Electronic parts for improving an isolation distance are provided. The electronic part includes: at least one plate; and first and second terminals each connected to the plate, wherein the electronic part is mounted in a PCB through the first and second terminals and a creepage distance between the first terminal and the second terminal is greater than a clearance distance between the first terminal and the second terminal.

An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed. An inductor on an integrated passive device can configured and arranged such that it is magnetically coupled to an inductor on a structure such as a processor chip or a system on a chip.

Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.

In a printed circuit board (1) comprising a plurality of insulating layers and conductive layers, and comprising at least one cavity (7) at least one electromagnetic coil (8) is arranged on an outer layer (4) of the printed circuit board (1) and cooperates with a permanent magnet (6) arranged inside the at least one cavity (7).

A band stop filter can include a circuit board having a first surface and an opposing second surface. The circuit board can have a transmission line on the first surface. The band stop filter can include a dielectric cavity resonator physically coupled to the second surface of the circuit board. The dielectric cavity resonator can have a coupling aperture configured to magnetically couple the dielectric cavity resonator to the transmission line, and to cause excitation of the dielectric cavity resonator in a second order transverse electric (TE) mode.

A power supply converter and a method for manufacturing the same are provided. The power supply converter includes an inductance component and a power component, wherein the inductance component includes: a first magnetic substrate, provided with a first via, the first magnetic substrate including a first surface and a second surface, and a first pin being provided on the first surface; a second magnetic substrate, provided with a second via, and having a second surface provided with a second pin; an inductance coil, provided between the first surface and the second surface and having a first end and a second end formed at the vias and connected to the first and second pin, respectively; and a filling part, at least partly filling the vias, wherein the power component and the inductance component are stacked, are in contact and are coupled to each other.

A chip includes a plurality of ground conductors that at least partially surround a signal conductor on a same die. The signal conductor carries an interface (e.g., high speed) signal, and the ground conductors filter electromagnetic interference generated by the signal carried by the signal conductor. A chip package includes a plurality of ground pins around a signal pin that carries an interface signal. The ground pins filter electromagnetic interference generated by the signal carried by the signal pin. A printed circuit board includes a plurality of ground conductors around a signal line. The ground conductors are in vias and filter electromagnetic interference generated by an interface signal carried by the signal line.

On a circuit board configured to transmit a signal, a pulse transformer is provided on a path used for transmitting the signal of the circuit board. A shield member is provided on the circuit board to prevent noise, which is generated due to noise current flowing in a noise line pattern, from entering the pulse transformer. The shield member covers a part of a surface of at least one pulse transformer, the part intersecting concentric circles (which represent a magnetic field generated by the noise current) whose central axis extends along the direction in which the noise current flows.

A first conductive pattern made from a conductive material is formed on a first surface that is one surface of a flexible film made from a dielectric material. An adhesive layer is disposed on a second surface opposite to the first surface of the flexible film. A pair of first outer electrodes generates an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer, and causes an electric current to flow through the first conductive pattern.

An advantageous effect of a low-pass filter that reduces high-frequency noise can be obtained by including an input terminal that extends from a front surface to a rear surface of a multilayer circuit board including a double-sided circuit board; a first wiring conductor having an end connected to the input terminal on the rear surface of the multilayer circuit board; a first via that extends from an other end of the first wiring conductor to the front surface of the multilayer circuit board; a second wiring conductor having an end connected to the first via on the front surface of the multilayer circuit board; and a first input capacitor disposed on the second wiring conductor; by being conductive due to the input terminal and the first via being configured in series; and including the first input capacitor.