A coaxial line is provided which includes: a first columnar conductor disposed inside a multilayer substrate such that one end thereof is coupled to a first stripline and that the other end thereof is coupled to a second stripline; and one or more second columnar conductors penetrating the multilayer substrate such that one end thereof is coupled to a ground layer and that the other end thereof is coupled to a ground layer, the first columnar conductor acting as an inner conductor, and the second columnar conductors acting as outer conductors. Each of the first and second striplines is coupled to an open stub acting as resonators and a matching conductor acting as capacitance matching elements.

A circuit substrate includes a multi-layer substrate in which a plurality of dielectric layers are stacked, and a millimeter wave absorber provided inside the multi-layer substrate and having an electromagnetic wave absorption peak within a region of 30 to 300 GHz. An antenna element includes the circuit substrate described above, a power feeder provided inside the multi-layer substrate of the circuit substrate, and an antenna provided on a surface of the circuit substrate and connected to the power feeder. A method for reducing noise in a circuit substrate including a multi-layer substrate includes, by a millimeter wave absorber provided inside the multi-layer substrate and having an electromagnetic wave absorption peak within a region of 30 to 300 GHz, absorbing unnecessary electromagnetic waves diffused in the multi-layer substrate to reduce noise in the circuit substrate.

A package that includes a power amplifier and a substrate coupled to the power amplifier. The substrate includes an encapsulation layer, a capacitor device located in the encapsulation layer, an inductor located in the encapsulation layer, at least one first dielectric layer coupled to a first surface of the encapsulation layer, and a plurality of first interconnects coupled to the first surface of the encapsulation layer. The plurality of first interconnects is located at least in the at least one first dielectric layer. The plurality of first interconnects is coupled to the capacitor device and the inductor. The inductor and the capacitor device are configured to be electrically coupled together to operate as elements of a matching network for the power amplifier. The capacitor device is configured to be coupled to ground.

This application relates to an independent active electromagnetic interference filter module. In one aspect, the filter module includes a first element group including a noise sensing unit provided to sense electromagnetic noise, and a second element group including a compensating unit provided to generate a compensation signal for the electromagnetic noise. The first group and the second group may be respectively mounted on different substrates. According to some embodiments, the filter module can reduce a volume of each element constituting an electromagnetic interference filter module, implement a single modularization of a compact structure. The filter module can also improve electromagnetic interference noise reduction performance and a manufacturing method thereof.

An adaptive DC-DC boost converter arrangement and an electronic circuit including such an arrangement are provided. The arrangement includes a circuit board with a plurality of electronic components mounted thereon, implementing an adaptive DC-DC boost converter circuit and a boost decoupling capacitor. The adaptive DC-DC boost converter circuit comprises a DC-DC boost converter having a converter set value input, a boost supply input, and a boost voltage output, and an adaptive DC-DC boost control unit having a control input and a control output. An acoustical noise suppression filter is present having a filter input connected to the control output of the adaptive DC-DC boost control unit and a filter output connected to the converter set value input of the DC-DC boost converter.

A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include a plurality of layers that include a plurality of signal layers, a plurality of ground plane layers, a plurality of inner signal layers, and a single core substrate layer. Each layer in the plurality of layers may be separated from every other layer in the plurality of layers by at least one prepreg substrate layer.

Design and packaging of wide bandgap (WBG) power electronic power stages are disclosed herein. An example apparatus includes a first printed circuit board (PCB) including: a first voltage phase circuit cluster; a second voltage phase circuit cluster; and a cluster of traces, the cluster of traces routed substantially perpendicular to the second voltage phase circuit cluster; a second PCB positioned below the first PCB; and a connector to connect the first PCB to the second PCB, the connector electrically coupled to the first voltage phase circuit cluster by the cluster of traces.

In an embodiment a bus bar includes a first interface and a second interface, a filter element electrically connected between the first and the second interface and a first rail between the first interface and the second interface, wherein the first rail includes a central section with a metal sheet and a dielectric material at least partially covering the central section.

A circuit module includes a wiring board, first and second lines, a first inductor, and a sheet-like first conductor. The first line is on the wiring board, for transmitting a signal to a first circuit, outside the wiring board, and a power supply voltage for supplying power to the first circuit. The second line is on the wiring board side by side with the first line, for transmitting a signal to a second circuit and a power supply voltage for supplying power to the second circuit, which is outside the wiring board independently of the first circuit. The first inductor is on the wiring board, having one end connected to the first line, and another end connected to a power supply circuit for supplying the power. The sheet-like first conductor is on or near at least part of a side surface of a housing that holds the first inductor.

In a circuit board, a printed board includes an insulating base and a plurality of conductors disposed in layers in the insulating base. The conductors include a signal line electrically connected to an electronic component; and a potential fixed layer fixed to a predetermined potential and arranged to face the signal line across the insulating base in a thickness direction of the printed board. The potential fixed layer has a facing surface facing the signal line, and is provided with a high magnetic film having a magnetic permeability higher than that of the at least one potential fixed layer on the facing surface. The high magnetic film is disposed to overlap the signal line in the thickness direction. The signal line includes a facing line that faces the high magnetic film across the insulating base in the thickness direction.