A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.

A method for manufacturing a package substrate including an insulating layer and a wiring conductor, including: forming, on one or both sides of a core resin layer, a substrate including a peelable first metal layer that has a thickness of 1-70 μm, a first insulating resin layer, and a second metal layer; forming a non-through hole reaching a surface of the first metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and first metal layers; arranging a second insulating resin layer and a third metal layer and heating and pressurizing the first substrate to form a substrate; forming a non-through hole reaching a surface of the second metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and third metal layers; peeling a third substrate; and patterning the first and third metal layers to form the wiring conductor.

A method for producing a printed circuit board structure comprising at least one insulation layer, at least one conductor layer, and at least one embedded component having a contact pad that has an outer barrier layer, in which structure at least two conductor paths/conductor layer are connected to at least two connections using vias, and each via runs from a conductor path/conductor layer directly to the barrier contact layer of the corresponding connection of the component.

A component carrier with a stack including at least one electrically insulating layer structure and at least one electrically insulating structure has a tapering blind hole formed in the stack and an electrically conductive plating layer extending along at least part of a horizontal surface of the stack outside of the blind hole and along at least part of a surface of the blind hole. A minimum thickness of the plating layer at a bottom of the blind hole is at least 8 μm.

An implantable electrical connecting device includes a first elastic multi-ply layer and a second elastic multi-ply layer. The first elastic multi-ply layer has a first electrically conductive layer and a plurality of first electrical contacts electrically conductively connected to the first electrically conductive layer of the first elastic multi-ply layer. The second elastic multi-ply layer has a first electrically conductive layer and a plurality of second electrical contacts electrically conductively connected to the first electrically conductive layer of the second elastic multi-ply layer. The second electrical contacts make contact with the first electrical contacts.

In one aspect, a PCB is provided. The PCB includes at least one insulating layer, a blind slot, and at least one via. The at least on insulating layer includes a first surface and a second surface opposite the first surface. The blind slot is plated and formed in the at least one insulating layer, where the blind slot partially extends from the first surface to the second surface, and where the blind slot includes a conductive plating bonded along a major surface of the blind slot. The at least one via is electrically conductive and filled, where the at least one via is coupled with and extends between the conductive plating of the blind slot and the second surface of the at least one insulating layer.

A wiring board includes: a first insulating layer; a first pad region provided above the first insulating layer and having a first connection pad; a second insulating layer provided above the first connection pad and having a first opening to expose the first connection pad; a second pad region provided above the second insulating layer and having a second connection pad electrically connected to the first connection pad; and a third insulating layer provided above the second connection pad, and having a second opening to exposes the first and second connection pads. The first connection pad region is smaller than the second connection pad region.

A power module for PCB embedding includes: a leadframe; a power semiconductor die with a first load terminal and control terminal at a first side of the die and a second load terminal at the opposite side, the second load terminal soldered to the leadframe; a first metal clip soldered to the first load terminal and forming a first terminal of the power module at a first side of the power module; and a second metal clip soldered to the control terminal and forming a second terminal of the power module at the first side of the power module. The leadframe forms a third terminal of the power module at the first side of the power module, or a third metal clip is soldered to the leadframe and forms the third terminal. The power module terminals are coplanar within +/−30 μm at the first side of the power module.

Methods for producing a printed circuit board and printed circuit boards are disclosed, including a method in which a slot is formed in a substrate, the substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. The conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.