Provided is a display device including: a display panel in which a display area and a non-display area located around the display area are defined; an external device which is disposed on the non-display area of the display panel; and a cover member which is disposed on the external device, wherein the external device includes a driving chip and a printed circuit film which is disposed on the non-display area of the display panel and spaced apart from the display area with the driving chip interposed between the printed circuit film and the display area in plan view, and the cover member includes a first insulating tape disposed on the external device, a first conductive tape disposed on the first insulating tape and a second insulating tape disposed on the first conductive tape, wherein the second insulating tape includes an electrostatic induction opening penetrating the second insulating tape in a thickness direction, a planar size of the first conductive tape is greater than a planar size of the second insulating tape, the first conductive tape protrudes further toward the display area than the second insulating tape in plan view, and the electrostatic induction opening is disposed on a part of the first conductive tape which protrudes further toward the display area than the second insulating tape.

Aspects of the present disclosure provide miniaturized isolator modules capable of transferring power and/or data signals across an isolation barrier by way of a transformer while maintaining intrinsic safety (IS) compliance. For example, the isolator modules may provide power from a non-IS side to an IS side of the isolation barrier while protecting the IS side in the event of an overvoltage and/or overcurrent event on the non-IS side. In some aspects, an isolator module includes one or more silicon protection devices, which facilitate the miniaturization of the isolator module while maintaining protection against overvoltage and/or overcurrent events in accordance with IS standards. In some aspects, an isolator module includes a transformer adapted for IS compliance. For example, coils of the transformer may be disposed on opposing sides of an isolation barrier having a thickness of at least 200 microns. Some aspects provide silicon protection devices formed on a single semiconductor die for use with miniaturized isolator modules to provide overvoltage and/or overcurrent protection for IS compliance. Miniaturized isolator modules and protection devices described herein may be used either alone or in combination, in IS or non-IS environments.

A light-emitting diode display is provided. The light-emitting diode display includes a substrate, a plurality of wires, a plurality of light-emitting areas, and at least one driver IC. The plurality of wires are formed on the substrate. The plurality of light-emitting areas include a light-emitting diode area and a virtual area. The plurality of light-emitting areas are arranged in a matrix. The virtual area of the plurality of light-emitting areas corresponds to each other. The driver IC is formed on the virtual area of the plurality of the light-emitting areas or on the plurality of the light-emitting areas.

A chip includes a plurality of ground conductors that at least partially surround a signal conductor on a same die. The signal conductor carries an interface (e.g., high speed) signal, and the ground conductors filter electromagnetic interference generated by the signal carried by the signal conductor. A chip package includes a plurality of ground pins around a signal pin that carries an interface signal. The ground pins filter electromagnetic interference generated by the signal carried by the signal pin. A printed circuit board includes a plurality of ground conductors around a signal line. The ground conductors are in vias and filter electromagnetic interference generated by an interface signal carried by the signal line.

A display device having a display panel, a conductive shielding film disposed on a surface of the display panel, and a flexible circuit unit connected to another surface of the display panel and configured to provide a driving signal to the display panel, wherein the shielding film has at least one protrusion disposed adjacent the flexible circuit unit.

A touch panel module including a touch panel and an electrostatic discharge (ESD) protection circuit is provided. The touch panel includes one or more conductive electrodes and one or more dummy electrodes. The one or more conductive electrodes include at least one of one or more driving electrodes and one or more sensing electrodes. The one or more dummy electrodes are configured to fill areas between the one or more conductive electrodes or areas outside the one or more conductive electrodes. The ESD protection circuit is electrically connected to at least one dummy electrode of the one or more dummy electrodes, and configured to provide an electrostatic discharging path to the at least one dummy electrode. Furthermore, an electrostatic discharging method of the touch panel module is also provided.

A radio-frequency device and a radio-frequency component thereof are provided. The radio-frequency component includes a signal transmission line and a first electrostatic protection module coupled to the signal transmission line. The first electrostatic protection module includes a first wire layer including a first wire coupled to the signal transmission line, a first cell layer disposed corresponding to the first wire layer and including a first conductive body and a plurality of first non-conductive portions, a first grounding layer coupled to the first wire layer and the first cell layer, a first dielectric layer disposed between the first wire layer and the first cell layer, and a second dielectric layer disposed between the first cell layer and the first grounding layer. A vertical projection of the first conductive line on the first dielectric layer at least partially overlaps with that of the first cell layer on the same.

Optical stacks containing one or more patterned transparent conductor layers may be damaged by electrostatic discharges that occur during the optical stack manufacturing process. Such damage may result in non-conductive conductors within the patterned transparent conductor layer. An electrostatic discharge protected optical stack may include a substrate layer, a first anti-static layer having a sheet resistance of from about 10.sup.6 ohms per square (Ω/sq) to about 10.sup.9 Ω/sq, and a patterned transparent conductor layer. Methods of testing and assessing damage to patterned transparent conductors are provided.

A data transmission circuit board, a mobile industry processor interface and a device are provided. The data transmission circuit board includes: a wiring substrate; a plurality of data transmission line pairs on one side of the wiring substrate; and a plurality of transient voltage suppression diodes on the one side of the wiring substrate. Data transmission lines of the data transmission line pairs are coupled to the transient voltage suppression diodes in a one-to-one correspondence, the line width of at least one data transmission line is within a line width threshold range; and the transient voltage suppression diode is configured to discharge when a voltage to ground on the corresponding data transmission line is greater than a discharge voltage threshold, wherein the discharge voltage threshold is not less than a maximum voltage value of the differential signal transmitted on the data transmission line.

The present disclosure provides a circuit board, including a substrate on which a first conductive layer and an electronic device are disposed, wherein the first conductive layer is disposed on a first surface of the substrate, and wherein a bottom end of the electronic device is disposed on the first conductive layer through the substrate. The present disclosure provides a display device.