An image sensor package, according to one embodiment of the present invention, comprises: a printed circuit board; an image sensor disposed on the printed circuit board; a first support part disposed on the image sensor; a filter layer disposed on the image sensor; a second support part disposed on the printed circuit board, to the side of the image sensor; a wire part which is disposed between the first support part and the second support part, and of which one end is connected to the image sensor and the other end is connected to the printed circuit board; and a molding member filling the gap between the first support part and the second support part.

A multilayer circuit board having a signal and power isolation circuit, which can suppress the capacitive coupling between a chip inductor and a ground layer below the chip inductor and also suppress the characteristic impedance change occurring in a mounting pad on a microstrip line. Portions of the inner-layer ground below both the mounting pad on the microstrip line and the chip inductors connected to the mounting pad are separately removed respectively as the signal transmission characteristic compensation removal portion, which is formed by removing a portion having a predetermined area and situated immediately below the mounting pad, and the inductor characteristic compensation removal portion, which is formed by removing a mounting-surface-below portion having a predetermined area and situated immediately below the chip inductors. The signal transmission characteristic compensation removal portion and the inductor characteristic compensation removal portion are electrically isolated from each other with the predetermined distance therebetween.

In some aspects, a flexible cable may comprise: a flexible strip with first and second parallel surfaces and first and second ends, said flexible strip being electrically insulating; a metal stripline within said flexible strip; first and second metallic grounding planes on said first and second surfaces, respectively; and a first circuit board mechanically attached to at least one of said first end of said flexible strip and said first and second metallic grounding planes at said first end, said first circuit board being mechanically stiff, said metal stripline being electrically connected to electrical circuitry on said first circuit board.

An electric pump is provided. The electric pump includes a PCB board, where the PCB board is formed with a power input port. The electric pump further includes a common mode filter, where the common-mode filter includes a common mode inductor, and the common mode inductor is arranged close to the power input port; and in a direction perpendicular to a plane on which the PCB is located, no wiring is provided at the common mode inductor corresponding to a wiring film layer in the PCB.

According to one embodiment of the disclosure, an electronic device comprises: a printed circuit board including a conductive pattern; and a tuner mounted on the conductive pattern and electrically connected to the conductive pattern, wherein the tuner comprises: a ground; a first conductive pad; a first switching element electrically connected between the ground and the first conductive pad; and a second conductive pad electrically disconnected with the ground, wherein the conductive pattern may comprise: a first electrical path in electrical contact with the first conductive pad; and a second electrical path in electrical contact with the second conductive pad and electrically shorted to the first electrical path. Various other embodiments are possible.

A selected reject band non-RF-coupling tile includes a ground plate disposed on a first side of a printed circuit board. The selected reject band non-RF-coupling tile also includes a planar inductor disposed on a second side of the printed circuit board. The selected reject band non-RF-coupling tile also includes a conductive via structure extending through the printed circuit board. The conductive via structure electrically connects to both the ground plate and the planar inductor at a location near an interior end of the planar inductor. The selected reject band non-RF-coupling tile is used to shield enclosure walls and/or other electrical circuitry from RF fields. The selected reject band non-RF-coupling tile is also used to encapsulate an RF carrying component to block RF fields that emanate from the RF carrying component.

A flexible printed circuit board includes: an electrically insulating substrate layer; an electrically conductive pattern stacked on at least one surface of the substrate layer; and a cover layer that is disposed on a stack including the substrate layer and the electrically conductive pattern and covers a surface of the stack, which surface is on the side on which the electrically conductive pattern is present. The electrically conductive pattern has a coil region including a coil. In the substrate layer or the cover layer, a high-magnetic permeability member is present in at least a region that overlaps the coil region in plan view.

A ceramic composition according to an embodiment of the present invention contains: a main phase component represented by CaMgSi.sub.2O.sub.6 or Ba.sub.4(Re.sub.(1-x), Bi.sub.x).sub.9.33Ti.sub.18O.sub.54; and an additive component containing a Li component and a B component, An observation field, a part of a sectional surface of the ceramic composition, is divided into a plurality of unit observation regions. Among all the unit observation regions, those containing no or little sintering agent component are referred to as the main crystal regions. An area percentage of main crystal regions relative to the observation field is 30% or more, the main crystal regions being the unit observation regions containing 0.5% or less by area of the additive component.

An apparatus for a shielding structure for surface-mount components and filters to increase the signal isolation from input signal port to output signal port. An LTCC filter device with an increased rejection of undesired frequencies in a stopband and minimal distortion or loss of desired signals in a passband.

A filter module for reducing differential and common mode electrical noise may include at least a first electrically conductive busbar and a second electrically conductive busbar spaced apart from the first busbar, an at least partially electrically conductive housing at least partially enclosing the first busbar and the second busbar, at least a first common mode choke and a second common mode choke arranged in the housing and spaced apart from each other, at least a first bypass capacitor electrically connected to the first busbar and the second bus bar, at least a second bypass capacitor electrically connected to the first busbar and a midpoint, and at least a third bypass capacitor electrically connected to the second busbar and the midpoint.