A printed circuit board and a terminal are provided. The printed circuit board includes a feedpoint arrangement region, a ground point arrangement region, and a ground region. The ground region is adjacent to and connected to the ground point arrangement region and is configured to be a ground plate of the antenna. A radiation reduction structure is arranged in the ground region and defines an opening. Therefore, an edge of the printed circuit board is disrupted by the opening.

Electronic device includes a housing; an antenna module accommodated in the housing, the antenna module including a PCB including a first side and a second side opposite to the first side; one or more antenna elements disposed at the first side of the PCB; and a wireless communication circuit disposed at the second side of the PCB and configured to transmit and/or receive a radio signal through an antenna element of the one or more antenna elements; and a conductive member accommodated in the housing and including a supporting portion and a connecting portion extended from the supporting portion and connected to the conductive portion of the housing, the supporting portion configured to support the antenna module such that the first side of the PCB faces in a direction toward the lateral surface of the electronic device, and the connecting portion including a hole through which a fastening member is disposed to fasten the conductive member to the conductive portion of the housing. Heat generated by the antenna module is transferred to the conductive portion of the housing.

Embodiments described herein may be related to apparatuses, processes, and techniques directed to bridges having a glass core, where the bridges may include one or more thick traces and one or more thin traces, where the thin traces are layered closer to a surface of the glass core, and the thick traces are layered further away from the glass core. During operation, the thin traces may be used to transmit signals between the coupled dies, and the thick traces may be used to transmit power between the coupled dies. During manufacture, the rigidity and highly planner surface of the glass core may enable thinner traces closer to the surface of the glass core to be placed with greater precision resulting in increased overall quality and robustness of transmitted signals. Other embodiments may be described and/or claimed.

A printed circuit board includes an insulating layer; a recess portion disposed on one surface of the insulating layer; and a circuit layer disposed on the one surface of the insulating layer and including a signal pattern and a ground pattern. At least a portion of the ground pattern covers at least a portion of the recess portion.

A printed circuit board includes a reference plane embedded in a substrate and adjacent to the top surface of the substrate. The printed circuit board also includes a first signal net and a second signal net being in close proximity to each other and disposed within a specific region on the top surface of the substrate. An outermost insulating layer on the top surface of the substrate covers the substrate, the first signal net and the second signal net, and includes an opening to expose a portion of the second signal net. A conductive layer is disposed in the opening and on the outermost insulating layer corresponding to the specific region, such that the conductive layer overlaps with the first signal net. A fifth signal net is embedded in the substrate and between the reference plane and the outermost insulating layer.

A first conductive pattern (13) is provided on an upper surface of the submount (7). A GND pattern (9) is provided on a lower surface of the submount (7). A lower surface electrode (21) of a capacitor (3) is bonded to the first conductive pattern (13) with solder (22). An upper surface electrode (23) of the capacitor (3) is connected to a light emitting device (2). A terminating resistor (4) is connected to the first conductive pattern (13). The first conductive pattern (13) has a protruding portion (25) which protrudes outside from the capacitor (3) in planar view. A width of the protruding portion (25) is narrower than a width of the capacitor (3).

Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.

An electronic apparatus includes a printed board and an electroconductive shield member disposed such as to cover a shield area which is a part of a front surface of the printed board. A wiring connecting an inside and an outside of the shield area is disposed on the front surface of the printed board. The shield member has an opening that connects an inside and an outside of the shield member, at a position where the wiring passes through an outer edge of the shield area, and that extends in an extending direction of the wiring. The opening is electrically connected to a conductor disposed on an opposite side of the wiring from the opening, and the opening and the conductor form a waveguide surrounding the wiring.

An electronic component module includes a first module including a sealing portion disposed on a first surface of a first board and a shielding layer disposed on a surface of the sealing portion, a second module spaced apart from the first module, a connection board having greater flexibility than the first board and connecting the first module to the second module, and a first ground line electrically connected to a ground layer of the first board and disposed on a surface of the connection board, and at least a portion of the shielding layer is electrically connected to the ground layer of the first board.

An electrical connector includes an insulating housing, at least one flexible printed circuit board mounted in the insulating housing, at least one location block disposed to a middle of an outer surface of the at least one flexible printed circuit board, at least one elastic structure disposed on an outer surface of the at least one location block, and a shell. The at least one flexible printed circuit board includes an outer ground layer, a signal layer and an inner ground layer. The signal layer has a plurality of traces. Each trace has a main portion, at least one contact portion and a soldering portion. The shell surrounds the insulating housing, the at least one flexible printed circuit board, the at least one location block and the at least one elastic structure.