Disclosed is an electronic device, including a substrate, a first electrode, a second electrode, a modulation element, a first solder, and a switch element. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The modulation element is disposed on the substrate and includes at least two connecting pads. The first solder is disposed between the first electrode and one connecting pad of the modulation element. The switch element is disposed on the substrate. The one connecting pad of the modulation element is electrically connected to the switch element sequentially through the first solder, the first electrode, and the second electrode.

Wafer level passive array packages and modules are described. In an embodiment, a module includes a circuit board, and a package mounted on the circuit board in which the package includes a plurality of passive components bonded to a bottom side of the die and a plurality of landing pads of the circuit board.

An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component may include a first dielectric layer having a top and a bottom, and a first conductive trace positioned on the bottom of the first dielectric layer. The component may also include a first ground layer positioned on the bottom of the first dielectric layer and spaced apart from the first conductive trace and a first solder layer connecting the first conductive trace to a second conductive trace of the printed circuit board and extending the full length of the first conductive trace. The component may also include a third conductive trace over the top of the first dielectric layer. The component may also include a pad under the first dielectric layer. The pad is soldered to a signal contact region of the printed circuit board. The third conductive trace is coupled to signal outputs formed by the signal contact region of the printed circuit board through a first via. The component may also include a second solder layer connecting the first ground layer of the component to a second ground layer positioned on the printed circuit board.

A light source module includes a light-emitting device having an upper surface and a lower surface and including: at least one light-emitting element and a plurality of conductive regions on the upper surface of the light-emitting device; a mounting substrate having an upper surface on which a lower surface side of the light-emitting device is located, the mounting substrate including conductive patterns on the upper surface of the mounting substrate, each conductive pattern including a device-side connecting portion and an external side connecting portion; and a plurality of conductive members each having a first end bonded to a respective one of the device-side connecting portion and a second end opposite to the first end, the second end being in contact with a respective one of the conductive region by elasticity to electrically connect the respective one of the conductive regions and a respective one of the conductive patterns.

An electronic component comprising a body and at least one terminal for soldering the body to a carrier is provided, with the terminal comprising: an electrode arranged on a surface of the body; an outgassing layer formed on and/or surrounded by the electrode, wherein the outgassing layer is configured to outgas when being heated; and an electrically conductive cover layer formed on the outgassing layer, wherein the cover layer is electrically connected to the electrode and seals the outgassing layer in a gastight manner between the cover layer and the electrode.

The invention relates to a method for mechanical connecting especially of a potting frame to a printed circuit board of an electrical/electronic module. The potting frame includes a metal contact area. The printed circuit board includes a surface area structured metallically corresponding to the contact area. The method includes positioning the mechanical component with the contact area facing the corresponding surface area, and soldering the mechanical component to the printed circuit board via the contact area and the surface area. The method the advantage that a material saving encapsulation can be provided for electrical/electronic modules in explosion endangered regions. An additional process step for mechanical connecting of the encapsulation to the printed circuit board can be omitted, since the mechanical connecting of the potting frame can be performed in one process step together with the soldering of the additional electrical/electronic components to the printed circuit board.

A chip component including a first electrode and a second electrode, a semiconductor device including a first land and a second land, and a printed wiring board are prepared. A first solder paste and a second solder paste are supplied to the printed wiring board. The chip component is placed on the printed wiring board so that the first electrode is in contact with the first solder paste and the second electrode is in contact with the second solder paste. The semiconductor device is placed on the printed wiring board so that the first land faces the first electrode and the second land faces the second electrode. The solder paste is heated and melted, the first land and the first electrode are bonded to each other, and the second land and the second electrode are bonded to each other.

RFID inlays or straps may be assembled using impulse heating of metal precursors. Metal precursors are applied to and/or included in contacts on an RFID IC and/or terminals on a substrate. During assembly of the tag, the IC is disposed onto the substrate such that the IC contacts physically contact either the substrate terminals or metal precursors that in turn physically contact the substrate terminals. Impulse heating is then used to rapidly apply heat to the metal precursors, processing them into metallic structures that electrically couple the IC contacts to the substrate terminals.

The present disclosure relates to an electronic component joining method and a joined structure. A solder layer made of a gold-tin alloy including 20 mass % or greater of tin is formed on a light-emitting element side, and a layer including gold as a main component is formed, as a joining layer for joining to the solder layer, on a submount side. The solder layer and the joining layer are heated at a temperature below the melting point of the gold-tin alloy of the solder layer to join the light-emitting element and the submount.

Wafer level passive array packages, modules, and methods of fabrication are described. In an embodiment, a module includes a circuit board, and a package mounted on the circuit board in which the package includes a plurality of passive components bonded to a bottom side of the die and a plurality of landing pads of the circuit board.