A semiconductor device includes an input/output circuit to which a signal is input or from which a signal is output; a first terminal connected to a power line of the input/output circuit; a second terminal connected to the power line; a resistance element connected between the second terminal and the power line; and a first capacitance element connected between the second terminal and a ground terminal. The semiconductor device can suppress a resonance phenomena and Volt age variation caused by impedance of the power line.

Disclosed is a technology that enables an elastic composite filter to have a capacitor to remove noise. The elastic composite includes a functional material layer; electrode patterns disposed on top and bottom surfaces of the material layer, respectively; and a conductive elastic member adhered onto the top electrode pattern, wherein the elastic member is coupled electrically and mechanically to the top electrode pattern to be used as an electrode, and the elastic member is in direct contact with a conductive object to provide elasticity.

A multiple-layer circuit board has a signaling layer, an exterior layer, and a ground layer. A pair of differential signal lines implemented as strip lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. An element conductively extends inwards from the exterior layer. A void of a defected ground structure within the ground layer has a size, shape, and a location in relation to the element to suppress the EMI propagated by the strip lines. A resistive material of the defected ground structure along a perimeter of the void improves suppression of the EMI propagated by the strip lines, via the resistive material absorbing the EMI.

An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.

A device, in particular a pre-assembled transmission cable, is used to transmit differential data signals in a high-speed data connection. The device contains a circuit board with a conductor pair with two signal conductors for transmitting the differential data signal. An output line which is insulated from the conductor pair is paired with the conductor pair, the output line running parallel to the signal conductors in a non-interrupted manner and additionally being connected to a measuring conductor via at least one damping element. By virtue of the configuration, an undesired common-mode signal component is at least partly coupled into the output line, where the signal component is absorbed during operation.

A semiconductor integrated circuit device includes a component built-in board in which at least a first core layer on which a first electronic component is mounted, a second core layer on which a second electronic component is mounted, an adhesive layer arranged between the first core layer and the second core layer, and wiring layers are stacked; a third electronic component mounted in a first core layer side of the component built-in board and electrically connected to the at least one of the first and second electronic components through the wiring layers; and an external connection terminal formed in a second core layer side of the component built-in board and electrically connected to at least one of the first and second electronic components.

According to one embodiment, a semiconductor device includes an input/output circuit to which a signal is input or from which a signal is output; a first terminal connected to a power line of the input/output circuit; a second terminal connected to the power line; a resistance element connected between the second terminal and the power line; and a first capacitance element connected between the second terminal and a ground terminal.

A printed circuit board has: a first wiring pattern laid in a first layer such that, when a predetermined component is mounted in a predetermined mounting region, a first current path in an open ring shape leading from a first end to a second end is formed; a second wiring pattern laid in a second layer different from the first layer such that a second current path in an open ring shape leading from a third end to a fourth end is formed; a first conductive member formed between the second and third ends; and a second conductive member formed between the first and fourth ends. The first and second wiring patterns are so laid that, as seen in their respective plan views, the directions of the currents flowing across the first and second current paths, respectively, are opposite to each other.

Discussed generally herein are methods and devices for altering an effective series resistance (ESR) of a component. A device can include a substrate including electrical connection circuitry therein, a first via hole through a first surface of the substrate and contiguous with the electrical connection circuitry, a first conductive polymer with a resistance greater than a resistance of the electrical connection circuitry filling the first via hole, and a component electrically coupled to the first conductive polymer.

An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.