A laminated uncured sheet of the present disclosure has a structure in which resin sheet layers and resin layers are alternately laminated and a through hole penetrating in the laminating direction is formed, wherein the resin sheet layers are formed with a thermosetting resin composition containing a thermosetting resin as a main component, the resin layers are formed with a thermoplastic resin composition containing a thermoplastic resin, and the thermoplastic resin composition is adhered to the inner wall surface of the resin sheet layer part in the through hole.

To provide a copper-clad laminate which maintains adhesion between a resin film and a conductor layer and which suppresses the occurrence of wrinkles. A copper-clad laminate has a base film containing a thermoplastic resin, an underlying metal layer film-formed on a surface of the base film by a dry plating method, and a copper layer film-formed on a surface of the underlying metal layer. The underlying metal layer has a mean thickness of 0.3 to 1.9 nm. Since the underlying metal layer has a mean thickness of 0.3 nm or more, it is possible to maintain adhesion between the base film and a conductor layer. Since the underlying metal layer has a mean thickness of 1.9 nm or less, it is possible to suppress an increase in the temperature of a film during film-forming of the underlying metal layer, and it is possible to suppress the occurrence of wrinkles.

Provided is a double-sided circuit substrate being a laminate of: a composite material comprising a fluorine resin and a glass cloth; and a copper foil having a two-dimensional roughness Ra in a mat surface (a surface that comes in contact with the resin) of less than 0.2 μm. Ideally, a surface of the fluorine resin has an O content of at least 1.0%, as observed using ESCA.

Compositions including first and second silicon-containing compounds are described. The first silicon-containing compound includes a polyvalent transition metal having bonded thereto a hydrocarbyloxy group(s) and/or a (di-hydrocarbyl)(perfluoro/fluorinated-hydrocarbyl)silyloxy group(s), which is represented by Formula (I). The second silicon-containing compound includes a reaction product of a first reactant represented by Formula (II-A), which includes hyrdrocarbylsilyloxy groups, and a second reactant represented by Formula (II-B), which includes a perfluorohydrocarbyloxy group(s). The present invention also relates to, articles that include one or more layers formed from such compositions, methods of treating articles by applying thereover such compositions, and the second silicon-containing compound.

The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

A flexible metal laminate contains an insulation layer including a polyimide film, a first liquid crystal polymer coating layer formed on one surface of the polyimide film, and a second liquid crystal polymer coating layer formed on the other surface of the polyimide film, and a metal layer formed on at least one surface of the insulation layer. A printed circuit board containing the flexible metal laminate is also disclosed. The flexible metal laminate has an excellent dielectric property of the insulation layer, and the dielectric property of the insulation layer can be maintained excellently in a high temperature and high humidity environment to preserve high-speed, low-loss signal performance. Therefore, it can be advantageously applied to 5G communication products.

A multilayer curable resin film comprising a first resin layer comprising a first curable resin composition including a polyphenylene ether oligomer (A1) with an end modified by an aromatic vinyl group and a curing agent (A2) and a second resin layer comprising a second curable resin composition including an alicyclic olefin polymer (B1) and a curing agent (B2), a prepreg comprised of this including a fiber substrate, and a laminate, cured product, composite, and multilayer circuit board obtained using these are provided.

An adhesive composition having a low dielectric constant, low dielectric loss tangent, excellent folding endurance, and excellent heat resistance. The adhesive composition includes: with respect to the total of 100 parts by mass of the adhesive composition, 70 to 90 parts by mass of the styrene elastomer; 5 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent, wherein the styrene ratio of the styrene elastomer is less than 42%.

Provided are: a prepreg with low dielectric constant, low dielectric loss tangent, and improved adhesiveness to glass cloth; and a laminate for a circuit board. The prepreg is formed of the glass cloth serving as a base material and a semi-cured product of a thermosetting resin composition impregnated into the glass cloth, where the glass cloth comprises a treated surface treated by at least one type of silane coupling agent selected from methacryl-based silane coupling agents, acryl-based silane coupling agents, and isocyanate-based silane coupling agents, and the thermosetting resin composition contains polyphenyleneether having a terminal hydroxyl group modified with an ethylenically unsaturated compound in a main chain of the polyphenyleneether. The laminate for the circuit board is obtained by laminating the prepreg and a conductor layer.

The metal thin film production method of the present invention includes, in the following order, the steps of: preparing a substrate (1) having thereon an underlayer (2) formed of an insulating resin; subjecting a surface of the underlayer (2) to a physical surface treatment for breaking bonds of organic molecules constituting the insulating resin; subjecting the substrate (1) to a heat treatment at a temperature of 200° C. or lower; applying a metal nanoparticle ink to the underlayer (2); and sintering metal nanoparticles contained in the metal nanoparticle ink at a temperature equal to or higher than a glass transition temperature of the underlayer (2). A fused layer (4) having a thickness of 100 nm or less is formed between the underlayer (2) and a metal thin film (3) formed by sintering the metal nanoparticles.