A component carrier for carrying at least one electronic component includes (a) a plurality of electrically conductive layers; (b) a plurality of electrically insulating layers; and (c) a thermoplastic structure. The electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate. Further, a method for manufacturing such a component carrier and an electronic apparatus including such a component carrier are provided.

A resin composition, a prepreg, and a printed circuit board are provided. The resin composition is used to form a dielectric substrate layer. The resin composition includes a polymeric based material and fillers. Based on a total volume of the resin composition being 100 vol %, the resin composition includes 10 vol % to 60 vol % of the polymeric based material and 1 vol % to 80 vol % of the fillers. The fillers include hollow fillers, and the hollow fillers include a first hollow filler. A material of the first hollow filler is silicon dioxide.

A method for manufacturing a functionally graded composite material for a printed circuit board (PCB) is proposed. The method may include preparing two or more types of mixed powders with different contents of polymer or ceramic powder, each mixed powder comprising (i) a metal powder comprising a powder made of aluminum or an aluminum alloy and a powder of magnesium and (ii) the polymer or ceramic powder. The method may also include laminating the two or more types of mixed powders to form a functionally graded laminate in which a ratio of the content of the polymer or ceramic powder to the content of the metal powder in each of layers stacked in sequence from bottom to the top of the laminate differs. The method may further include preparing a functionally graded composite material by sintering the functionally graded laminate by pressureless sintering or spark plasma sintering.

An object of the present disclosure is to provide a laminate comprising a fluoropolymer layer with insulating properties, hardness, or transparency. The present disclosure relates to a laminate comprising a fluoropolymer layer, wherein the fluoropolymer comprises, as a main component, a monomer unit represented by formula (1):

##STR00001##

wherein R.sup.1 to R.sup.4 are each independently a fluorine atom, a fluoroalkyl group, or a fluoroalkoxy group.

Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a Mowing formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material.
0.12<{(a1+a2)/2}/B  (1)
0.8≤a1/a2≤1.25  (2)

A thermosetting resin composition contains an ethylene-propylene-diene copolymer (A), a terminal-modified polyphenylene ether compound (B), an inorganic filler (C), a styrene-based elastomer (D), and a fibrous filler (E).

A carrier configured to be attached to a semiconductor substrate via a first surface comprises a continuous carbon structure defining a first surface of the carrier, and a reinforcing material constituting at least 2 vol-% of the carrier.

A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including varnish transparency, varnish sedimentation property, glass transition temperature, X-axis coefficient of thermal expansion, T300 thermal resistance, resin cluster and resin filling property.

Proposed are a multilayer wiring board having both durability and chemical resistance, and a probe card including the same.

A metal-clad laminate includes: an insulating layer; and a metal layer stacked on the insulating layer. The insulating layer includes: a first layer; and a second layer interposed between the first layer and the metal layer. The first layer contains a cured product of a first resin composition containing composite particles. The second layer contains a cured product of a second resin composition. The first resin composition contains composite particles, each having a core containing a fluororesin and a shell containing a silicon oxide that coats the core at least partially. The second resin composition may or may not contain composite particles. When the second resin composition contains the composite particles, a ratio of the composite particles in the second resin composition to solid content of the second resin composition is lower than a ratio of the composite particles in the first resin composition to solid content of the first resin composition.