The device may include a core. The device may include built-up layers arranged over the core. The device may also include a ground path disposed in a first built-up layer of the built-up layers. The device may also include a power path disposed in a second built-up layer of the built-up layers. The device may also include a multi-terminal capacitor on a top layer of the built-up layers. The multi-terminal capacitor may be coupled to the ground path and the power path through respective vias passing through the built-up layers. The respective vias may be arranged to alternate such that respective vias coupled to the power path neighbor a respective via coupled to the ground path.

A network of Intermediate Device Structure (IDS) members communicatively coupled, mounted to elevated structure/s within urban settings, each configured to operate by a processor/controller with resident code, and in real time receive sensed environmental inputs from each IDS' vicinity, remote data/instruction/s processing the inputs with resident code parameters generating outputs that are configured to mitigate/avert intermittent environmental events harmful/hazardous to humans.

In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

A filter device includes: a multilayer board including a first dielectric layer, a first wiring layer including a reference electrode to which a reference potential is supplied, and a second dielectric layer positioned between the first dielectric layer and the first wiring layer and having a thickness different from a thickness of the first dielectric layer; a series passive element provided on a series wire electrically connecting a first terminal and a second terminal together; a first parallel wire electrically connecting the series wire and the reference electrode together; and a first parallel passive element provided on the first parallel wire. The first parallel wire includes: a first via penetrating through the first dielectric layer and electrically connected to the first parallel passive element; and a second via penetrating through the second dielectric layer and electrically connecting the first via and the reference electrode together.

A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.

Micro-scale planar-coil transformers including one or more shields are disclosed. The one or more shields can block most common-mode current from crossing from one side to another side of a transformer. Reduction of common-mode current crossing the transformer results in reduction of dipole radiation, which is the main component of electromagnetic interference (EMI) in some transformers.

Disclosed herein are dual-spiral common-mode filters, printed circuit boards (PCBs) comprising such dual-spiral common-mode filters, and devices comprising such dual-spiral common-mode filters and PCBs. A dual-spiral common-mode filter is patterned into the reference plane of a PCB. The dual-spiral common-mode filter comprises a first spiral portion connected to a second spiral portion. The spiral portions may be substantially identical, or mirror images of each other, or different from each other. One or more signal traces in a signal trace layer of the PCB pass over the dual-spiral common-mode filter. The disclosed dual-spiral common-mode filters can replace both conventional patterned ground structure (PGS) filters used for radio-frequency interference mitigation and the cutouts often used in the reference plane of a PCB to mitigate impedance mismatches due to DC blocking capacitors. Also disclosed herein are methods of making PCBs that include dual-spiral common-mode filters.

A filter element is mounted on a module substrate. The filter element includes a ground terminal and a pair of signal terminals. The module substrate includes a ground plane, a ground land, and an inductance adjusting line that connects the ground land to the ground plane. The ground terminal of the filter element is connected to the ground land of the module substrate. The inductance adjusting line includes an in-plane extending portion that extends in an in-plane direction of the module substrate.

A circuit including a die and an integrated passive device. The die includes a first substrate and at least one active device. The integrated passive device includes a first layer, a second substrate, a second layer and an inductance. The inductance includes vias, where the vias are implemented in the second substrate. The inductance is implemented on the first layer, the second substrate, and the second layer. A resistivity per unit area of the second substrate is greater than a resistivity per unit area of the first substrate. The third layer is disposed between the die and the integrated passive device. The third layer includes pillars, where the pillars respectively connect ends of the inductance to the at least one active device. The die, the integrated passive device and the third layer are disposed relative to each other to form a stack.

A filter module includes a circuit board on or in which a ground electrode is provided, and a low pass filter on the circuit board. The low pass filter includes first and second inductors, and a capacitor. The first and second inductors are cumulatively connected to each other. Relationships of Lp+Lg−M≥0 and Lp−M<0 are satisfied, where Lp denotes an inductance of a path between a connection portion between the first and second inductors and a ground terminal, Lg denotes an inductance of a path between the ground terminal and the ground electrode, and M denotes a mutual inductance between the first and second inductors.