In order to maintain high haze value of thermoplastic liquid crystalline polymer while to improve total light transmittance, provided is a thermoplastic liquid crystalline polymer molded body having a haze value of 99% or higher, and a thermal expansion coefficient of 16 to 27 ppm/° C., and satisfying a correlation between a light absorption coefficient (ε) and a thickness (x) as: ε≤0.21x.sup.−0.55.

A via frame. In some embodiments, the via frame includes: a sheet of epoxy mold compound, having a plurality of holes each extending through the sheet of epoxy mold compound, and a plurality of conductive elements, each extending through a respective one of the holes.

The present invention provides recyclable copper clad laminates (CCLs) each including copper coil and a recyclable/degradable fiber composition, and printed circuit boards that are made of or include the CCLs of this invention. Also provided are method for recycling these CCLs and printed circuit boards.

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

A high frequency signal transmission structure includes an insulating sheet and a conductive wiring layer forming on the insulating sheet. The conductive wiring layer includes a silver conductive layer forming on the insulating sheet, a copper conductive layer forming on the silver conductive layer, and a silver covering layer covering a top surface and side surfaces of the copper conductive layer. The silver conductive layer and the silver covering layer together surround the copper conductive layer.

The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to an electrically conductive film wherein the stress relaxation rate (R) and the residual strain rate (alpha), as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.

Provided are a thermoplastic polymer capable of reducing a dielectric dissipation factor in high frequency bands and a film thereof. The thermoplastic liquid crystal polymer includes repeating units represented by the following formulae (I), (II), (III) and (IV), in which a molar ratio of a total amount of the repeating units represented by formulae (I) and (II) to a total amount of all the repeating units in the thermoplastic liquid crystal polymer is 50 to 90 mol %, and a molar ratio of the repeating unit represented by formula (III) to the repeating unit represented by formula (IV) is the former/the latter=23/77 to 77/23.

The present invention provides a novel phosphorus-containing olefin polymer that comprises cycloolefin as a first component and a vinyl phosphorus-containing compound as a second component. The present invention further provides a method for producing such phosphorus-containing olefin polymer and a composition and an article comprising the same.

An oligomer, composition, and composite material employing the same are provided. The oligomer can be a reaction product of a reactant (a) and a reactant (b). The reactant (a) is a reaction product of a reactant (c) and a reactant (d). The reactant (b) can be

##STR00001##

or a combination thereof, wherein a is 0 or 1, and R.sup.1 is independently hydrogen

##STR00002##

or and wherein b is 0-6; c is 0 or 1; and, d is 0-6. The reactant (c) is

##STR00003##

wherein R.sup.2 is C.sub.5-10 alkyl group. The reactant (d) is

##STR00004##

wherein e is 0-10.

The invention provides a hydrogel network comprising a plurality of hydrogel objects, wherein each of said hydrogel objects comprises: a hydrogel body, and an outer layer of amphipathic molecules, on at least part of the surface of the hydrogel body, wherein each of said hydrogel objects contacts another of said hydrogel objects to form an interface between the contacting hydrogel objects. A process for producing the hydrogel networks is also provided. The invention also provides an electrochemical circuit and hydrogel component for mechanical devices comprising a hydrogel network. Various uses of the hydrogel network are also described, including their use in synthetic biology and as components in electrochemical circuits and mechanical devices.