An electronic element has a first surface, and an insulating surrounding member has a second surface and is in close contact with the electronic element and surrounds the electronic element while allowing the first surface to be exposed from the second surface. A wiring board faces a third surface constituted by the first surface and the second surface. An insulating joining member is interposed between the third surface and the wiring board and joins the third surface and the wiring board together. A conductive bump is located between the third surface and the wiring board and electrically connects the electronic element and the wiring board to each other. The joining member has a through hole that passes through the joining member from the third surface to the wiring board and that accommodates the bump. At least a portion of the through hole overlaps the second surface in perspective plan view.

A fastening system comprises two interconnecting components for fastening electronic components which can be joined by snap-fit when a fastener component is pressed against a retainer. The fastening system consists of a fastener stud with a planar base at the bottom and an upwardly extending shank with a neck portion of reduced diameter adjacent the base. The stud has a spherical ball portion with a flat planar top surface at a distal top end. The fastener stud mates with a retainer having a planar base and affixed opposing resilient arms extending orthogonally from the base centered about a rotational axis. The arms preferably have compound shaped inner surfaces symmetrical about the axis. These surfaces comprise a cylindrical portion adjacent the base and a spherical portion adjacent the distal ends of the arms.

A coil component includes: a substrate body having a first resin part formed by a resin that contains magnetic grains, and a second resin part joined to the surface of the first resin part and formed by a material that contains resin, and whose insulation property is higher than that of the first resin part; a coil embedded in the first resin part and formed by a conductor having an insulating film; leader parts formed by the conductor and led out from the coil to the second resin part; and terminal parts connected electrically to the leader parts; wherein covered parts of the leader parts, which are covered with the insulating film, are embedded partially in the second resin part, and the second resin part is disposed between the terminal parts and the first resin part, thereby preventing shorting between the terminal parts.

A multilayer capacitor and a board on which the multilayer capacitor is mounted provide increased capacitor effective area. The multilayer capacitor includes a capacitor body having first and second dielectric layers each with first and second internal electrodes, first and second external electrodes disposed on a surface of the capacitor body, a first via electrode connecting the first internal electrodes to the first external electrode, and a second via electrode connecting the second internal electrodes to the second external electrode. The first and second dielectric layers are alternately stacked in the first direction such that the first internal electrode of the first dielectric layer overlaps the second internal electrode of the second dielectric layer in a first direction, and the second internal electrode of the first dielectric layer overlaps the first internal electrode of the second dielectric layer in the first direction.

A control panel of an appliance includes a film comprising conductive ink embedded in the film. A header on the film is in electrical communication with the conductive ink embedded in the film. The control panel also includes a printed circuit board. The film is directly mounted to the printed circuit board via the header. With this direct mounting, the printed circuit board is in operative communication with the conductive ink embedded in the film.

A method for interconnecting a first conductor and a second conductor includes forming a layer of substantially pure copper on the first conductor, applying a copper sintering material to the first conductor, the second conductor, or both, and interconnecting the first conductor and the second conductor by sintering the copper sintering material so as to form a copper-copper interface that includes the layer of substantially pure copper, the second conductor, and the copper sintering material.

An electronic component module includes a second terminal electrode that is independent of a first terminal electrode in terms of potential. A second electronic component is mounted on a board, with a first surface thereof facing the board. A heat transfer portion is disposed on a second surface of the second electronic component, the heat transfer portion being connected to both the first terminal electrode and the second terminal electrode. A heat dissipation portion is connected to the board via the first terminal electrode, the second terminal electrode, and the heat transfer portion.

A method for mounting an electronic component on a resin base material, the method including: (1) preparing the resin base material having a wiring pattern formed of a conductive paste; (2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material; (3) placing the electronic component on the solder paste; and (4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, wherein a melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.

A high-frequency board includes an insulating substrate, a first line conductor, a second line conductor, a capacitor, a first bond, and a second bond. The insulating substrate has a recess on its upper surface. The first line conductor extends from an edge of the recess on the upper surface of the insulating substrate. The second line conductor faces the first line conductor across the recess on the upper surface of the insulating substrate. The capacitor overlaps the recess. The first bond joins the capacitor to the first line conductor. The second bond joins the capacitor to the second line conductor, and is spaced from the first bond.

A solder printing inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder on the substrate on which a thermosetting adhesive is applied, the solder printing inspection device including: an irradiator that irradiates the solder with light; an imaging device that takes an image of the irradiated solder; a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group; outputs mounting position adjustment information to the component mounting machine.