A multilayer board insulating sheet contains a reducing agent.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

An aspect of the present invention is a resin composition, which contains a polyphenylene ether compound, a curing agent, boron nitride, and an inorganic filler other than the boron nitride, in which the content of boron nitride is 15 to 70 parts by volume with respect to 100 parts by volume of the sum of the polyphenylene ether compound and the curing agent.

A method of manufacturing a multilayer board includes forming conductor patterns on four or more insulating base material layers, forming a multilayer body by stacking the insulating base material layers in a state in which the conductor patterns face each other with prepreg layers therebetween, and heat-pressing the multilayer body. In a state before the step of heat-pressing, among the prepreg layers, a thickness of an outermost prepreg layer is larger than a thickness of a prepreg layer other than the outermost prepreg layer.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component is embedded in the stack. A first thermally conductive block is located above and thermally connected with the component, and a second thermally conductive block is located below and thermally coupled with the component. Heat generated by the component during operation is removed via at least one of the first thermally conductive block and the second thermally conductive block.

A wiring substrate includes an insulating layer including resin and filler particles, conductor layers including an upper-layer conductor layer and a lower-layer conductor layer such that the insulating layer is sandwiched between the upper-layer and lower-layer conductor layers, and a penetrating conductor formed in the insulating layer such that the penetrating conductor is penetrating through the insulating layer and connecting the upper-layer and lower-layer conductor layers. The penetrating conductor is formed such that the penetrating conductor has a first length which is the maximum width of the penetrating conductor in the direction orthogonal to the thickness direction of the wiring substrate and the first length is 25 μm or less, and the insulating layer is formed such that the maximum particle size of the filler particles in a region within the distance of 40% of the first length from the penetrating conductor is 20% or less of the first length.

A resin composition contains a thermosetting resin (A) and an inorganic filler (B). The inorganic filler (B) includes: a first filler (B1); and a second filler (B2) of a nanometer scale having a smaller particle size than the first filler (B1). The first filler (B1) includes an anhydrous magnesium carbonate filler (b1) and an alumina filler (b2). The proportion of the first filler (B1) relative to a total solid content in the resin composition is equal to or greater than 50% by volume and equal to or less than 90% by volume. The proportion of the second filler (B2) relative to the total solid content in the resin composition is equal to or greater than 0.1% by volume and equal to or less than 2.0% by volume.

Provided is a resin composition for laser direct structuring on which a plating can be formed and demonstrating low loss tangent, a molded article, and, a method for manufacturing a plated molded article. The resin composition for laser direct structuring contains a polycarbonate resin and a laser direct structuring additive, and the polycarbonate resin containing 5% by mass or more, relative to all structural units, of a structural unit represented by formula (1). In formula (1), each of R.sup.1 and R.sup.2 independently represents a hydrogen atom or a methyl group, and W.sup.1 represents a single bond or a divalent group).

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A copolymer is formed by reacting (A) aromatic monomer, an oligomer thereof, or a polymer thereof, with (B) aliphatic monomer, an oligomer thereof, or a polymer thereof. The aromatic monomer has a chemical structure of

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in which each of R.sup.1 is independently H or CH.sub.3, and n=1-4. R.sup.2 is a single bond, —O—,

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Each of R.sup.3 is independently

##STR00003##

A composite substrate that includes: an upper ceramic layer; a lower ceramic layer; a middle resin layer between the upper ceramic layer and the lower ceramic layer; and a side surface resin layer on all side surfaces of the composite substrate, wherein the middle resin layer and the side surface resin layer are integral resin layers.