A printed circuit board comprises a first mounting surface, a second mounting surface, and a piezoelectric transformer. The piezoelectric transformer has a piezoelectric substance, external electrodes, and a frame substrate. The second mounting surface has a projection region. There is a first region from a first location, where an end portion further from the output electrode out of end portions of the input electrode is projected onto the second mounting surface in the projection region, to a second location, where an end portion closer to the output electrode out of the end portions of the input electrode is projected onto the second mounting surface, the first region being a mounting allowed region where an electronic component is mounted.

Electrically isolating an electrical or electronic assembly having a carrier and one or more electrical or electronic components mechanically and electrically connected with the carrier, includes coating the carrier or at least one of the components or both entirely or partially with powder. The powder includes powder particles of electrically isolating material that have an average particle diameter of less than 1000 micrometers.

A printed circuit board includes a first thermal pad on a first side of the printed circuit board for a first integrated circuit having a first exposed pad and a second thermal pad on a second side of the printed circuit board for a second integrated circuit having a second exposed pad. The first thermal pad and the second thermal pad overlap at least partially to each other in a direction perpendicular to a plane of the printed circuit board.

A circuit board device of the embodiment includes: a mount board having an electronic component and a printed circuit board having at least one surface where the electronic component is mounted; a heat path arranged to a position facing the mount surface of the mount board, a sheet arranged on the mount surface, and a resin portion arranged between the sheet and the heat path. A cavity surrounded by the sheet and the mount surface is formed in a step portion between the electronic component and the printed circuit board.

The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T.sub.1.

The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T.sub.1.

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

An electrical feed-through assembly includes electrically conductive pins having a top apex and a bottom apex, where the pins extend through at least a majority of an electrically non-conductive material. The top apexes, the bottom apexes, or both the top and bottom apexes of the pins have an electrically conductive connection pad material, such as a solder pad, coupled thereto. In variations, the top and/or bottom apexes may be slightly recessed from a corresponding surface of the non-conductive material, such that the connection pads fill the respective recesses; and/or the top and/or bottom apexes barely extend from a corresponding surface, such that the connection pads bulge out from the corresponding surface. Such a feed-through configuration may inhibit pin bending, in addition to enabling use of more types of connectors beyond pin-and-socket type connectors.

One variation of a method for producing a smart yarn includes: aligning a set of sensing elements offset along a lateral axis in a magazine, wherein each sensing element in the set of sensing elements includes a sensor, a first conductive lead extending from a first side of the sensor along a longitudinal axis perpendicular to the lateral axis, and a second conductive lead extending from a second side of the sensor opposite the first side and along the longitudinal axis; wrapping a set of fibers into a yarn within a wrapping field; feeding a leading end of a first sensing element, in the set of sensing elements, from the magazine into the wrapping field; releasing the first sensing element from the magazine into the wrapping field; encasing the first sensing element between the set of fibers within the yarn; and repeating this process for the set of sensing elements.

Once variation of a method for producing a smart yarn includes: advancing a set of wires into an assembly field; at each sensor site in a series of sensor sites along the set of wires, depositing solder paste onto the set of wires at the sensor site, placing a sensor into the solder paste on the set of wires at the sensor site, and heating the set of wires within the assembly field to reflow the solder paste; wrapping fibers around the set of wires and sensors arranged along the set of wires to form a continuous length of the smart yarn; separating a first segment of the smart yarn from the continuous length of the smart yarn; and weaving the first segment of the smart yarn into a garment.