An electronic device according to various embodiments of the present invention may comprise: a circuit substrate comprising a first layer including a first wire, a second wire formed at one side surface of the first wire along the first wire, and a third wire formed at the other side surface of the first wire along the first wire, a second layer including a ground plane formed along the first wire, the second wire, and the third wire and electrically connected to the second wire and the third wire, and an insulation layer disposed between the first layer and the second layer and having first permittivity; and a conductive member which is disposed above the first layer to have a dielectric-fillable interval space along the first wire and is electrically connected to the ground of the electronic device, the dielectric having second permittivity lower than the first permittivity.

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.

An electronic device includes a microphone module and a printed circuit board on which the microphone module is disposed. The printed circuit board includes a first layer having at least one first microphone pad coupled to the microphone module, a first ground spaced apart from the first microphone pad, and a second microphone pad coupled to the microphone module and connected to the first ground; and a second layer disposed under the first layer and having a second ground opposite to the first microphone pad and at least a part of the first ground.

A display device includes: a panel including a display region and a touch region; and a circuit board, and including a first conductive layer, a second conductive layer and a first insulating layer between the first conductive layer and the second conductive layer. The circuit board includes: a plurality of data lines electrically connected with a plurality of data signal lines; a plurality of touch lines electrically connected with a plurality of touch electrodes; and a first ground line disposed between at least two or more of the plurality of data lines and the plurality of touch lines. The first ground line includes a first part of the first conductive layer, a first part of the second conductive layer, and a first via passing through the first insulating layer and connecting the first part of the first conductive layer with the first part of the second conductive layer.

A connector port module and a method of manufacturing the same. The connector port module includes a circuit board, with a connector having a plurality of connector pads formed on the circuit board configured to electrically connect to a mating connector. At least one via hole is formed in the circuit board for reinforcing the physical integrity and the heat diffusivity of the circuit board. The connector port module is capable of supporting Universal Serial Bus (USB) (e.g. USB-C) and Thunderbolt 3 connectors. The method includes: providing a circuit board; forming a plurality of connector pads on the circuit board configured to electrically connect to a mating connector; and forming at least one via hole for reinforcing physical integrity of the circuit board.

Provided is a semiconductor package including a pair of differential signal wiring lines including a first differential signal wiring line and a second differential signal wiring line, extending parallel to and spaced apart from each other, a lower equal potential plate in a lower wiring layer under the signal wiring layer, an upper equal potential plate in an upper wiring layer above the signal wiring layer, and a wiring insulating layer adjacent to the pair of differential signal wiring lines, the lower equal potential plate, and the upper equal potential plate, the wiring insulating layer filling spaces between the signal wiring layer, the lower wiring layer, and the upper wiring layer, at least one of the lower equal potential plate and the upper equal potential plate including an impedance opening overlapping the pair of differential signal wiring lines in a vertical direction and is filled by the wiring insulating layer.

Printed circuit boards for a base station antenna include a substrate layer, and a first conductive trace and a second conductive trace which are printed on the substrate layer and cross each other. The first conductive trace has two trace sections separated by the second conductive trace. Adjacent ends of the two trace sections separated by the second conductive trace are connected electrically by a jumper. The jumper has an electrical conductor, is isolated electrically from the second conductive trace and is fixed on the printed circuit board. The electrical conductor and the two trace sections are connected electrically at adjacent ends. The printed circuit board allows flexible wiring of the conductive traces on the printed circuit board.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

A flexible circuit board for transmitting a signal in a frequency band includes an intermediate region in which a signal line is disposed as a transmission line for transmitting the signal in the frequency band, and a pad region extending from the intermediate region and disposed at one end or both ends of the flexible circuit board, a pad electrically connected to the signal line and formed to face a first direction of the flexible circuit board, and a ground pattern overlapping at least a portion of the pad and formed to face a second direction of the flexible circuit board and disposed in the pad region where the second direction is opposite to the first direction.

A rigid flexible printed circuit board (RFPCB) may include: a first base conductive layer; a first rigid conductive layer spaced apart from the first base conductive layer in a first direction; a second rigid conductive layer spaced apart from the first base conductive layer in the first direction and spaced apart from the first rigid conductive layer in a second direction intersecting the first direction; a base cover layer spaced apart from the first base conductive layer in the first direction and positioned closer to the first base conductive layer than to the first rigid conductive layer and the second rigid conductive layer; a transmission line positioned between the first base conductive layer and the base cover layer; and a dummy metal layer disposed on the base cover layer, positioned between the first rigid conductive layer and the second rigid conductive layer, and overlapping the transmission line in the first direction.