A substrate with a tetrafluoroethylene polymer and an inorganic filler, wherein the proportion of the total volume of the tetrafluoroethylene polymer and the inorganic filler to the total volume of the present substrate is at least 80 vol %, and the substrate has a rate of change in dielectric loss tangent at 10 GHz before and after 72 hours of unsaturated pressure cooker test at 120? C. under 85% RH on a 127-?m thick specimen cut out from the substrate is at most 30%.

A wiring board manufacturing method and a wiring board in which a pattern can be simply and easily formed even when using a coating composition having a high surface tension are provided. The method includes a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a surface free energy which is higher than that of the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing the resin composition to form a base material to which the surface free energy difference pattern is transferred; and a conductor pattern forming step of applying a conductive coating composition onto a pattern transfer surface of the base material to form a conductor pattern, the base material having a pattern of a high surface free energy region and a low surface free energy region, and the high surface free energy region having a surface free energy of more than 62 mJ/m.sup.2.

To provide a method for producing a liquid composition, whereby agglomeration of the resin powder is suppressed even at a low viscosity and it is possible to obtain a uniformly dispersed liquid composition, and a method for producing a film, etc. by using the method for producing a liquid composition. The method for producing a liquid composition comprises heat-treating a mixture comprising a resin powder having an average particle size of from 0.02 to 200 m made from a powder material containing a fluorinated polymer having a specific functional group, a binder component having a reactive group reactive with the functional group of the resin powder, and a liquid medium capable of dissolving the binder component, to obtain a liquid composition, of which the viscosity change rate to the viscosity before heating is from 5 to 200%. Further, the method for producing a film, etc. uses the liquid composition obtained by the method for producing a liquid composition.

A laminate that includes a metal layer that is not easily separated from a substrate, a method for producing the laminate, and a method for forming a fine conductive pattern that exhibits high conductivity, are disclosed. The peel strength of a metal layer included in a laminate that includes a polymer layer provided between a substrate and the metal layer is improved by implementing a structure in which the metal that forms the metal layer is chemically bonded to COO that extends from the polymer main chain that forms the polymer layer at the interface between the metal layer and the polymer layer. A fine conductive pattern that exhibits high conductivity can be formed by applying UV light to a pattern area of an insulating film formed on a substrate, and applying an ink prepared by dispersing metal nanoparticles in a solvent to the substrate to effect adhesion and aggregation of the ink in the pattern area, the surface of the metal nanoparticles being protected by an organic molecule layer.

An approach for protecting the circuit trade of a printed circuit board from oxidation that may occur due the permeability of the underlying substrate. A layer of silver is positioned between the circuit trace and the substrate, such as by immersion plating, during manufacturing of the printed circuit board. The layer of silver is preferably applied over the seed-conductor after a negative photo resist layer has been applied to the substrate and before the copper is plated to form the circuit trace. The resist and seed-conductor outside of the circuit trace may then be removed to leave the protected circuit trace. An additional layer of silver may be plated over the copper trace to protect the exterior and side surface of the trace.

An electrical wiring system comprises a plurality of electrical conduits, each of which comprises a plurality of electrically conductive wires, a carrier encapsulating and electrically insulating the wires from each other, the carrier being composed of a rigid material, and at least connector carried by the carrier in electrical communication with the wires. The electrical wiring system further comprises a junction box comprising a plurality of interconnecting wires and a plurality of connectors electrically coupled together by the interconnecting wires. The plurality of connectors of the junction box are coupled to the plurality connectors of the electrical conduits.

Provided are a polyphenyl ether resin composition and a prepreg and a laminated board containing same. The polyphenyl ether resin composition comprises the following components: (1) a tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin; and (2) a vinyl eresin cross-linking agent, the weight of the vinyl resin cross-linking agent being 40-100 parts by weight based on 100 parts by weight of the tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin. The modified thermosetting polyphenyl ether resin, due to containing a tetrafunctional or higher multifunctional acrylate active group, can cross-link more vinyl resin cross-linking agents. Not only the prepared high-speed electronic circuit substrate has low dielectric constant and dielectric loss, but also double bonds in side chains of the vinyl resin cross-linking agent are reacted completely in a resin curing system, so that the high-speed electronic circuit substrate has a better thermo-oxidative aging resistance.

A thermosetting resin composition. The composition comprises thermosetting resin, a cross-linking agent, accelerator, and a porogen. The porogen is a porogen capable of being dissolved in an organic solvent. The organic solvent is an organic solvent capable of dissolving the thermosetting resin. A mode of directly adding the dissolvable porogen to a resin system is used, tiny pores that are uniform in pore diameter can be evenly distributed in resin matrix by means of a simple process at low cost, and the high-performance composition having a low dielectric constant and low dielectric loss is obtained; the method has good applicability to a great number of resin systems; because the pore size in the system reaches a nanometer grade, performance of the final system, such as mechanical strength, thermal performance and water absorption rate, is not sacrificed.

A wiring board and a method for manufacturing the same enabling simple and easy formation of a conductive pattern are provided. The method comprises a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a higher surface free energy than the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing to obtain a base material to which the surface free energy difference pattern is transferred; and a conductive pattern forming step of applying a conductive coating composition onto a surface of pattern transfer of the base material to form a conductive pattern.

High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.