A printer for security paper, such as a multifunction printer, a printer, a facsimile machine or a copier, is configured to perform a printing operation by distinguishing between security paper and normal paper. The printer for security paper includes: security paper sensor disposed on a printing paper feeding path; and a control unit for comparing a first sensing value sensed by the security paper sensor when printing paper to be determined is not present near the security paper sensor with one or more second sensing values sensed by the security paper sensor for the corresponding printing paper on the feeding path, during the course of conveying the corresponding printing paper on the feeding path, determining printing paper as security paper when a comparison value is above a predefined reference value, and determining printing paper as normal paper when the comparison value is below the predefined reference value.

An electronic device is provided. The electronic device includes a conductive support member, a first circuit board connected to the conductive support member by a first capacitor, a second circuit board connected to the conductive support member by a second capacitor, a first conductive connection member electrically connecting the first circuit board and the second circuit board, and a first ground structure, at least a portion of the first ground structure being interposed between the first conductive connection member and the conductive support member. The ground structure includes a non-conductive layer physically contacting the conductive support member, and a conductive layer electrically connected to the first conductive connection member to form a capacitive coupling with the conductive support member.

A printed circuit board (100) includes a front layer (30) including frame ground regions (102a, 102b) on which connectors (202, 203) to be connected with external apparatuses or communication cables are mounted and which are connected with a ground, a signal ground region (101) which is separated from the frame ground regions at the front layer, on which electronic devices (200, 201) configured to receive signals from the connectors are mounted, and which is connected with a ground, and a static electricity removal ground region (103) separated from the frame ground regions (102a, 102b) and the signal ground region (101) at the front layer, situated outside the frame ground regions (102a, 102b), and connected with a ground.

Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

A display panel and a display device are provided. The display panel includes a driving chip and an electrostatic protection module including a plurality of adjustment units. The adjustment units correspond to at least a part of connection lines, and the electrostatic protection module is configured to adjust a current value on the connection lines when an absolute value of an actual voltage on the connection lines is greater than a preset voltage to prevent damage to the connection lines.

An electronic device is provided. The electronic device includes a display panel, a metal layer disposed on a surface of the display panel, a display driver integrated circuit (DDI) disposed on a surface of the metal layer, a bending part connecting the display panel to the DDI, and a cover member connected to the metal layer while covering the DDI. The cover member includes at least one conductive layer. The metal layer and the cover member form a space in which the DDI is disposed, and the bending part is connected to the DDI via a connection part in the space.

A wiring substrate includes an insulating base that has a plate surface; a first circuit that is provided on the plate surface; a first terminal that is provided on the plate surface, and to which a mounting member is attached; a second terminal that is provided on the plate surface; a first wiring that connects the first circuit and the first terminal to each other; and a second wiring that connects the first terminal and the second terminal to each other, is electrically connected to the first wiring in the first terminal, and has a parallel section in which the second wiring is disposed close to and parallel to the first wiring without being electrically connected to the first wiring outside the first terminal.

A touch panel includes a substrate having an operation face, a sensor part provided at a sensor face of the substrate, and a wire led out from the sensor part to the sensor face to be connected to an external connection part. The sensor part and the wire are covered by an insulation layer. A cutout is provided to the insulation layer to expose a part of the wire to which the external connection part is connected. An insulation part is provided to cover the external connection part, the insulation layer and the wire located at the cutout. The touch panel can reliably prevent static electricity generated at the operation face during panel operation from entering the sensor part via the wire and the external connection part and causing electrostatic destruction of a bridge and such of the sensor part.

Provided is a display apparatus including a liquid crystal panel, a substrate disposed under the liquid crystal panel, and a reflective sheet provided with a hole and disposed on a first side of the substrate. The substrate may include at least one feed portion and at least one antistatic portion. A light source module may be disposed within an area defined by the hole of the reflective sheet on the first side of the substrate. The light source module may be provided with a light emitting diode and an insulating dome covering the light emitting diode such that the at least one feed portion is disposed on the first side of the substrate and is in contact with the light emitting diode of the light source module, and the at least one antistatic portion may be disposed within the area defined by the hole of the reflective sheet.

The present disclosure provides a source driver and a display panel. The source driver includes a printed circuit board, a flip-chip film, a source driver chip, a first connection line, and a test point. The source driver chip is encapsulated on the flip-chip film and connected to the display panel through the first connection line, and the first connection line is connected to the test point, wherein a conductive pattern is formed on the flip-chip film, the conductive pattern is grounded through a ground line, and the conductive pattern includes a tip portion configured to form a tip discharge effect to discharge static electricity on the test point to the ground line. Therefore, the present disclosure can conduct static electricity through the tip portion when electrostatic discharge occurs, thereby preventing the electrostatic discharge from damaging the driver chip through a test point path.