A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.

The present invention provides a method for producing a metal wiring-containing laminate which is capable of efficiently producing a metal wiring-containing laminate having a fine metal wiring with low resistance; as well as a metal wiring-containing laminate and a substrate with a plated layer. The method for producing a metal wiring-containing laminate of the present invention includes: a step of forming a photosensitive layer having a functional group capable of interacting with a plating catalyst or a precursor thereof on a substrate; a step of exposing the photosensitive layer in a patternwise manner and subjecting the exposed photosensitive layer to a development treatment to form a plated layer having a groove portion; a step of applying a plating catalyst or a precursor thereof to the plated layer; and a step of subjecting the plated layer, to which the plating catalyst or the precursor thereof has been applied, to a plating treatment to form a metal wiring so as to fill the groove portion.

A new method capable of forming a circuit by performing metal plating on a desired portion on a substrate through a small number of steps regardless of the kind of the substrate. A method for forming a circuit on a substrate characterized in that when forming a circuit by plating on a substrate, the method includes steps of applying a coating film containing a silicone oligomer and a catalyst metal onto the substrate, and thereafter, performing an activation treatment of the catalyst metal in the coating film to make the catalyst metal exhibit autocatalytic properties, and then, performing electroless plating.

The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conductive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors. The composition for forming a conductive pattern, comprises: a polymer resin; and a non-conductive metal compound having a predetermined chemical structure, and may be a composition for forming a conductive pattern through electromagnetic irradiation, by which a metal nucleus is formed from the non-conductive metal compound.

A workpiece (100) having substrate, such as a glass substrate, can be etched by a laser or by other means to create recessed features (200, 202). A laser-induced forward transfer (LIFT) process or metal oxide printing process can be employed to impart a seed material (402), such as a metal, onto the glass substrate, especially into the recessed features (200, 202). The seeded recessed features can be plated, if desired, by conventional techniques, such as electroless plating, to provide conductive features (500) with predictable and better electrical properties. The workpieces (100) can be connected in a stacked such that subsequently stacked workpieces (100) can be modified in place.

An object of the present invention is to provide a method for producing an electroconductive laminate, which is capable of forming a metal layer having low resistance at a position corresponding to a patterned plated layer, a laminate, and an electroconductive laminate. The method for producing an electroconductive laminate of the present invention includes: a step of forming a plated layer forming layer on a base material using a predetermined plated layer forming composition; a step of subjecting the plated layer forming layer to a patternwise exposure treatment and a development treatment to form a patterned plated layer containing a portion having a line width of less than 3 m; a step of applying a plating catalyst or a precursor thereof to the patterned plated layer using an alkaline plating catalyst-applying liquid containing the plating catalyst or the precursor thereof; and a step of subjecting the patterned plated layer to which the plating catalyst or the precursor thereof has been applied to a plating treatment using a plating liquid containing aminocarboxylic acids to form a metal layer on the patterned plated layer.

A circuit board is formed from a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth. The catalytic laminate is subjected to a drilling and blanket surface plasma etch operation to expose the catalytic particles, followed by an electroless plating operation which deposits a thin layer of conductive material on the surface. A photo-masking step follows to define circuit traces, after which an electro-plating deposition occurs, followed by a resist strip operation and a quick etch to remove electroless copper which was previously covered by photoresist.

An object of the present invention is to provide a plated layer forming composition which is capable of forming a plated layer having excellent alkali resistance and is capable of forming a metal layer on the plated layer even in the case of forming the plated layer by exposure with a low exposure amount; a film having a plated-layer precursor layer; a film having a patterned plated layer; an electroconductive film; and a touch panel. The plated layer forming composition of the present invention includes a polymer having a group capable of interacting with a plating catalyst or a precursor thereof, and a polyfunctional monomer having three or more acrylamide groups or methacrylamide groups.

A polymer product with a metal layer coated on the surface thereof is provided. The polymer product includes a polymer substrate and a metal layer formed on at least a part of a surface of the polymer substrate. The surface of the polymer substrate covered by the metal layer is formed by a polymer composition comprising a polymer and a doped tin oxide. A doping element of the doped tin oxide comprises niobium. The doped tin oxide has a coordinate L* value of about 70 to about 100, a coordinate a value of about 5 to about 5, and a coordinate b value of about 5 to about 5 in a CIELab color space.

A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.