An ESD protection device includes a multilayer substrate, first and second discharge electrodes, and a discharge auxiliary electrode. Discharge portions of the first and second discharge electrodes are opposed to each other in a lamination direction of insulating layers with the discharge auxiliary electrode interposed between both the discharge portions. A cavity is provided within the multilayer substrate in at least one of a region positioned adjacent to or in a vicinity of the discharge portion of the first discharge electrode on an opposite side to the discharge auxiliary electrode and a region positioned adjacent to or in a vicinity of the discharge portion of the second discharge electrode on an opposite side to the discharge auxiliary electrode.

An electronic component includes a multilayer electronic component including an ESD discharge member including a substrate and conductors, and external electrodes. The conductors include discharge electrode layers disposed on the substrate to be spaced apart from each other and connected to the external electrodes. The discharge electrode layers have a protrusion formed to extend, and the protrusion has a shape having a narrowing width.

A circuit board includes a board, an interface formed on the board, a discharge wiring pair formed on the board and having a first discharge wire connected to the interface and a second discharge wire having a second tip portion facing a first tip portion of the first discharge wire with an interval, an electronic component installed in a signal path connected to the interface, a ground path connected to the second discharge wire, and a discharge induction unit configured to induce discharge between the discharge wiring pair by making a current having a frequency based on a voltage waveform of static electricity to be discharged flow more easily in the discharge wiring pair than in the signal path.

An ESD protective device includes an element assembly with a hollow portion that includes inner surfaces including a first inner surface, a second inner surface, and a third inner surface inclined to a Z direction in a cross section including the Z direction. Accordingly, a surface area of the inner surfaces of the hollow portion is increased, the heat load on an auxiliary discharge electrode is reduced, and the deterioration of the auxiliary discharge electrode is significantly reduced or prevented.

An ESD protection device includes a ceramic element assembly including a glass component, first and second discharge electrodes on the same plane in the ceramic element assembly and opposed to each other with a gap therebetween, a discharge auxiliary electrode that connects the first discharge electrode to the second discharge electrode on the same plane, and a seal layer that is disposed between the discharge auxiliary electrode and the ceramic element assembly and that reduces or prevents a glass component in the ceramic element assembly from entering the discharge auxiliary electrode. The seal layer includes a conductive component.

An ESD protection device includes: a first insulating layer (2a); a second insulating layer (2b) stacked on the first insulating layer (2a); a first via conductor (6a) extending through the first insulating layer (2a) in a thickness direction; a discharge gap portion (10) provided so as to be in contact with the first via conductor (6a), between the first insulating layer (2a) and the second insulating layer (2b); a first wiring line (7a) that is arranged on a surface of the first insulating layer (2a) opposite to the discharge gap portion (10) and that is electrically connected to the first via conductor (6a); and a second wiring line (7b) that is arranged on one surface of the second insulating layer (2b) and that includes a portion facing the first via conductor (6a) with at least the discharge gap portion (10) interposed therebetween.

To provide a display body device and a display apparatus that allow for improvement of an electrostatic withstanding voltage, a display body device 10E includes: a wiring substrate 30; a light-emitting element 12 and a drive IC 13 that are disposed on the wiring substrate 30; and a wiring pattern 36 that is disposed on an outermost side, and is at least partially exposed and has a potential equal to a ground of each of the light-emitting element 12 and the drive IC 13.

A spark-preventing element embedded in a printed circuit board includes a capacitive output electrode, a capacitive input electrode, an interlayer conductive member electrically connecting the capacitive output electrode to a signal line, and an interlayer insulation member electrically insulating the capacitive input electrode from the signal line, The capacitive input electrode is spaced apart from the capacitive output electrode with an air gap disposed between the capacitive output electrode and the capacitive input electrode, surrounds the capacitive output electrode, and is electrically connected to the ground layer. The spark-preventing element has an improved electrical characteristic and an increased durability.

An ESD protection device includes a ceramic element assembly including a glass component, first and second discharge electrodes on the same plane in the ceramic element assembly and opposed to each other with a gap therebetween, a discharge auxiliary electrode that connects the first discharge electrode to the second discharge electrode on the same plane, and a seal layer that is disposed between the discharge auxiliary electrode and the ceramic element assembly and that reduces or prevents a glass component in the ceramic element assembly from entering the discharge auxiliary electrode. The seal layer includes a conductive component.

An optoelectronic component device includes first and second electrodes; a first optoelectronic component electrically coupled to the first and second electrodes; and a first electrically conductive section electrically coupled to the first electrode, and a second electrically conductive section electrically coupled to the second electrode; wherein the first and second electrically conductive sections are arranged electrically in parallel with the first optoelectronic component; wherein the first and second electrically conductive sections are arranged and configured relative to one another such that, beyond a response voltage applied over the first and second conductive sections, a discharge path is formed between the first and second conductive sections; and wherein the response voltage has as its value a value formed greater than the threshold voltage value of the first optoelectronic component and less than or equal to the value of the breakdown voltage of the first optoelectronic component.