate heat from the chip via the lateral heat conducting path, and to dissipate the evacuated heat via a first end of a heat sink (33) in thermal contact with the TEC. The packaged IC is disposed on an un-recessed area of the PCB, wherein the packaged IC is configured to dissipate heat via a second end of the heat sink that is in thermal contact with the packaged IC.

A package structure includes a first dielectric layer, semiconductor device(s) attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein, the embedding material comprising one or more additional dielectric layers. Vias are formed through the first dielectric layer to the at least one semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on one or more outward facing surfaces thereof to provide a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicular to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit.

A circuit substrate for carrying at least one light-emitting diode and a light-emitting structure for providing illumination are disclosed. The circuit substrate includes an insulation base layer, a conductive heat-dissipating layer, an insulation covering layer, a conductive circuit structure and a conductive through structure. The conductive heat-dissipating layer is disposed on the insulation base layer. The insulation covering layer is disposed on the conductive heat-dissipating layer. The conductive circuit structure includes a first electrode conductive layer and a second electrode conductive layer that are disposed on the insulation covering layer. The conductive through structure passes through the insulation covering layer and is connected between the conductive heat-dissipating layer and one of the first electrode conductive layer and the second electrode conductive layer. One of the first electrode conductive layer and the second electrode conductive layer is electrically connected to the conductive heat-dissipating layer through the conductive body.