The present disclosure relates to a thermosetting resin composite having a specific thermal stress factor, and capable of implementing a low glass transition temperature, low modulus, and a low coefficient of thermal expansion, and minimizing warpage, and having excellent flowability in a prepreg or semi-cured state, and a metal clad laminate using the same.

The present disclosure relates to a thermosetting resin composition for a semiconductor package including an amine compound containing a specific functional group, a thermosetting resin, a thermoplastic resin, and an inorganic filler, and having a glass transition temperature of 230 C. or less after curing, a prepreg including the thermosetting resin composition, and a metal clad laminate including the prepreg.

To provide a dispersion excellent in miscibility with varnish, coating properties, dispersibility and dispersion stability; and methods for producing a metal laminate and a printed board. A dispersion comprises an organic solvent and a powder so that the powder is dispersed in the organic solvent, wherein the powder is a powder containing a tetrafluoroethylene type polymer having a melt viscosity at 380 C. of from 110.sup.2 to 110.sup.6 Pa.Math.s; the viscosity is from 50 to 10,000 mPa.Math.s; and the thixotropy ratio calculated by dividing the viscosity measured under the condition of rotational speed of 30 rpm by the viscosity measured under the condition of rotational speed of 60 rpm, is from 1.0 to 2.2.

A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.

A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.

A substrate for pattern formation, the substrate including at least a base material and a perfluoro(poly)ether group-containing silane compound-derived portion, wherein the base material includes at least one main face having a first region and a second region which is a region for pattern formation, adjacent to the first region, and the perfluoro(poly)ether group-containing silane compound-derived portion is disposed in the first region.

A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.

The disclosure provides a method of manufacturing a flexible circuit electrode assembly and an apparatus manufactured by said method. According to the method, an electrically conductive sheet is laminated to an electrically insulative sheet. An electrode is formed on the electrically conductive sheet. An electrically insulative layer is formed on a tissue contacting surface of the electrode. The individual electrodes are separated from the laminated electrically insulative sheet and the electrically conductive sheet. In another method, a flexible circuit is vacuum formed to create a desired profile. The vacuum formed flexible circuit is trimmed. The trimmed vacuum formed flexible circuit is attached to a jaw member of a clamp jaw assembly.

The present invention provides a novel phosphorus-containing olefin polymer that comprises cycloolefin as a first component and a vinyl phosphorus-containing compound as a second component. The present invention further provides a method for producing such phosphorus-containing olefin polymer and a composition and an article comprising the same.

A purpose of the present disclosure is to provide a multilayer wiring substrate capable of reducing transmission loss of electrical signals when using a fluororesin substrate, by using an adhesive layer capable of suppressing misalignment between layers and having excellent peel strength. Provided is a multilayer wiring substrate 1 including: a fluororesin substrate 30 having a conductor pattern 20 formed on at least one surface thereof; and an adhesive layer 10 for bonding the fluororesin substrate 30, wherein the adhesive layer 10 contains a cured product of a thermosetting resin, and has a breaking elongation rate of 20% or more and 300% or less.