A system and method for forming a stretchable conductive circuit package that utilizes an addition and condensation mechanism incorporated into one system. When the stretchable conductive ink is used in a circuit package, the circuit package has high reliability and durability.

A copper-clad laminate includes an insulating layer and a copper foil in contact with at least one surface of the insulating layer, in which the insulating layer contains a cured product of a resin composition containing a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond, a chromium element amount on an exposed surface on which the insulating layer is exposed by an etching treatment of the copper-clad laminate with a copper chloride solution, measured by X-ray photoelectron spectroscopy is 7.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and a surface roughness of the exposed surface is 2.0 μm or less in terms of ten-point average roughness.

One example of a flexible printed article includes a non-conductive, graphene oxide membrane base substrate; and an electronic component positioned on the non-conductive, graphene oxide membrane base substrate. An example method for generating this example of the flexible printed article includes inkjet printing a conductive ink directly on the non-conductive graphene oxide membrane base substrate.

The present disclosure pertains to the technical field of resin composite materials and more particularly relates to resin compositions and articles made therefrom, including a resin film, a prepreg, a laminate or a printed circuit board, wherein the resin composition comprises a phosphorus-containing flame retardant of Formula (I) and a prepolymerized resin prepared at least from a divinylbenzene compound, an allyl resin and an acrylate resin. The resin compositions may be further used to make a resin film, a prepreg, a laminate or a printed circuit board, which has the properties of absence of branch-like pattern on laminate surface, high glass transition temperature, low ratio of thermal expansion, and high copper foil peeling strength.

A resin composition contains a polyphenylene ether compound having a carbon-carbon unsaturated double bond at the terminal, a maleimide compound (A) having an indane structure in the molecule, and an inorganic filler.

A resin comprises at least one compound selected from one of the following formulas ##STR00001##

The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.

A fluororesin film including a fluorine-containing composition, wherein the oxygen element percentage as measured when heat treatment is performed at 180° C. for 3 minutes and then the state of one or both surfaces of the film is observed by scanning X-ray photoelectron spectroscopy (XPS/ESCA) is 1.35 atom % or more, and an absolute value of the rate of dimensional change in MD and TD before and after heat treatment as measured when the film is heat-treated at 180° C. for 10 minutes and then cooled to room temperature is 2% or less. Also disclosed is a copper-clad laminate, including copper foil and the fluororesin film; a substrate for circuit, including the copper-clad laminate; and a method for producing the copper-clad laminate.

A resin composition includes: (A) 100 parts by weight of a thermosetting resin, which includes a vinyl-containing polyphenylene ether resin, a maleimide resin, or a combination thereof; (B) 15 parts by weight to 50 parts by weight of a sintered body formed by aluminum nitride and boron nitride; and (C) 180 parts by weight to 280 parts by weight of titanium dioxide. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

Disclosed are surface-treated copper foils having at least one treated surface that exhibit high conductivity and a set of surface properties. Also provided are flexible copper-clad laminates and printed circuits made therefrom. The present printed circuits exhibit low insertion loss and are suitable for use in high speed/high frequency applications.