A high-frequency module includes: a chassis which is made of a conductor and which has an internal space; a high-frequency circuit board which is housed in the internal space of the chassis; and a resistive element provided between an inner wall that opposes the high-frequency circuit board among inner walls of the chassis which define the internal space and the high-frequency circuit board.

A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted. The first passive component may be an inductor, a capacitor or a resistor. The first passive component is operable as a heat sink, a heat shield, an electromagnetic shield, or as a tuning inductor.

An integrated circuit chip includes a core circuit, a first bond pad, a first switch circuit, a second configuration resistor, a control circuit, and a storage unit. The first bonding pad is coupled to a first external reference voltage through a first node, and the first node is coupled to the first external reference voltage through a bonding wire or a first configuration resistor. The first switch circuit is coupled between a first internal reference voltage and the first node. The second configuration resistor is coupled between the first internal reference voltage and the first switch circuit or between the first switch circuit and the first node. In a first mode, the control circuit turns on the first switch circuit, and writes a configuration state of the first bonding pad to the storage unit. In a second mode, the control circuit turns off the first switch circuit.

A wideband termination circuit layout is provided for high power applications. The circuit layout may include a dielectric layer having a first surface and a second surface. The circuit layout may also include an input port disposed over the first surface. The circuit layout may further include at least two resistive film patches disposed over the first surface of the dielectric layer and a tuning line between the at least two resistive films disposed over the first surface of the dielectric layer. The at least two resistive film patches are connected in series with the at least one tuning line.

An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.

A printed circuit board has: a first wiring pattern laid in a first layer such that, when a predetermined component is mounted in a predetermined mounting region, a first current path in an open ring shape leading from a first end to a second end is formed; a second wiring pattern laid in a second layer different from the first layer such that a second current path in an open ring shape leading from a third end to a fourth end is formed; a first conductive member formed between the second and third ends; and a second conductive member formed between the first and fourth ends. The first and second wiring patterns are so laid that, as seen in their respective plan views, the directions of the currents flowing across the first and second current paths, respectively, are opposite to each other.

For example, an apparatus may include a Printed Circuit Board (PCB); a Multiple-Input-Multiple-Output (MIMO) radar antenna on the PCB, the MIMO radar antenna comprising a plurality of Transmit (Tx) antenna elements configured to transmit Tx radar signals, and a plurality of receive (Rx) antenna elements configured to receive Rx radar signals based on the Tx radar signals; and a surface wave mitigator connected to the PCB, the surface wave mitigator configured to mitigate an impact of surface waves via the PCB on a radiation pattern of the MIMO radar antenna.

A printed circuit board has: a first wiring pattern laid in a first layer such that, when a predetermined component is mounted in a predetermined mounting region, a first current path in an open ring shape leading from a first end to a second end is formed; a second wiring pattern laid in a second layer different from the first layer such that a second current path in an open ring shape leading from a third end to a fourth end is formed; a first conductive member formed between the second and third ends; and a second conductive member formed between the first and fourth ends. The first and second wiring patterns are so laid that, as seen in their respective plan views, the directions of the currents flowing across the first and second current paths, respectively, are opposite to each other.

A differential trace structure reducing the magnitude of low frequency attenuation is disclosed. The trace structure is formed on a printed circuit board. A pair of differential traces connects a signal receiver and a signal transmitter. A passive equalizer has a first shunt coupled to one of the pair of differential traces; and a second shunt coupled to the other one of the pair of differential traces. The passive equalizer has an inductor and a resistor coupled in series to the shunts. For low frequency signals, the passive equalizer behaves as a shunt resistance to the pair of differential traces.

A memory layout is provided. The layout comprises a circuit board, a plurality of memories, a processing unit, and a reflection absorption unit. The circuit board has a first surface and a second surface. The first surface is set with a first wire unit and a second wire unit corresponding to each other. The memories are separately set on the first and second surfaces of the circuit board and connect to the first and second wire units. The processing unit connects to the first wire unit. The reflection absorption unit connects to the second wire unit. Thus, not only the capacity of the memories is increased, but also, during operating the memories, related reflection signals are absorbed by the reflection absorption unit for stably operating the memories with operation velocity enhanced as well.