A high-frequency board includes an insulating substrate, a first line conductor, and a second line conductor. The insulating substrate has an upper surface with a recess. The first line conductor is located on the upper surface of the insulating substrate. The second line conductor is located on the upper surface of the insulating substrate and extends parallel to the first line conductor with a space from the first line conductor as viewed from above. The recess is located between the first line conductor and the second line conductor, and has a lower dielectric constant than the insulating substrate.

A filter element is mounted on a module substrate. The filter element includes a ground terminal and a pair of signal terminals. The module substrate includes a ground plane, a ground land, and an inductance adjusting line that connects the ground land to the ground plane. The ground terminal of the filter element is connected to the ground land of the module substrate. The inductance adjusting line includes an in-plane extending portion that extends in an in-plane direction of the module substrate.

A communication apparatus includes a signal line that connects an antenna and a wireless communication module to each other, the signal line having a portion where the signal line is divided in part into sections, with an adjacent portion adjacent to the divided portion of the signal line being greater in line width than a main body portion of the signal line; a first ground pattern disposed to face the main body portion; and a second ground pattern disposed to face the adjacent portion. The distance from the adjacent portion to the second ground pattern is longer than the distance from the main body portion to the first ground pattern. The antenna and the wireless communication module are connected to each other through the signal line and a solder adhered to the adjacent portion.

A multilayer substrate includes a dielectric substrate, a pair of capacitor electrodes, and an input/output electrode that is an electrode for input, an electrode for output, or an electrode for input and output. The dielectric substrate has a first main surface and a second main surface that are opposite to each other in a thickness direction of the dielectric substrate. The pair of capacitor electrodes is disposed in the dielectric substrate. Electrodes of the pair of capacitor electrodes face each other in the thickness direction. The input/output electrode is disposed on the second main surface of the dielectric substrate. A capacitor that includes the pair of capacitor electrodes and a portion being part of the dielectric substrate and located between the electrodes of the pair of capacitor electrodes at least partially overlaps the input/output electrode electrically connected to the capacitor.

An electronic device according to various embodiments may comprise: a housing; an antenna structure positioned in the housing; and a wireless communication circuit. The antenna structure may comprise: a first conductive layer comprising a first opening; a second conductive layer positioned in parallel with the first conductive layer, the second conductive layer comprising a second opening which at least partially overlaps with the first opening when the first conductive layer is seen from above; a third conductive layer positioned in parallel with the first conductive layer and interposed between the first conductive layer and the second conductive layer; a first insulating layer interposed between the first conductive layer and the third conductive layer; a second insulating layer interposed between the second conductive layer and the third conductive layer; a first conductive plate in the first opening, which is electrically separated from the first conductive layer; a second conductive plate in the second opening, which is electrically separated from the second conductive layer; a first conductive via electrically connected between the first conductive plate and the third conductive layer through the first insulating layer; and a second conductive via electrically connected between the second conductive plate and the third conductive layer through the second insulating layer. The wireless communication circuit may be configured to transmit or receive a signal having a frequency between 3 giga hertz (GHz) and 100 GHz and may be electrically connected to the antenna structure. Various embodiments may be possible.

A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

A circuit board has an edge connector with signal traces. The signal traces are formed on a dielectric layer of the circuit board. A reference trace is formed within the dielectric layer or on another surface of the dielectric layer. Parameters of the reference trace are adjusted to set an impedance of a single-ended signal trace or a differential impedance of two adjacent signal traces.

A circuit board is a circuit board on which a predetermined circuit unit that causes heat and electromagnetic noise is disposed, and which is to be fixed to a conductive housing with a conductive screw. The circuit board includes: an insulator layer including an insulating plate-shaped base material; a conductor layer having a circuit pattern including a ground portion, which is disposed on at least one surface of the insulator layer; and a screw insertion hole that penetrates the insulator layer and the ground portion, and through which the conductive screw is to be inserted. The ground portion has a slit disposed between the screw insertion hole and the predetermined circuit unit. The ground portion has a ground bridge that electrically connects a portion of the ground portion between the slit and the screw insertion hole and a portion of the ground portion between the slit and the predetermined circuit unit.

A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.